SNLS779A July   2025  – November 2025 DP83TC815-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
    1. 5.1 Pin Power Domain
    2. 5.2 Pin States
    3. 5.3 Pin Multiplexing
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 IEEE802.1AS Features
        1. 7.3.1.1 PTP Clock Configuration
          1. 7.3.1.1.1 PTP Reference Clock
          2. 7.3.1.1.2 PTP Synchronized Clock (Wall Clock)
            1. 7.3.1.1.2.1 PTP Time Read or Write
            2. 7.3.1.1.2.2 PTP Clock Initialization
            3. 7.3.1.1.2.3 PTP Clock Adjustment
            4. 7.3.1.1.2.4 PTP Clock Output
              1. 7.3.1.1.2.4.1 One Pulse Per Second (PPS) Output
          3. 7.3.1.1.3 PTP Time Registers
        2. 7.3.1.2 Packet Timestamps
          1. 7.3.1.2.1 Transmit (Egress) Packet Parser and Timestamp
          2. 7.3.1.2.2 Receive (ingress) Packet Parser and Timestamp
          3. 7.3.1.2.3 PTP Transmit and Receive Timestamp Registers
        3. 7.3.1.3 Event Triggering and Timestamping
          1. 7.3.1.3.1 Event Triggering (Output)
            1. 7.3.1.3.1.1 Trigger Initialization
          2. 7.3.1.3.2 Event Timestamp (Input)
            1. 7.3.1.3.2.1 Timestamp Storage and Reading
          3. 7.3.1.3.3 Event Capture and Output Trigger Registers
        4. 7.3.1.4 PTP Interrupts
        5. 7.3.1.5 PTP I/O Configuration
      2. 7.3.2 TC10 Sleep Wake-up
        1. 7.3.2.1 Functions of the PHY for TC10 Support
          1. 7.3.2.1.1 Transition from Sleep to Wake-up Mode
            1. 7.3.2.1.1.1 Local Wake Detection
            2. 7.3.2.1.1.2 WUP Transmission and Reception
          2. 7.3.2.1.2 Wake Forwarding
          3. 7.3.2.1.3 Transition to Sleep - Sleep Negotiation
            1. 7.3.2.1.3.1 Sleep Ack
            2. 7.3.2.1.3.2 Sleep Request
            3. 7.3.2.1.3.3 Sleep Silent
            4. 7.3.2.1.3.4 Sleep Fail
            5. 7.3.2.1.3.5 Sleep
            6. 7.3.2.1.3.6 Force Sleep
        2. 7.3.2.2 Power Supply Networks for Sleep Applications
        3. 7.3.2.3 Configuration for Non-TC10 Applications
        4. 7.3.2.4 Miscellaneous Sleep Features
        5. 7.3.2.5 Fast Wake-up
      3. 7.3.3 PPM Monitor
      4. 7.3.4 Clock Dithering
      5. 7.3.5 Output Slew Control
      6. 7.3.6 Diagnostic Tool Kit
        1. 7.3.6.1 Signal Quality Indicator
        2. 7.3.6.2 Electrostatic Discharge Sensing
        3. 7.3.6.3 Time Domain Reflectometry
        4. 7.3.6.4 Voltage Sensing
        5. 7.3.6.5 Temperature Sensing
      7. 7.3.7 BIST and Loopback Modes
        1. 7.3.7.1 Data Generator and Checker
        2. 7.3.7.2 xMII Loopback
        3. 7.3.7.3 PCS Loopback
        4. 7.3.7.4 Digital Loopback
        5. 7.3.7.5 Analog Loopback
        6. 7.3.7.6 Reverse Loopback
      8. 7.3.8 Compliance Test Modes
        1. 7.3.8.1 Test Mode 1
        2. 7.3.8.2 Test Mode 2
        3. 7.3.8.3 Test Mode 4
        4. 7.3.8.4 Test Mode 5
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Modes
        1. 7.4.1.1 Power Down
        2. 7.4.1.2 Reset
        3. 7.4.1.3 Standby
        4. 7.4.1.4 Normal
        5. 7.4.1.5 Sleep
      2. 7.4.2 Media Dependent Interface
        1. 7.4.2.1 100BASE-T1 Leader and 100BASE-T1 Follower Configuration
        2. 7.4.2.2 Auto-Polarity Detection and Correction
        3. 7.4.2.3 Jabber Detection
        4. 7.4.2.4 Interleave Detection
      3. 7.4.3 MAC Interfaces
        1. 7.4.3.1 Media Independent Interface
        2. 7.4.3.2 Reduced Media Independent Interface
        3. 7.4.3.3 Reduced Gigabit Media Independent Interface
        4. 7.4.3.4 Serial Gigabit Media Independent Interface
      4. 7.4.4 Serial Management Interface
        1. 7.4.4.1 Extended Register Space Access
        2. 7.4.4.2 Write Operation (No Post Increment)
        3. 7.4.4.3 Read Operation (No Post Increment)
        4. 7.4.4.4 Write Operation (Post Increment)
        5. 7.4.4.5 Read Operation (Post Increment)
    5. 7.5 Programming
      1. 7.5.1 Strap Configuration
        1. 7.5.1.1 LED Configuration
  9. 8 Register Maps
    1. 8.1 Register Access Summary
    2. 8.2 DP83TC815 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Physical Medium Attachment
          1. 9.2.1.1.1 Common-Mode Choke Recommendations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Signal Traces
        2. 9.4.1.2 Return Path
        3. 9.4.1.3 Metal Pour
        4. 9.4.1.4 PCB Layer Stacking
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

