Produktdetails

Technology family HC Number of channels 1 Operating temperature range (°C) -55 to 125 Rating Catalog Supply current (max) (µA) 160
Technology family HC Number of channels 1 Operating temperature range (°C) -55 to 125 Rating Catalog Supply current (max) (µA) 160
PDIP (N) 16 181.42 mm² 19.3 x 9.4 SOIC (D) 16 59.4 mm² 9.9 x 6 SOP (NS) 16 79.56 mm² 10.2 x 7.8 TSSOP (PW) 16 32 mm² 5 x 6.4
  • Select One of Eight Data Outputs
    • Active Low for CD74HC137 and CD74HCT137
    • Active High for ’HC237 and CD74HCT237
  • I/O Port or Memory Selector
  • Two Enable Inputs to Simplify Cascading
  • Typical Propagation Delay of 13ns at VCC = 5V, 15pF, TA = 25°C (CD74HC237)
  • Fanout (Over Temperature Range)
    • Standard Outputs. . . . 10 LSTTL Loads
    • Bus Driver Outputs. . . . 15 LSTTL Loads
  • Wide Operating Temperature Range . . . –55°C to 125°C
  • Balanced Propagation Delay and Transition Times
  • Significant Power Reduction Compared to LSTTL Logic ICs
  • HC Types
    • 2V to 6V Operation
    • High Noise Immunity: NIL = 30%, NIH = 30%, of VCC at VCC = 5V
  • HCT Types
    • 4.5V to 5.5V Operation
    • Direct LSTTL Input Logic Compatibility, VIL = 0.8V (Max), VIH = 2V (Min)
    • CMOS Input Compatibility, Il 1µA at VOL, VOH

Data sheet acquired from Harris Semiconductor

  • Select One of Eight Data Outputs
    • Active Low for CD74HC137 and CD74HCT137
    • Active High for ’HC237 and CD74HCT237
  • I/O Port or Memory Selector
  • Two Enable Inputs to Simplify Cascading
  • Typical Propagation Delay of 13ns at VCC = 5V, 15pF, TA = 25°C (CD74HC237)
  • Fanout (Over Temperature Range)
    • Standard Outputs. . . . 10 LSTTL Loads
    • Bus Driver Outputs. . . . 15 LSTTL Loads
  • Wide Operating Temperature Range . . . –55°C to 125°C
  • Balanced Propagation Delay and Transition Times
  • Significant Power Reduction Compared to LSTTL Logic ICs
  • HC Types
    • 2V to 6V Operation
    • High Noise Immunity: NIL = 30%, NIH = 30%, of VCC at VCC = 5V
  • HCT Types
    • 4.5V to 5.5V Operation
    • Direct LSTTL Input Logic Compatibility, VIL = 0.8V (Max), VIH = 2V (Min)
    • CMOS Input Compatibility, Il 1µA at VOL, VOH

Data sheet acquired from Harris Semiconductor

The CD74HC137, CD74HCT137, ’HC237, and CD74HCT237 are high speed silicon gate CMOS decoders well suited to memory address decoding or data routing applications. Both circuits feature low power consumption usually associated with CMOS circuitry, yet have speeds comparable to low power Schottky TTL logic.

Both circuits have three binary select inputs (A0, A1 and A2) that can be latched by an active High Latch Enable (LE) signal to isolate the outputs from select-input changes. A "Low" LE makes the output transparent to the input and the circuit functions as a one-of-eight decoder. Two Output Enable inputs (OE\1 and OE0) are provided to simplify cascading and to facilitate demultiplexing. The demultiplexing function is accomplished by using the A0, A1, A2 inputs to select the desired output and using one of the other Output Enable inputs as the data input while holding the other Output Enable input in its active state. In the CD74HC137 and CD74HCT137 the selected output is a "Low"; in the ’HC237 and CD74HCT237 the selected output is a "High".

The CD74HC137, CD74HCT137, ’HC237, and CD74HCT237 are high speed silicon gate CMOS decoders well suited to memory address decoding or data routing applications. Both circuits feature low power consumption usually associated with CMOS circuitry, yet have speeds comparable to low power Schottky TTL logic.

Both circuits have three binary select inputs (A0, A1 and A2) that can be latched by an active High Latch Enable (LE) signal to isolate the outputs from select-input changes. A "Low" LE makes the output transparent to the input and the circuit functions as a one-of-eight decoder. Two Output Enable inputs (OE\1 and OE0) are provided to simplify cascading and to facilitate demultiplexing. The demultiplexing function is accomplished by using the A0, A1, A2 inputs to select the desired output and using one of the other Output Enable inputs as the data input while holding the other Output Enable input in its active state. In the CD74HC137 and CD74HCT137 the selected output is a "Low"; in the ’HC237 and CD74HCT237 the selected output is a "High".

Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 14
Typ Titel Datum
* Data sheet CD74HC137, CD74HCT137, CD54HC237, CD74HC237, CD74HCT237 datasheet (Rev. F) 13 Okt 2003
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dez 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note Designing With Logic (Rev. C) 01 Jun 1997
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Okt 1996
Application note Live Insertion 01 Okt 1996
Application note SN54/74HCT CMOS Logic Family Applications and Restrictions 01 Mai 1996
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 01 Apr 1996

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

14-24-LOGIC-EVM — Generisches Logikprodukt-Evaluierungsmodul für 14-polige bis 24-polige D-, DB-, DGV-, DW-, DYY-, NS-

Das 14-24-LOGIC-EVM-Evaluierungsmodul (EVM) ist für die Unterstützung aller Logikgeräte konzipiert, die sich in einem 14-Pin- bis 24-Pin-D-, DW-, DB-, NS-, PW-, DYY- oder DGV-Gehäuse befinden.

Benutzerhandbuch: PDF | HTML
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
PDIP (N) 16 Ultra Librarian
SOIC (D) 16 Ultra Librarian
SOP (NS) 16 Ultra Librarian
TSSOP (PW) 16 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos