TIDUFG5 December   2025

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Insulation Monitoring
    2. 1.2 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 TIDA-010985 Overview
      2. 2.2.2 Solving for the Unknown Isolation Resistances
      3. 2.2.3 Addressing Large Time Constant Cases
      4. 2.2.4 Prediction Algorithms
      5. 2.2.5 Understanding Error Sources
    3. 2.3 Highlighted Products
      1. 2.3.1 LP-MSPM0G3507
      2. 2.3.2 TPSI2240-Q1
      3. 2.3.3 RES60A-Q1
      4. 2.3.4 TLV9002-Q1
      5. 2.3.5 TPSM33620-Q1
      6. 2.3.6 TPS7A2033
      7. 2.3.7 ISOW1044
      8. 2.3.8 TSM24CA
      9. 2.3.9 TLV431B
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Software
    3. 3.3 Test Setup
      1. 3.3.1 Hardware Test Setup
      2. 3.3.2 Software Test Setup
    4. 3.4 Test Results
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
      3. 4.1.3 PCB Layout Recommendations
        1. 4.1.3.1 Layout Prints
    2. 4.2 Tools and Software [Required Topic]
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Authors

4.1.3 PCB Layout Recommendations

The PCB layout can vary depending on specific design requirements such as the isolation rating and the components selected for the design.

  • In general, reference the individual device guidelines in the datasheet for device-specific layout recommendations.
  • For HV system designs, clearance and creepage rules are an important factor when laying out the PCB. Pollution degree, working voltage, material properties, and other environmental factors (for example, altitude, and humidity) can affect the specific design creepage and clearance requirements. These are typically specified in standards such as IEC-61851-1 and UL-2202.
  • To minimize noise coupling, avoid routing digital and analog signals close together. Having proper ground planes, shields, minimal signal loop areas, and filters can help keep noise under control.
  • TIDA-010985 is an example AFE reference design that works with a TI LaunchPad in the spirit of modularity. In the best circumstances, place the MCU ADC on the same PCB as the AFE to minimize trace length, which improves the performance of the system.