LM2502

AKTIV

Serializer und Deserializer für Display-Schnittstelle Mobile Pixel Link (MPL)

Produktdetails

Protocols Catalog Rating Catalog Operating temperature range (°C) -30 to 85
Protocols Catalog Rating Catalog Operating temperature range (°C) -30 to 85
WQFN (RSB) 40 25 mm² (5 mm × 5 mm)
  • >300 Mbps Dual Link Raw Throughput
  • MPL Physical Layer (MPL-0)
  • Pin Selectable Master / Slave Mode
  • Frequency Reference Transport
  • Complete LVCMOS / MPL Translation
  • Interface Modes:
    • 16-bit CPU, i80 or m68 Style
    • RGB565 with Glue Logic
  • −30°C to 85°C Operating Range
  • Link Power Down Mode Reduces IDDZ < 10 µA
  • Dual Display Support (CS1* & CS2*)
  • Via-less MPL Interconnect Feature
  • 3.0V Supply Voltage (VDD and VDDA)
  • Interfaces to 1.7V to 3.3V Logic (VDDIO)

All trademarks are the property of their respective owners.

  • >300 Mbps Dual Link Raw Throughput
  • MPL Physical Layer (MPL-0)
  • Pin Selectable Master / Slave Mode
  • Frequency Reference Transport
  • Complete LVCMOS / MPL Translation
  • Interface Modes:
    • 16-bit CPU, i80 or m68 Style
    • RGB565 with Glue Logic
  • −30°C to 85°C Operating Range
  • Link Power Down Mode Reduces IDDZ < 10 µA
  • Dual Display Support (CS1* & CS2*)
  • Via-less MPL Interconnect Feature
  • 3.0V Supply Voltage (VDD and VDDA)
  • Interfaces to 1.7V to 3.3V Logic (VDDIO)

All trademarks are the property of their respective owners.

The LM2502 device is a dual link display interface SERDES that adapts existing CPU / video busses to a low power current-mode serial MPL link. The chipset may also be used for a RGB565 application with glue logic. The interconnect is reduced from 22 signals to only 3 active signals with the LM2502 chipset easing flex interconnect design, size and cost.

The Master Serializer (SER) resides beside an application processor or baseband processor and translates a parallel bus from LVCMOS levels to serial MPL levels for transmission over a flex cable and PCB traces to the Slave Deserializer (DES) located near the display module.

Dual display support is provided for a primary and sub display through the use of two ChipSelect signals. A Mode pin selects either a i80 or m68 style interface.

The Power_Down (PD*) input controls the power state of the MPL interface. When PD* is asserted, the MD1/0 and MC signals are powered down to save current.

The LM2502 implements the physical layer of the MPL Standard (MPL-0). The LM2502 is offered in NOPB (Lead-free) NFBGA and WQFN packages.

The LM2502 device is a dual link display interface SERDES that adapts existing CPU / video busses to a low power current-mode serial MPL link. The chipset may also be used for a RGB565 application with glue logic. The interconnect is reduced from 22 signals to only 3 active signals with the LM2502 chipset easing flex interconnect design, size and cost.

The Master Serializer (SER) resides beside an application processor or baseband processor and translates a parallel bus from LVCMOS levels to serial MPL levels for transmission over a flex cable and PCB traces to the Slave Deserializer (DES) located near the display module.

Dual display support is provided for a primary and sub display through the use of two ChipSelect signals. A Mode pin selects either a i80 or m68 style interface.

The Power_Down (PD*) input controls the power state of the MPL interface. When PD* is asserted, the MD1/0 and MC signals are powered down to save current.

The LM2502 implements the physical layer of the MPL Standard (MPL-0). The LM2502 is offered in NOPB (Lead-free) NFBGA and WQFN packages.

Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 2
Top-Dokumentation Typ Titel Format-Optionen Neueste englische Version herunterladen Datum
* Datenblatt LM2502 Mobile Pixel Link (MPL) Display Interface Serializer and Deserializer datasheet (Rev. L) 02.05.2013
Anwendungshinweis Mobile Pixel Link Level-0 20.03.2012

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
WQFN (RSB) 40 Ultra Librarian

Bestellen & Qualität

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos