TIDUFF0 December   2025

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 AWR2188
      2. 2.3.2 DS90UB971S-Q1
      3. 2.3.3 MSPM0G3519-Q1
      4. 2.3.4 LM68635-Q1
      5. 2.3.5 LP8772x-Q1
      6. 2.3.6 TPS6285018A-Q1
      7. 2.3.7 CDC6C025000-Q1
  9. 3System Design Theory
    1. 3.1 Diagnostic and Monitoring Features
    2. 3.2 Power over Coax (PoC) Network
    3. 3.3 SPI and I2C Communication Interface
  10. 4Hardware, Software, Testing Requirements, and Test Results
    1. 4.1 Hardware Requirements
    2. 4.2 Software Requirements
    3. 4.3 Test Setup
      1. 4.3.1 Precautions
      2. 4.3.2 Data Capturing Approach
  11. 5Design and Documentation Support
    1. 5.1 Design Files
      1. 5.1.1 Schematics
      2. 5.1.2 BOM
      3. 5.1.3 PCB Layout Recommendations
        1. 5.1.3.1 Launch on Package (LOP Antenna)
        2. 5.1.3.2 Power over Coax (PoC)
        3. 5.1.3.3 PCB Layer Stackup
        4. 5.1.3.4 Board Photos
    2. 5.2 Tools and Software
    3. 5.3 Documentation Support
    4. 5.4 Support Resources
    5. 5.5 Trademarks
      1. 5.5.1 About the Author
  12. 6About the Author

4.3.1 Precautions

TIDA-020093
WARNING:

Hot surface! Contact can cause burns. Do not touch!

Some components can reach high temperatures > 55°C when the board is powered on. Do not touch the board at any point during operation or immediately after operating, as high temperatures can be present.