TIDUFF4 October   2025

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
      1. 1.1.1 General TI High Voltage Evaluation User Safety Guidelines
        1. 1.1.1.1 Safety and Precautions
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 GaN Power Stage
      2. 2.2.2 Inductor
      3. 2.2.3 Controller
      4. 2.2.4 Cooling
        1. 2.2.4.1 Heat Sink Placement
        2. 2.2.4.2 Via Placement
        3. 2.2.4.3 Copper Block
    3. 2.3 Highlighted Products
      1. 2.3.1 LMG3100R017
      2. 2.3.2 UCD3138A
      3. 2.3.3 TPSM365R6V5
      4. 2.3.4 TMP61
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Software Requirements
    3. 3.3 Test Setup
    4. 3.4 Test Results
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
      3. 4.1.3 PCB Layout Recommendations
        1. 4.1.3.1 Power Loop Optimization
        2. 4.1.3.2 Return Current Through Output Power Ground
    2. 4.2 Tools and Software
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Author

2.2.4.2 Via Placement

In addition to top-side cooling with a heat sink, removing heat from the board is essential. To achieve this, use plated vias on pads to transfer current to inner layers and reduce overall thermal resistance. Make sure that sufficient vias are added to transfer current to multiple layers and minimize overall PCB copper loss.

TIDA-050095 Via Placement Figure 2-3 Via Placement