TIDUFF4 October   2025

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
      1. 1.1.1 General TI High Voltage Evaluation User Safety Guidelines
        1. 1.1.1.1 Safety and Precautions
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 GaN Power Stage
      2. 2.2.2 Inductor
      3. 2.2.3 Controller
      4. 2.2.4 Cooling
        1. 2.2.4.1 Heat Sink Placement
        2. 2.2.4.2 Via Placement
        3. 2.2.4.3 Copper Block
    3. 2.3 Highlighted Products
      1. 2.3.1 LMG3100R017
      2. 2.3.2 UCD3138A
      3. 2.3.3 TPSM365R6V5
      4. 2.3.4 TMP61
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Software Requirements
    3. 3.3 Test Setup
    4. 3.4 Test Results
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
      3. 4.1.3 PCB Layout Recommendations
        1. 4.1.3.1 Power Loop Optimization
        2. 4.1.3.2 Return Current Through Output Power Ground
    2. 4.2 Tools and Software
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Author

Hardware Requirements

  • Base board with:
    • VIN input and VOUT output connector
    • Input and output capacitors
    • PMBus connector
    • Test points for VIN, VOUT measurement
    • 5V, 3.3V bias supply (to flash the code when VIN is not applied)
  • Horizontal mount card:
    • Four-phase buck power stage with auxiliary power and controller
  • USB-2-GPIO connector
  • 100V, 60A programmable DC source
  • 12V, 180A programmable DC load
  • Air cooling fan