SNIS214C June   2021  – May 2022 TMP114

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Timing
    7. 7.7 Two-Wire Timing Diagram
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 1.2 V Compatible Logic Inputs
      2. 8.3.2 Cyclic Redundancy Check (CRC)
      3. 8.3.3 Temperature Limits
      4. 8.3.4 Slew Rate Warning
      5. 8.3.5 NIST Traceability
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Conversion Mode
      2. 8.4.2 Shutdown Mode
        1. 8.4.2.1 One-Shot Temperature Conversions
    5. 8.5 Programming
      1. 8.5.1 Temperature Data Format
      2. 8.5.2 I2C and SMBus Interface
      3. 8.5.3 Device Address
      4. 8.5.4 Bus Transactions
        1. 8.5.4.1 Auto-Increment
        2. 8.5.4.2 Writes
          1. 8.5.4.2.1 CRC Enabled Writes
        3. 8.5.4.3 Reads
          1. 8.5.4.3.1 CRC Enabled Reads
        4. 8.5.4.4 General Call Reset Function
        5. 8.5.4.5 Time-Out Function
        6. 8.5.4.6 Coexist on I3C MixedBus
        7. 8.5.4.7 Cyclic Redundancy Check Implementation
    6. 8.6 Register Map
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Separate I2C Pullup and Supply Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Equal I2C Pullup and Supply Voltage Application
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YMT|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • High accuracy
    • TMP114:
      • ±0.3 °C maximum from –10 °C to 85 °C
      • ±0.5 °C maximum from –40 °C to 125 °C
    • TMP114N:
      • ±1 °C maximum from –40 °C to 125 °C
  • Operating temperature range: –40 °C to 125 °C
  • 16-bit resolution: 0.0078 °C (LSB)
  • Low power consumption:
    • 0.7-µA average supply current
    • 0.16-µA shutdown current
  • Supply range: 1.08 V to 1.98 V
  • 1.2-V compatible logic inputs independent of supply voltage
  • I2C and SMBus compatible interface
  • 50-ns spike filter to coexist on I3C mixed bus
  • Optional Cyclic Redundancy Check (CRC)
  • 300-ms response time
  • Adjustable averaging
  • Adjustable conversion time and period
  • Continuous or one-shot conversion mode
  • Temperature alert status with hysteresis
  • NIST traceability
  • Ultra-thin 4-ball PicoStar (DSBGA) package with 0.15-mm height