TIDUFF4
October 2025
1
Description
Resources
Features
Applications
6
1
System Description
1.1
Key System Specifications
1.1.1
General TI High Voltage Evaluation User Safety Guidelines
1.1.1.1
Safety and Precautions
2
System Overview
2.1
Block Diagram
2.2
Design Considerations
2.2.1
GaN Power Stage
2.2.2
Inductor
2.2.3
Controller
2.2.4
Cooling
2.2.4.1
Heat Sink Placement
2.2.4.2
Via Placement
2.2.4.3
Copper Block
2.3
Highlighted Products
2.3.1
LMG3100R017
2.3.2
UCD3138A
2.3.3
TPSM365R6V5
2.3.4
TMP61
3
Hardware, Software, Testing Requirements, and Test Results
3.1
Hardware Requirements
3.2
Software Requirements
3.3
Test Setup
3.4
Test Results
4
Design and Documentation Support
4.1
Design Files
4.1.1
Schematics
4.1.2
BOM
4.1.3
PCB Layout Recommendations
4.1.3.1
Power Loop Optimization
4.1.3.2
Return Current Through Output Power Ground
4.2
Tools and Software
4.3
Documentation Support
4.4
Support Resources
4.5
Trademarks
5
About the Author
3.1
Hardware Requirements
Base board with:
VIN input and VOUT output connector
Input and output capacitors
PMBus connector
Test points for VIN, VOUT measurement
5V, 3.3V bias supply (to flash the code when VIN is not applied)
Horizontal mount card:
Four-phase buck power stage with auxiliary power and controller
USB-2-GPIO connector
100V, 60A programmable DC source
12V, 180A programmable DC load
Air cooling fan