Gehäuseinformationen
| Gehäuse | Pins VSON-CLIP (DMM) | 22 |
| Betriebstemperaturbereich (°C) -55 to 150 |
| Gehäusemenge | Träger 2.500 | LARGE T&R |
Merkmale von CSD88599Q5DC
- Half-Bridge Power Block
- High-Density SON 5-mm × 6-mm Footprint
- Low RDS(ON) for Minimized Conduction Losses
- 3.0-W PLoss at 30 A
- DualCool™ Thermally Enhanced Package
- Ultra-Low-Inductance Package
- RoHS Compliant
- Halogen Free
- Lead-Free Terminal Plating
Beschreibung von CSD88599Q5DC
The CSD88599Q5DC 60-V power block is an optimized design for high-current motor control applications, such as handheld, cordless garden and power tools. This device utilizes TI’s stacked die technology in order to minimize parasitic inductances while offering a complete half bridge in a space saving thermally enhanced DualCool™ 5-mm × 6-mm package. With an exposed metal top, this power block device allows for simple heat sink application to draw heat out through the top of the package and away from the PCB, for superior thermal performance at the higher currents demanded by many motor control applications.