SNVSCU9A May 2025 – November 2025 TPS7H4012-SEP , TPS7H4013-SEP
PRODMIX
Figure 6-1 HLC Package, 20-Pin CFP | PIN | I/O(1) | DESCRIPTION | ||
|---|---|---|---|---|
| NAME | CFP (20) |
HTSSOP (44) |
||
| GND | 1 | 1, 2 | — | Ground. Return for control circuitry. |
| EN | 2 | 3 | I | Enable. Driving this pin to logic high enables the device; driving the pin to logic low disables the device. A resistor divider from VIN to GND may be used to set the device turn-on level. |
| RT | 3 | 4 | I/O | A resistor connected between RT and GND sets the switching frequency of the converter. The switching frequency range is 100kHz to 1MHz. If the device is configured to utilize an external clock, this pin may be left floating or a resistor may be used to provide a backup frequency if the external clock is lost. |
| VIN | 4 | 5 | I | Input voltage. Power for the control circuitry of the switching regulator. It must be the same voltage as PVIN and is therefore recommended to externally connect VIN to PVIN. |
| LDOCAP | 5 | 6 | O | Linear regulator output capacitor pin. A 1µF capacitor must be placed on this pin for the internal linear regulator. The output voltage, AVDD, is nominally 5V. Do not load this pin with any additional external circuitry. |
| SYNC1 | 6 | 8 | I | Synchronization pin 1. This pin is used as an input for an external clock. It will set the switching frequency 180° out of phase with SYNC1. If an external clock is not used, it is recommended to connect SYNC1 to GND to prevent noise coupling into the pin. |
| PVIN | 7–8 | 11–15 | I | Power stage input voltage. Power for the output stage of the switching regulator. |
| PGND | 9–10 | 16–22 | — | Power stage ground. Return for low-side power MOSFET. Connect to GND on the PCB. |
| SW | 11–14 | 23–34 | O | Switching node pins. Switch node output. A Schottky diode may be connected from SW to PGND for potential improvement in internal device noise and efficiency. |
| PWRGD | 15 | 36 | O | Power Good pin. This is an open-drain pin. Use a pull-up resistor to pull this pin up to VOUT (assuming VOUT is under 7V) or the desired logic level. PWRGD is asserted when the output voltage is within 5% (typ) of its programmed value. PWRGD is deasserted when the output voltages is outside 8% (typ) of its programmed value or when there is a fault condition (such as thermal shutdown). |
| RSC | 16 | 39 | I/O | Slope compensation pin. A resistor from RSC to GND sets the desired slope compensation. |
| SS_TR | 17 | 40 | I/O | Soft-start and tracking. An external capacitor connected between this pin and VSNS- slows down the rise time of the internal reference. It can also be used for tracking and sequencing. |
| VSNS+ | 18 | 42 | I | Positive voltage sense. This is the feedback pin that will be set to a nominal 0.6V by selecting the appropriate resistor divider network. |
| COMP | 19 | 43 | I/O | Compensation pin. This is the operational transconductance (OTA) error amplifier output and input to the switch current comparator. Connect frequency compensation to this pin. |
| REFCAP | 20 | 44 | O | Reference capacitor pin. A 470nF external capacitor is required for the internal bandgap reference. The voltage, VBG, is nominally 1.2V. Do not connect external circuitry to this pin. |
| NC1 | N/A | 10, 35, 38,41 | — | No connect 1. These pins are not internally connected. It is recommended to connect these pins to GND to prevent charge buildup; however, these pins can also be left open or tied to any voltage between GND and VIN. |
| NC2 | N/A | 7, 9, 37 | — | No connect 2. These pins are internally connected. Do not externally connect these pins (they must be left electrically floating). They will internally be pulled to a voltage between GND and LDOCAP. |
| THERMAL PAD | 21 | 45 | — | Thermal pad internally connected to GND. Connect to a large ground plane for thermal dissipation. While it is recommended to electrically connect to GND or PGND; it may be left electrically disconnected if desired. |
| Metal lid | Lid | N/A | — | Internally connected to GND. |