TIDUFG5 December   2025

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Insulation Monitoring
    2. 1.2 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 TIDA-010985 Overview
      2. 2.2.2 Solving for the Unknown Isolation Resistances
      3. 2.2.3 Addressing Large Time Constant Cases
      4. 2.2.4 Prediction Algorithms
      5. 2.2.5 Understanding Error Sources
    3. 2.3 Highlighted Products
      1. 2.3.1 LP-MSPM0G3507
      2. 2.3.2 TPSI2240-Q1
      3. 2.3.3 RES60A-Q1
      4. 2.3.4 TLV9002-Q1
      5. 2.3.5 TPSM33620-Q1
      6. 2.3.6 TPS7A2033
      7. 2.3.7 ISOW1044
      8. 2.3.8 TSM24CA
      9. 2.3.9 TLV431B
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Software
    3. 3.3 Test Setup
      1. 3.3.1 Hardware Test Setup
      2. 3.3.2 Software Test Setup
    4. 3.4 Test Results
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
      3. 4.1.3 PCB Layout Recommendations
        1. 4.1.3.1 Layout Prints
    2. 4.2 Tools and Software [Required Topic]
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Authors

2.3.3 RES60A-Q1

The RES60A-Q1 is a matched resistive divider, implemented in thin-film SiCr with Texas Instruments' modern, high-performance, analog wafer process. A high-quality SiO2 insulative layer encapsulates the resistors and enables usage at extremely high voltages, up to 1400VDC for sustained operation or 4000VDC for HiPOT testing (60s). The device has a nominal input resistance of RHV = 12.5MΩ, and is available in several nominal ratios to meet a wide array of system needs.