Low-Power Configurable Multiple-Function Gate
Product details
Parameters
Package | Pins | Size
Features
- Available in the Texas Instruments NanoStar™
Packages - Low Static-Power Consumption
(ICC = 0.9 µA Maximum) - Low Dynamic-Power Consumption
(Cpd = 4.3 pF Typical at 3.3 V) - Low Input Capacitance (Ci = 1.5 pF Typical)
- Low Noise – Overshoot and Undershoot
<10% of VCC - Ioff Supports Partial-Power-Down Mode Operation
- Includes Schmitt-Trigger Inputs
- Wide Operating VCC Range of 0.8 V to 3.6 V
- Optimized for 3.3-V Operation
- 3.6-V I/O Tolerant to Support Mixed-Mode Signal
Operation - tpd = 5.3 ns Maximum at 3.3 V
- Suitable for Point-to-Point Applications
- Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II - ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 2000-V Human-Body Model
- APPLICATIONS
- Active Noise Cancellation (ANC)
- Barcode Scanners
- Blood Pressure Monitors
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- Cable Solutions
- E-Books
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- Field Transmitter: Temperature or Pressure
Sensors - HVAC: Heating, Ventilating, and Air Conditioning
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- Server Motherboard and PSU
- Software Defined Radio (SDR)
- TV: High-Definition (HDTV), LCD, and Digital
- Video Communications Systems
All other trademarks are the property of their respective owners
Description
The SN74AUP1G57 device features configurable multiple functions. The output state is determined by eight patterns of 3-bit input. The user can choose the logic functions AND, OR, NAND, NOR, XNOR, inverter, and noninverter. All inputs can be connected to VCC or GND.
Technical documentation
= Top documentation for this product selected by TI
Type | Title | Date | |
---|---|---|---|
* | Datasheet | SN74AUP1G57 Low-Power Configurable Multiple-Function Gate datasheet (Rev. J) | Jun. 22, 2015 |
Technical article | How to keep your motor running safely | Jun. 04, 2020 | |
Selection guide | Little Logic Guide 2018 (Rev. G) | Jul. 06, 2018 | |
Selection guide | Logic Guide (Rev. AB) | Jun. 12, 2017 | |
Application note | How to Select Little Logic (Rev. A) | Jul. 26, 2016 | |
Application note | Understanding Schmitt Triggers | Sep. 21, 2011 | |
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | Jul. 08, 2004 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
Features
- Board design allows for versatility in evaluation
- Supports a wide-range of logic devices
Design tools & simulation
SCEM400A.ZIP (64 KB) - IBIS Model
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
DSBGA (YFP) | 6 | View options |
DSBGA (YZP) | 6 | View options |
SC70 (DCK) | 6 | View options |
SON (DRY) | 6 | View options |
SON (DSF) | 6 | View options |
SOT-23 (DBV) | 6 | View options |
SOT-5X3 (DRL) | 6 | View options |
Ordering & quality
Information included:
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
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