Gehäuseinformationen
| Gehäuse | Pins VSON-CLIP (DPC) | 8 |
| Betriebstemperaturbereich (°C) -40 to 150 |
| Gehäusemenge | Träger 2.500 | LARGE T&R |
Merkmale von CSD97394Q4M
- 90% System Efficiency at 15 A
- Max Rated Continuous Current 20 A, Peak 45 A
- High Frequency Operation (up to 2 MHz)
- High Density – SON 3.5 × 4.5 mm Footprint
- Ultra-Low Inductance Package
- System Optimized PCB Footprint
- Ultra-Low Quiescent (ULQ) Current Mode
- 3.3 V and 5 V PWM Signal Compatible
- Diode Emulation Mode with FCCM
- Input Voltages up to 24 V
- Tri-State PWM Input
- Integrated Bootsrap Diode
- Shoot Through Protection
- RoHS Compliant – Lead Free Terminal Plating
- Halogen Free
Beschreibung von CSD97394Q4M
The CSD97394Q4M NexFET™ Power Stage is a highly-optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables connected standby for Windows® 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high current, high efficiency, and high speed switching device in a small 3.5 × 4.5 mm outline package. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.