TIDUFG5 December   2025

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Insulation Monitoring
    2. 1.2 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 TIDA-010985 Overview
      2. 2.2.2 Solving for the Unknown Isolation Resistances
      3. 2.2.3 Addressing Large Time Constant Cases
      4. 2.2.4 Prediction Algorithms
      5. 2.2.5 Understanding Error Sources
    3. 2.3 Highlighted Products
      1. 2.3.1 LP-MSPM0G3507
      2. 2.3.2 TPSI2240-Q1
      3. 2.3.3 RES60A-Q1
      4. 2.3.4 TLV9002-Q1
      5. 2.3.5 TPSM33620-Q1
      6. 2.3.6 TPS7A2033
      7. 2.3.7 ISOW1044
      8. 2.3.8 TSM24CA
      9. 2.3.9 TLV431B
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Software
    3. 3.3 Test Setup
      1. 3.3.1 Hardware Test Setup
      2. 3.3.2 Software Test Setup
    4. 3.4 Test Results
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
      3. 4.1.3 PCB Layout Recommendations
        1. 4.1.3.1 Layout Prints
    2. 4.2 Tools and Software [Required Topic]
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Authors

2.3.1 LP-MSPM0G3507

The LP-MSPM0G3507 LaunchPad™ development kit is an easy-to-use evaluation module (EVM) based on the MSPM0G3507. The device contains everything needed to start developing on the MSPM0G3507 M0+ MCU platform, including onboard debug probe for programming, debugging, and energy measurements. The board includes three buttons, two LEDs (one is an RGB LED) and an analog temperature sensor and light sensor. The device also has a external buffer to show high-speed ADC performance at 4MSPS.