TIDUFF4 October   2025

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
      1. 1.1.1 General TI High Voltage Evaluation User Safety Guidelines
        1. 1.1.1.1 Safety and Precautions
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 GaN Power Stage
      2. 2.2.2 Inductor
      3. 2.2.3 Controller
      4. 2.2.4 Cooling
        1. 2.2.4.1 Heat Sink Placement
        2. 2.2.4.2 Via Placement
        3. 2.2.4.3 Copper Block
    3. 2.3 Highlighted Products
      1. 2.3.1 LMG3100R017
      2. 2.3.2 UCD3138A
      3. 2.3.3 TPSM365R6V5
      4. 2.3.4 TMP61
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Software Requirements
    3. 3.3 Test Setup
    4. 3.4 Test Results
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
      3. 4.1.3 PCB Layout Recommendations
        1. 4.1.3.1 Power Loop Optimization
        2. 4.1.3.2 Return Current Through Output Power Ground
    2. 4.2 Tools and Software
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Author

5 About the Author

MADHUR WAGLE is an Applications Engineer for the GaN power stages focusing on server, enterprise and telecom market segments. He is responsible for high-power density reference designs using GaN power stages. Madhur earned his bachelor’s degree (B.Tech) in electrical engineering from the College of Engineering, Pune (COEP).

SRIJAN ASHOK is a Product Marketing Manager representing the GaN power stages in the server, enterprise and telecom market segments.