Product details

Regulated outputs (#) 12 Vin (Min) (V) 5.6 Vin (Max) (V) 21 Iout (Max) (A) 21 Rating Catalog Step-down DC/DC controller 3 Step-down DC/DC converter 3 Step-up DC/DC controller 0 Step-up DC/DC converter 0 LDO 4 Iq (Typ) (mA) 0.3 Features Comm Control, Dynamic Voltage Scaling, Enable, Enable Pin, I2C Control, Over Current Protection, Power Good, Power Sequencing, Synchronous Rectification, Thermal Shutdown, UVLO Fixed Operating temperature range (C) -40 to 85 Processor name Apollo Lake Processor supplier Intel/Altera Shutdown current (ISD) (Typ) (uA) 65 Configurability Factory programmable, Software configurable
Regulated outputs (#) 12 Vin (Min) (V) 5.6 Vin (Max) (V) 21 Iout (Max) (A) 21 Rating Catalog Step-down DC/DC controller 3 Step-down DC/DC converter 3 Step-up DC/DC controller 0 Step-up DC/DC converter 0 LDO 4 Iq (Typ) (mA) 0.3 Features Comm Control, Dynamic Voltage Scaling, Enable, Enable Pin, I2C Control, Over Current Protection, Power Good, Power Sequencing, Synchronous Rectification, Thermal Shutdown, UVLO Fixed Operating temperature range (C) -40 to 85 Processor name Apollo Lake Processor supplier Intel/Altera Shutdown current (ISD) (Typ) (uA) 65 Configurability Factory programmable, Software configurable
VQFN (RSK) 64 64 mm² 8 x 8
  • Wide VIN range from 5.6 V to 21 V
  • Three variable-output voltage synchronous
    Step-down controllers With D-CAP2™ Topology
    • 5 A for BUCK1 (VNN), 7 A for BUCK6 (VDDQ), and 21 A for BUCK2 (VCCGI) using external FETs for typical applications
    • I2C Dynamic Voltage Scaling (DVS) control
      (0.5 V to 1.45 V in 10-mV Steps) for BUCK1 and BUCK2
    • OTP-Programmable default output voltage for BUCK6 (VDDQ)
  • Three variable-output voltage synchronous
    Step-down converters with dcs-control topology and I2C DVS capabilities
    • VIN range from 4.5 V to 5.5 V
    • 3 A of output current for BUCK3 (VCCRAM)
    • 2 A of output current for BUCK4 (V1P8A) and BUCK5 (V1P24A) for typical applications
  • Three LDO regulators with adjustable output voltage
    • LDOA1: I2C-Selectable output voltage from 1.35 V to 3.3 V for up to 200 mA of output current
    • LDOA2 and LDOA3: I2C-Selectable output voltage from 0.7 V to 1.5 V for up to 600 mA of Output Current
  • VTT LDO for DDR memory termination
  • Three load switches with slew rate control
    • Up to 400 mA of output current with voltage drop less than 1.5% of nominal input voltage
    • RDSON < 96 mΩ at input voltage of 1.8 V
  • I2C Interface (device address 0x5E) supports:
    • Standard mode (100 kHz)
    • Fast mode (400 kHz)
    • Fast mode plus (1 MHz)
  • Wide VIN range from 5.6 V to 21 V
  • Three variable-output voltage synchronous
    Step-down controllers With D-CAP2™ Topology
    • 5 A for BUCK1 (VNN), 7 A for BUCK6 (VDDQ), and 21 A for BUCK2 (VCCGI) using external FETs for typical applications
    • I2C Dynamic Voltage Scaling (DVS) control
      (0.5 V to 1.45 V in 10-mV Steps) for BUCK1 and BUCK2
    • OTP-Programmable default output voltage for BUCK6 (VDDQ)
  • Three variable-output voltage synchronous
    Step-down converters with dcs-control topology and I2C DVS capabilities
    • VIN range from 4.5 V to 5.5 V
    • 3 A of output current for BUCK3 (VCCRAM)
    • 2 A of output current for BUCK4 (V1P8A) and BUCK5 (V1P24A) for typical applications
  • Three LDO regulators with adjustable output voltage
    • LDOA1: I2C-Selectable output voltage from 1.35 V to 3.3 V for up to 200 mA of output current
    • LDOA2 and LDOA3: I2C-Selectable output voltage from 0.7 V to 1.5 V for up to 600 mA of Output Current
  • VTT LDO for DDR memory termination
  • Three load switches with slew rate control
    • Up to 400 mA of output current with voltage drop less than 1.5% of nominal input voltage
    • RDSON < 96 mΩ at input voltage of 1.8 V
  • I2C Interface (device address 0x5E) supports:
    • Standard mode (100 kHz)
    • Fast mode (400 kHz)
    • Fast mode plus (1 MHz)