9.2.2 Detailed Design Procedure

When creating a new system design with an Ethernet PHY, follow this schematic capture procedure:

  1. Select desired PHY hardware configurations in table Table 7-41.
  2. Use the Electrical Characteristics table, the Table 7-39 table and the Table 7-40 table to select the correct external bootstrap resistors.
  3. If using LEDs, ensure the correct external circuit is applied as shown in Figure 7-25.
  4. Select an appropriate clock source that adheres to either the CMOS-level oscillator or crystal resonator requirements within the Electrical Characteristics table.
  5. Select a CMC, a list of recommended CMCs are located in Table 9-2.
  6. Add common-mode termination, DC-blocking capacitors, an MDI-coupling capacitor, and an ESD shunt found in Table 9-1.
  7. Ensure that there is sufficient supply decoupling on VDDIO and VDDA supply pins.
  8. Add an external pullup resistor (tie to VDDIO) on MDIO line.
  9. If operating with SGMII, place 0.1μF, DC-blocking capacitors between the MAC and PHY SGMII pins.
  10. If sleep modes are not desired, WAKE pin must be tied to VSLEEP directly or through an external pullup resistor.

The following layout procedure must be followed:

  1. Locate the PHY near the edge of the board so that short MDI traces can be routed to the desired connector.
  2. Place the MDI external components: CMC, DC-blocking capacitors, CM termination, MDI-coupling capacitor, and ESD shunt.
  3. Create metal pour keepout under the CMC on the top layer and at least one layer beneath the top later.
  4. Ensure that the MDI TRD_M and TRD_P traces are routed such that they are 100-Ω differential.
  5. Place the clock source near the XI and XO pins.
  6. Ensure that when configured for MII, RMII, or RGMII operation, the xMII pins are routed 50-Ω and are single-ended with reference to ground.
  7. Ensure that transmit path xMII pins are routed such that setup and hold timing does not violate the PHY requirements.
  8. Ensure that receive path xMII pins are routed such that setup and hold timing does not violate the MAC requirements.
  9. Ensure that when configured for SGMII operation, the xMII RX_P, RX_M, TX_P, and TX_M pins are routed 100-Ω differential.
  10. Place the MDIO pullup close to the PHY.