TIDUFF4 October   2025

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
      1. 1.1.1 General TI High Voltage Evaluation User Safety Guidelines
        1. 1.1.1.1 Safety and Precautions
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 GaN Power Stage
      2. 2.2.2 Inductor
      3. 2.2.3 Controller
      4. 2.2.4 Cooling
        1. 2.2.4.1 Heat Sink Placement
        2. 2.2.4.2 Via Placement
        3. 2.2.4.3 Copper Block
    3. 2.3 Highlighted Products
      1. 2.3.1 LMG3100R017
      2. 2.3.2 UCD3138A
      3. 2.3.3 TPSM365R6V5
      4. 2.3.4 TMP61
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Software Requirements
    3. 3.3 Test Setup
    4. 3.4 Test Results
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
      3. 4.1.3 PCB Layout Recommendations
        1. 4.1.3.1 Power Loop Optimization
        2. 4.1.3.2 Return Current Through Output Power Ground
    2. 4.2 Tools and Software
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Author

2.2.4.3 Copper Block

At full load, the synchronous rectification (SR) FET carries a significant amount of current. Removing heat from the SR FET is essential to achieve better efficiency. The PGND copper can be exposed near the SRC pad of the low-side LMG3100R017. A small copper block, with the same height as the LMG3100R017, can be used and then attached to the heat sink.

TIDA-050095 Copper Block Placement Figure 2-4 Copper Block Placement