Fixed-Point Digital Signal Processor
Product details
Parameters
Package | Pins | Size
Features
- High-Performance, Low-Power, Fixed-Point TMS320C55™ Digital Signal Processor
- 9.26-, 6.95-, 5-ns Instruction Cycle Time
- 108-, 144-, 200-MHz Clock Rate
- One/Two Instruction(s) Executed per Cycle
- Dual Multipliers [Up to 400 Million Multiply-Accumulates per Second (MMACS)]
- Two Arithmetic/Logic Units (ALUs)
- Three Internal Data/Operand Read Buses and Two Internal Data/Operand Write Buses
- 64K × 16-Bit On-Chip RAM, Composed of:
- 64K Bytes of Dual-Access RAM (DARAM) 8 Blocks of 4K × 16-Bit
- 64K Bytes of Single-Access RAM (SARAM) 8 Blocks of 4K × 16-Bit
- 64K Bytes of One-Wait-State On-Chip ROM (32K × 16-Bit)
- 8M × 16-Bit Maximum Addressable External Memory Space (Synchronous DRAM)
- 16-Bit External Parallel Bus Memory Supporting Either:
- External Memory Interface (EMIF) With GPIO Capabilities and Glueless Interface to:
- Asynchronous Static RAM (SRAM)
- Asynchronous EPROM
- Synchronous DRAM (SDRAM)
- 16-Bit Parallel Enhanced Host-Port Interface (EHPI) With GPIO Capabilities
- External Memory Interface (EMIF) With GPIO Capabilities and Glueless Interface to:
- Programmable Low-Power Control of Six Device Functional Domains
- On-Chip Scan-Based Emulation Logic
- On-Chip Peripherals
- Two 20-Bit Timers
- Watchdog Timer
- Six-Channel Direct Memory Access (DMA) Controller
- Three Multichannel Buffered Serial Ports (McBSPs)
- Programmable Phase-Locked Loop Clock Generator
- Seven (LQFP) or Eight (BGA) General-Purpose I/O (GPIO) Pins and a General- Purpose Output Pin (XF)
- USB Full-Speed (12 Mbps) Slave Port Supporting Bulk, Interrupt and Isochronous Transfers
- Inter-Integrated Circuit (I2C) Multi-Master and Slave Interface
- Real-Time Clock (RTC) With Crystal Input, Separate Clock Domain, Separate Power Supply
- 4-Channel (BGA) or 2-Channel (LQFP) 10-Bit Successive Approximation A/D
- IEEE Std 1149.1(1) (JTAG) Boundary Scan Logic
- Packages:
- 144-Terminal Low-Profile Quad Flatpack (LQFP) (PGE Suffix)
- 179-Terminal MicroStar BGA™ (Ball Grid Array) (GHH and ZHH Suffixes)
- 1.2-V Core (108 MHz), 2.7-V - 3.6-V I/Os
- 1.35-V Core (144 MHz), 2.7-V - 3.6-V I/Os
- 1.6-V Core (200 MHz), 2.7-V - 3.6-V I/Os
C55x is a trademark of Texas Instruments.
TMS320C55x and MicroStar BGA are trademarks of Texas Instruments.
All trademarks are the property of their respective owners.
(1)IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
Description
The TMS320VC5507 fixed-point digital signal processor (DSP) is based on the TMS320C55x DSP generation CPU processor core. The C55x DSP architecture achieves high performance and low power through increased parallelism and total focus on reduction in power dissipation. The CPU supports an internal bus structure that is composed of one program bus, three data read buses, two data write buses, and additional buses dedicated to peripheral and DMA activity. These buses provide the ability to perform up to three data reads and two data writes in a single cycle. In parallel, the DMA controller can perform up to two data transfers per cycle independent of the CPU activity.
The C55x CPU provides two multiply-accumulate (MAC) units, each capable of 17-bit × 17-bit multiplication in a single cycle. A central 40-bit arithmetic/logic unit (ALU) is supported by an additional 16-bit ALU. Use of the ALUs is under instruction set control, providing the ability to optimize parallel activity and power consumption. These resources are managed in the Address Unit (AU) and Data Unit (DU) of the C55x CPU.
The C55x DSP generation supports a variable byte width instruction set for improved code density. The Instruction Unit (IU) performs 32-bit program fetches from internal or external memory and queues instructions for the Program Unit (PU). The Program Unit decodes the instructions, directs tasks to AU and DU resources, and manages the fully protected pipeline. Predictive branching capability avoids pipeline flushes on execution of conditional instructions.
The 128K bytes of on-chip memory on 5507 is sufficient for many hand-held appliances, portable GPS systems, wireless speaker phones, portable PDAs, and gaming devices. Many of these appliances typically require 64K bytes or more on-chip memory but less than 128K bytes of memory, and need to operate in standby mode for more than 60% to 70% of time. For the applications which require more than 128K bytes of on-chip memory but less than 256K bytes of on-chip memory, Texas Instruments (TI) offers the TMS320VC5509A device, which is based on the TMS320C55x DSP core.
