Startseite Schnittstelle LVDS-, M-LVDS- und PECL-ICs

DS92001

AKTIV

3,3-V-B/LVDS-BLVDS-Puffer

Produktdetails

Function Buffer Protocols BLVDS Number of transmitters 1 Number of receivers 1 Supply voltage (V) 3.3 Signaling rate (Mbps) 400 Input signal LVDS, LVTTL Output signal LVDS Rating Catalog Operating temperature range (°C) -40 to 85
Function Buffer Protocols BLVDS Number of transmitters 1 Number of receivers 1 Supply voltage (V) 3.3 Signaling rate (Mbps) 400 Input signal LVDS, LVTTL Output signal LVDS Rating Catalog Operating temperature range (°C) -40 to 85
SOIC (D) 8 29.4 mm² 4.9 x 6 WSON (NGK) 8 9 mm² 3 x 3
  • Single +3.3 V Supply
  • Receiver Inputs Accept LVDS/CML/LVPECL Signals
  • TRI-STATE Outputs
  • Receiver Input Threshold < ±100 mV
  • Fast Propagation Delay of 1.4 ns (typ)
  • Low Jitter 400 Mbps Fully Differential Data Path
  • Compatible with BLVDS 10-bit SerDes (40MHz)
  • Compatible with ANSI/TIA/EIA-644-A LVDS Standard
  • Available in SOIC and Space Saving WSON Package
  • Industrial Temperature Range

All trademarks are the property of their respective owners.

  • Single +3.3 V Supply
  • Receiver Inputs Accept LVDS/CML/LVPECL Signals
  • TRI-STATE Outputs
  • Receiver Input Threshold < ±100 mV
  • Fast Propagation Delay of 1.4 ns (typ)
  • Low Jitter 400 Mbps Fully Differential Data Path
  • Compatible with BLVDS 10-bit SerDes (40MHz)
  • Compatible with ANSI/TIA/EIA-644-A LVDS Standard
  • Available in SOIC and Space Saving WSON Package
  • Industrial Temperature Range

All trademarks are the property of their respective owners.

The DS92001 B/LVDS-BLVDS Buffer takes a BLVDS input signal and provides a BLVDS output signal. In many large systems, signals are distributed across backplanes. One of the limiting factors for system speed is the "stub length" or the distance between the transmission line and the unterminated receivers on individual cards. Although it is generally recognized that this distance should be as short as possible to maximize system performance, real-world packaging concerns often make it difficult to make the stubs as short as the designer would like.

The DS92001 has edge transitions optimized for multidrop backplanes where the switching frequency is in the 200 MHz range or less. The output edge rate is critical in some systems where long stubs may be present, and utilizing a slow transition allows for longer stub lengths.

The DS92001, available in the WSON package, will allow the receiver inputs to be placed very close to the main transmission line, thus improving system performance.

A wide input dynamic range allows the DS92001 to receive differential signals from LVPECL, CML as well as LVDS sources. This will allow the device to also fill the role of an LVPECL-BLVDS or CML-BLVDS translator.

The DS92001 B/LVDS-BLVDS Buffer takes a BLVDS input signal and provides a BLVDS output signal. In many large systems, signals are distributed across backplanes. One of the limiting factors for system speed is the "stub length" or the distance between the transmission line and the unterminated receivers on individual cards. Although it is generally recognized that this distance should be as short as possible to maximize system performance, real-world packaging concerns often make it difficult to make the stubs as short as the designer would like.

The DS92001 has edge transitions optimized for multidrop backplanes where the switching frequency is in the 200 MHz range or less. The output edge rate is critical in some systems where long stubs may be present, and utilizing a slow transition allows for longer stub lengths.

The DS92001, available in the WSON package, will allow the receiver inputs to be placed very close to the main transmission line, thus improving system performance.

A wide input dynamic range allows the DS92001 to receive differential signals from LVPECL, CML as well as LVDS sources. This will allow the device to also fill the role of an LVPECL-BLVDS or CML-BLVDS translator.

Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 1
Typ Titel Datum
* Data sheet DS92001 3.3V B/LVDS-BLVDS Buffer datasheet (Rev. F) 22 Apr 2013

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Simulationstool

PSPICE-FOR-TI — PSpice® für TI Design-und Simulationstool

PSpice® für TI ist eine Design- und Simulationsumgebung, welche Sie dabei unterstützt, die Funktionalität analoger Schaltungen zu evaluieren. Diese voll ausgestattete Design- und Simulationssuite verwendet eine analoge Analyse-Engine von Cadence®. PSpice für TI ist kostenlos erhältlich und (...)
Simulationstool

TINA-TI — SPICE-basiertes analoges Simulationsprogramm

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Benutzerhandbuch: PDF
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
SOIC (D) 8 Ultra Librarian
WSON (NGK) 8 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos