TIDUFF0 December   2025

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 AWR2188
      2. 2.3.2 DS90UB971S-Q1
      3. 2.3.3 MSPM0G3519-Q1
      4. 2.3.4 LM68635-Q1
      5. 2.3.5 LP8772x-Q1
      6. 2.3.6 TPS6285018A-Q1
      7. 2.3.7 CDC6C025000-Q1
  9. 3System Design Theory
    1. 3.1 Diagnostic and Monitoring Features
    2. 3.2 Power over Coax (PoC) Network
    3. 3.3 SPI and I2C Communication Interface
  10. 4Hardware, Software, Testing Requirements, and Test Results
    1. 4.1 Hardware Requirements
    2. 4.2 Software Requirements
    3. 4.3 Test Setup
      1. 4.3.1 Precautions
      2. 4.3.2 Data Capturing Approach
  11. 5Design and Documentation Support
    1. 5.1 Design Files
      1. 5.1.1 Schematics
      2. 5.1.2 BOM
      3. 5.1.3 PCB Layout Recommendations
        1. 5.1.3.1 Launch on Package (LOP Antenna)
        2. 5.1.3.2 Power over Coax (PoC)
        3. 5.1.3.3 PCB Layer Stackup
        4. 5.1.3.4 Board Photos
    2. 5.2 Tools and Software
    3. 5.3 Documentation Support
    4. 5.4 Support Resources
    5. 5.5 Trademarks
      1. 5.5.1 About the Author
  12. 6About the Author

MSPM0G3519-Q1

MSPM0G3519-Q1 microcontrollers (MCUs) are part of the MSP Arm® Cortex®-M0+ 32-bit core platform. The device achieves a good balance of cost, performance, safety, and design flexibility for the automotive environment. To provide stable operation in extreme environments, the MCU adheres to AEC Q100 Grade 1 qualification, supporting an extended temperature range from –40°C to 125°C, and is architected to ASIL-B functional safety level. MSPM0 offers ultimate scalability and flexibility through complete pin-to-pin compatibility, which allows engineers to future-proof the hardware designs, enabling efficient performance scaling and platform consolidation across multiple vehicle programs.

The MSPM0G351x-Q1 delivers high-performance compute (80MHz Cortex-M0+ with math accelerator) alongside tightly integrated analog and digital peripherals in a single automotive-qualified device. The robust memory subsystem of the MCU supports up to 512KB ECC Flash with dual-bank OTA capability and 128KB parity-checked SRAM. Key integration includes two 12-bit 4Msps ADCs, comparators, amplifiers, a 12-bit DAC, and full communication suites (UART, I²C, SPI, CAN FD). Built-in security (AES, TRNG, CRC) provides data integrity. Supported by a mature automotive ecosystem—including production-ready CAN and LIN drivers, MCAL, diagnostics library and reference designs— this device enables rapid development of secure, consolidated ECUs while reducing BOM cost and system complexity.