SNVSCU9A May   2025  – November 2025 TPS7H4012-SEP , TPS7H4013-SEP

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Device Options Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Quality Conformance Inspection
    7. 7.7 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 VIN and Power VIN Pins (VIN and PVIN)
      2. 9.3.2 Voltage Reference
      3. 9.3.3 Voltage Sensing and Setting VOUT
        1. 9.3.3.1 Minimum Output Voltage
        2. 9.3.3.2 Maximum Output Voltage
      4. 9.3.4 Enable
      5. 9.3.5 Power Good (PWRGD)
      6. 9.3.6 Adjustable Switching Frequency and Synchronization
        1. 9.3.6.1 Internal Clock Mode
        2. 9.3.6.2 External Clock Mode
      7. 9.3.7 Turn-On Behavior
        1. 9.3.7.1 Soft-Start (SS_TR)
        2. 9.3.7.2 Safe Start-Up Into Prebiased Outputs
        3. 9.3.7.3 Tracking and Sequencing
      8. 9.3.8 Protection Modes
        1. 9.3.8.1 Overcurrent Protection
          1. 9.3.8.1.1 High-Side 1 Overcurrent Protection (HS1)
          2. 9.3.8.1.2 High-Side 2 Overcurrent Protection (HS2)
          3. 9.3.8.1.3 COMP Shutdown
          4. 9.3.8.1.4 Low-Side Overcurrent Sinking Protection
        2. 9.3.8.2 Output Overvoltage Protection (OVP)
        3. 9.3.8.3 Thermal Shutdown
      9. 9.3.9 Error Amplifier and Loop Response
        1. 9.3.9.1 Error Amplifier
        2. 9.3.9.2 Power Stage Transconductance
        3. 9.3.9.3 Slope Compensation
        4. 9.3.9.4 Frequency Compensation
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1  Operating Frequency
        2. 10.2.2.2  Output Inductor Selection
        3. 10.2.2.3  Output Capacitor Selection
        4. 10.2.2.4  Input Capacitor Selection
        5. 10.2.2.5  Soft-Start Capacitor Selection
        6. 10.2.2.6  Rising VIN Set Point (Configurable UVLO)
        7. 10.2.2.7  Output Voltage Feedback Resistor Selection
        8. 10.2.2.8  Output Voltage Accuracy
        9. 10.2.2.9  Slope Compensation Requirements
        10. 10.2.2.10 Compensation Component Selection
        11. 10.2.2.11 Schottky Diode
      3. 10.2.3 Application Curve
      4. 10.2.4 Inverting Buck-Boost
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1.     82

7.4 Thermal Information

THERMAL METRIC(1) TPS7H4012-SP
TPS7H4013-SP		 TPS7H4012-SP, -SEP
TPS7H4013-SP, -SEP		 UNIT
CFP HLC DDW (HTSSOP)
20 PINS 44 PINS
RθJA Junction-to-ambient thermal resistance 22.3 21.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 4.0 8.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 0.31 0.6 °C/W
RθJB Junction-to-board thermal resistance 5.8 4.4 °C/W
ψJT Junction-to-top characterization parameter 0.9 0.1 °C/W
ψJB Junction-to-board characterization parameter 5.8 4.4 °C/W
(1) For more information about the traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).