TIDUFF0 December   2025

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 AWR2188
      2. 2.3.2 DS90UB971S-Q1
      3. 2.3.3 MSPM0G3519-Q1
      4. 2.3.4 LM68635-Q1
      5. 2.3.5 LP8772x-Q1
      6. 2.3.6 TPS6285018A-Q1
      7. 2.3.7 CDC6C025000-Q1
  9. 3System Design Theory
    1. 3.1 Diagnostic and Monitoring Features
    2. 3.2 Power over Coax (PoC) Network
    3. 3.3 SPI and I2C Communication Interface
  10. 4Hardware, Software, Testing Requirements, and Test Results
    1. 4.1 Hardware Requirements
    2. 4.2 Software Requirements
    3. 4.3 Test Setup
      1. 4.3.1 Precautions
      2. 4.3.2 Data Capturing Approach
  11. 5Design and Documentation Support
    1. 5.1 Design Files
      1. 5.1.1 Schematics
      2. 5.1.2 BOM
      3. 5.1.3 PCB Layout Recommendations
        1. 5.1.3.1 Launch on Package (LOP Antenna)
        2. 5.1.3.2 Power over Coax (PoC)
        3. 5.1.3.3 PCB Layer Stackup
        4. 5.1.3.4 Board Photos
    2. 5.2 Tools and Software
    3. 5.3 Documentation Support
    4. 5.4 Support Resources
    5. 5.5 Trademarks
      1. 5.5.1 About the Author
  12. 6About the Author

5.1.3.1 Launch on Package (LOP Antenna)

This reference design is based on TI’s AWR2188 radar chip which utilizes TI's LoP technology. The radiating element directly radiates into the 3D antenna through a waveguide through the PCB. TI's LoP technology enables direct signal transfer from the package to the antenna, contrasting with the traditional MMIC packages which first transition a signal to the PCB and then to the antenna. The launch is embedded into the package bottom layer and the BGA balls around the launch provide RF shielding of the signals as the signals are propagated into the 3D antenna through the PCB waveguide holes. To check the dogbone cutout of the PCB as well as the mounting hole, positioning holes and borders of the waveguide module, see the TIDA-020093 design files.