TIDUFF0 December 2025
MSPM0G3519-Q1 microcontrollers (MCUs) are part of the MSP Arm® Cortex®-M0+ 32-bit core platform. The device achieves a good balance of cost, performance, safety, and design flexibility for the automotive environment. To provide stable operation in extreme environments, the MCU adheres to AEC Q100 Grade 1 qualification, supporting an extended temperature range from –40°C to 125°C, and is architected to ASIL-B functional safety level. MSPM0 offers ultimate scalability and flexibility through complete pin-to-pin compatibility, which allows engineers to future-proof the hardware designs, enabling efficient performance scaling and platform consolidation across multiple vehicle programs.
The MSPM0G351x-Q1 delivers high-performance compute (80MHz Cortex-M0+ with math accelerator) alongside tightly integrated analog and digital peripherals in a single automotive-qualified device. The robust memory subsystem of the MCU supports up to 512KB ECC Flash with dual-bank OTA capability and 128KB parity-checked SRAM. Key integration includes two 12-bit 4Msps ADCs, comparators, amplifiers, a 12-bit DAC, and full communication suites (UART, I²C, SPI, CAN FD). Built-in security (AES, TRNG, CRC) provides data integrity. Supported by a mature automotive ecosystem—including production-ready CAN and LIN drivers, MCAL, diagnostics library and reference designs— this device enables rapid development of secure, consolidated ECUs while reducing BOM cost and system complexity.