The TPS65094 device is a single-chip solution, power-management integrated chip (PMIC) designed specifically for the latest Intel™ processors targeted for tablets, ultrabooks, notebooks, industrial PCs, and Internet-of-Things (IOT) applications using 2S, 3S, or 4S Li-Ion battery packs (NVDC or non-NVDC power architectures), as well as wall-powered applications. The TPS65094 device is used for essential systems with low-voltage rails merged for the smallest footprint and lowest-cost system-power solution. The TPS65094 device provides the complete power solution based on the Intel Reference Designs. Six highly efficient step-down voltage regulators (VRs), a sink or source LDO (VTT), and a load switch are controlled by power-up sequence logic to provide the proper power rails, sequencing, and protection—including DDR3 and DDR4 memory power. The two regulators (BUCK1 and BUCK2) support dynamic voltage scaling (DVS) for maximum efficiency—including support for Connected Standby. The high-frequency VRs use small inductors and capacitors to achieve a small solution size. An I2C interface allows simple control by an embedded controller (EC) or by a system on chip (SoC).

The PMIC comes in an 8-mm × 8-mm single-row VQFN package with a thermal pad for good thermal dissipation and ease of board routing.

The TPS65094 device is a single-chip solution, power-management integrated chip (PMIC) designed specifically for the latest Intel™ processors targeted for tablets, ultrabooks, notebooks, industrial PCs, and Internet-of-Things (IOT) applications using 2S, 3S, or 4S Li-Ion battery packs (NVDC or non-NVDC power architectures), as well as wall-powered applications. The TPS65094 device is used for essential systems with low-voltage rails merged for the smallest footprint and lowest-cost system-power solution. The TPS65094 device provides the complete power solution based on the Intel Reference Designs. Six highly efficient step-down voltage regulators (VRs), a sink or source LDO (VTT), and a load switch are controlled by power-up sequence logic to provide the proper power rails, sequencing, and protection—including DDR3 and DDR4 memory power. The two regulators (BUCK1 and BUCK2) support dynamic voltage scaling (DVS) for maximum efficiency—including support for Connected Standby. The high-frequency VRs use small inductors and capacitors to achieve a small solution size. An I2C interface allows simple control by an embedded controller (EC) or by a system on chip (SoC).

The PMIC comes in an 8-mm × 8-mm single-row VQFN package with a thermal pad for good thermal dissipation and ease of board routing.

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Technical documentation

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Type Title Date
* Data sheet TPS65094 PMIC for Intel™ Apollo Lake Platform datasheet (Rev. D) 12 Jun 2019
EVM User's guide TPS65094x Evaluation Module User's Guide (Rev. A) 26 Jul 2017
Application note TPS65094x Schematic Checklist, Layout Checklist, and ILIM Calculator tool (Rev. A) 20 Jan 2017
User guide TPS65094x Design Guide 29 Aug 2015
White paper Power management integrated buck controllers for distant point-of-load apps 14 Aug 2015

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TPS650941EVM-116 — TPS65094x Evaluation Module

The TPS650941EVM-116 demonstrates the integrated circuit TPS65094 from Texas Instruments.

The TPS65094 device is a single-chip solution, power-management IC designed specifically for the latest Intel™ processors targeted for tablets, ultrabooks, and notebooks with NVDC or non-NVDC power (...)

GUI for evaluation module (EVM)

IPG-UI — IPG-UI EVM GUI

The IPG-UI GUI can be used to configure multiple PMIC devices to evaluate the features and performance of those devices.  This GUI is build using web based technologies and supports interacting with the EVM hardware using a USB2ANY adapter board. The USB2ANY Explorer is provided to allow (...)
Package Pins Download
VQFN (RSK) 64 View options

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