The general-purpose input and output functions and the 10-bit A/D provide sufficient pins for status, interrupts, and bit I/O for LCDs, keyboards, and media interfaces. The parallel interface operates in two modes, either as a slave to a microcontroller using the HPI port or as a parallel media interface using the asynchronous EMIF. Serial media is supported through three McBSPs.
The 5507 peripheral set includes an external memory interface (EMIF) that provides glueless access to asynchronous memories like EPROM and SRAM, as well as to high-speed, high-density memories such as synchronous DRAM. Additional peripherals include Universal Serial Bus (USB), real-time clock, watchdog timer, and I2C multi-master and slave interface. Three full-duplex multichannel buffered serial ports (McBSPs) provide glueless interface to a variety of industry-standard serial devices, and multichannel communication with up to 128 separately enabled channels. The enhanced host-port interface (HPI) is a 16-bit parallel interface used to provide host processor access to 32K bytes of internal memory on the 5507. The HPI can be configured in either multiplexed or non-multiplexed mode to provide glueless interface to a wide variety of host processors. The DMA controller provides data movement for six independent channel contexts without CPU intervention, providing DMA throughput of up to two 16-bit words per cycle. Two general-purpose timers, up to eight dedicated general-purpose I/O (GPIO) pins, and digital phase-locked loop (DPLL) clock generation are also included.
The 5507 is supported by the industrys award-winning eXpressDSP, Code Composer Studio Integrated Development Environment (IDE), DSP/BIOS, Texas Instruments algorithm standard, and the industrys largest third-party network. The Code Composer Studio IDE features code generation tools including a C Compiler and Visual Linker, simulator, RTDX, XDS51. emulation device drivers, and evaluation modules. The 5507 is also supported by the C55x DSP Library which features more than 50 foundational software kernels (FIR filters, IIR filters, FFTs, and various math functions) as well as chip and board support libraries.
No design support from TI available
This product does not have ongoing design support from TI for new projects, such as new content or software updates. If available, you will find relevant collateral, software and tools in the product folder. You can also search for archived information in the TI E2ETM support forums.
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The Spectrum Digital XDS200 is the first model of the XDS200 family of debug probes (emulators) for TI processors. The XDS200 family features a balance of low cost with good performance between the super low cost XDS110 and the high performance XDS560v2, while supporting a wide variety of standards (...)
Features
The XDS200 is the mid-range family of JTAG debug probes (emulators) for TI processors. Designed to deliver good performance and the most common features that place it between the low cost XDS110 and the high performance XDS560v2, the XDS200 is the balanced solution to debug TI microcontrollers (...)
Description
The XDS560v2 System Trace is the first model of the XDS560v2 family of high-performance debug probes (emulators) for TI processors. The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).
The (...)
Features
XDS560v2 is the latest variant of the XDS560 family of high-performance debug probes (emulators) for TI processors. With the fastest speeds and most features of the entire XDS family, XDS560v2 is the most comprehensive solution to debug TI microcontrollers, processors and wireless connectivity (...)
Description
The XDS560v2 System Trace is the first model of the XDS560v2 family of high-performance debug probes (emulators) for TI processors. The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).
The (...)
Features
-
XDS560v2 is the latest variant of the XDS560 family of high-performance debug probes (emulators) for TI processors. With the fastest speeds and most features of the entire XDS family, XDS560v2 is the most comprehensive solution to debug TI microcontrollers, processors and wireless connectivity (...)
Software development
Features
VoLIB
- Telogy Software Line Echo Canceller (ECU)
- Tone Detection Unit (TDU)
- Caller ID Detection/Generation (CID)
- Tone Generation Unit (TGU)
- Voice Activity Detection Unit (VAU)
- Noise Matching Functions
- Packet Loss Concealment (PLC)
- Voice Enhancement Unit (VEU)
FAXLIB
- Fax Interface Unit (FIU)
- Fax Modem (FM)
- (...)
Features
C55x Codecs are optimized for use on any TM320C55x™ devices. C55x Codecs offer:
- Free, object code with production licensing
- WINDOWS installers
- C55x Audio Codecs were tested on C5505 and C5510 devices
- C55x Speech Codecs were tested on C5510 device
- All codecs are eXpressDSP™ compliant
- Performance data are (...)
Design tools & simulation
Features
- Supports many TI processors including Sitara and Jacinto Processors and DSPs
- Search by type of product, TI devices supported, or country
- Links and contacts for quick engagement
- Third-party companies located around the world
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
LQFP (PGE) | 144 | View options |
NFBGA (GBB) | 179 | View options |
NFBGA (ZAY) | 179 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
TI E2E™ forums with technical support from TI engineers
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