SNIS237A December   2024  – April 2025 TMP118

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Two-Wire Interface Timing
    7. 6.7 Timing Diagram
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Averaging
      3. 7.3.3 Temperature Comparator and Hysteresis
      4. 7.3.4 Strain Tolerance
      5. 7.3.5 NIST Traceability
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Conversion Mode
      2. 7.4.2 One-Shot Mode (OS)
    5. 7.5 Programming
      1. 7.5.1 I2C and SMBus Interface
        1. 7.5.1.1 Serial Interface
          1. 7.5.1.1.1 Bus Overview
          2. 7.5.1.1.2 Device Address
          3. 7.5.1.1.3 Writing and Reading Operation
            1. 7.5.1.1.3.1 Writes
            2. 7.5.1.1.3.2 Reads
          4. 7.5.1.1.4 General-Call Reset Function
          5. 7.5.1.1.5 Timeout Function
          6. 7.5.1.1.6 Coexistence on I3C Mixed Bus
  9. 8 Device Registers
    1. 8.1 Register Map
      1. 8.1.1 Temp_Result Register (address = 00h) [reset = 0000h]
      2. 8.1.2 Configuration Register (address = 01h) [reset = 60B0h]
      3. 8.1.3 TLow_Limit Register (address = 02h) [reset = 2580h]
      4. 8.1.4 THigh_Limit Register (address = 03h) [reset = 2800h]
      5. 8.1.5 Device ID Register (Address = 0Bh) [reset = 1180h]
      6. 8.1.6 Unique_ID0 Register (Address = 0Ch) [reset = xxxxh]
      7. 8.1.7 Unique_ID1 Register (Address = 0Dh) [reset = xxxxh]
      8. 8.1.8 Unique_ID2 Register (Address = 0Eh) [reset = xxxxh]
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Separate I2C Pullup and Supply Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
      2. 9.2.2 Equal I2C Pullup and Supply Voltage Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Examples
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

6.5 Electrical Characteristics

Over free-air temperature range and VDD = 1.4V to 5.5V for TA = -40°C to 125°C (unless otherwise noted); Typical specifications are at TA = 25°C and VDD = 1.8V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TEMPERATURE TO DIGITAL CONVERTER
TERR Temperature accuracy TMP118 8x averaging
1-Hz conversion cycle, serial bus idle, VDD = 1.62V to 3.6V(1)		 20°C to 50°C –0.1 ±0.05 0.1 °C
0°C to 50°C –0.15 0.15
–20°C to 85°C –0.2 0.2
8x averaging
1-Hz conversion cycle, serial bus idle, VDD = 1.4V to 5.5V		 –40°C to 125°C –0.4 0.4
TMP118M 8x averaging
1-Hz conversion cycle, serial bus idle, VDD = 1.62V to 3.6V(1)		 20°C to 50°C –0.1 0.1
10°C to 50°C –0.15 0.15
–20°C to 85°C –0.2 0.2
8x averaging
1-Hz conversion cycle, serial bus idle, VDD = 1.4V to 5.5V		 –20°C to 85°C –0.4 0.4
PSRDC DC power supply sensitivity 1.62V to 5.5V 17 m°C/V
TRES Temperature resolution (LSB) 7.8125 m°C
TREPEAT Repeatability(2) 8x averaging ±1 LSB
No averaging ±2
TLTD Long-term stability and drift 3000 hours at 125°C, VDD = 5.5V 0.024 °C
THYS Temperature cycling and hysteresis(3) 8 averages ±2 LSB
tLIQUID Response time (stirred liquid) τ = 63% for step response from 25 °C to 75 °C Single layer Flex PCB
0.13mm thickness		 0.11 s
Single layer FR4 PCB 
1.575mm thickness		 1.4 s
tCONV Conversion time One-shot mode 11.1 ms
TGAIN Gain error Temp Error Drift over 10 °C to 50 °C;  Continuous sweep; Normalized at 35 °C –0.4 0.4 %
DIGITAL INPUT/OUTPUT
CIN Input capacitance f = 100kHz 3 pF
VIH Input logic high level 1 V
VIL Input logic low level 0.4 V
IIN Input leakage  current –0.1 0.1 μA
VOL SDA output logic low level IOL = –2mA 0.25 V
POWER SUPPLY
IDD_ACTIVE Supply current during active conversion Active conversion, serial bus idle 55 100 μA
IDD_AVG Average current consumption Continuous conversion mode
1 Hz conversion frequency		 Serial bus idle, no averaging 1.4 4 μA
Serial bus idle, 8x averaging 4.8 12
SCL frequency = 400kHz, no averaging(5) 5.3
IDD_SB Standby current(4) Continuous conversion mode, serial bus idle 0.75 3 μA
IDD_SD Shutdown current Serial bus idle 25 °C 0.065 0.25 μA
0 °C to 55 °C 0.11 0.3
–40 °C to 125 °C 1.5
VPOR Power-on reset threshold voltage Supply voltage rising 1.07 V
VBOR Brownout detect Supply voltage falling 0.9 V
tINIT Initialization time after power-on reset(6) 1 ms
tRESET Reset Time(7) General Call Reset 0.1 ms
(1) For VDD above 3.6V, refer to the PSRDC specification to calculate the accuracy shift as a result of the power supply variation
(2) Repeatability is the ability to reproduce a reading when the measured temperature is applied consecutively, under the same conditions.
(3) Hysteresis is defined as the ability to reproduce a temperature reading as the temperature varies from room → hot →room→cold→room. The temperatures used for this test are -40°C, 25°C, and 125°C.
(4) Quiescent current between conversions
(5) For best temperature measurement accuracy, avoid any serial bus traffic during active temperature conversion.
(6) From device power-on reset to start of temperature conversion
(7) From General Call Reset command received to start of temperature conversion