Produktdetails

Protocols Analog Configuration 1:1 SPST Number of channels 8 Bandwidth (MHz) 500 Ron (typ) (mΩ) 4000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 5.5 Supply current (typ) (µA) 1000 Operating temperature range (°C) -40 to 85 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 64 COFF (typ) (pF) 3.5 CON (typ) (pF) 9 OFF-state leakage current (max) (µA) 1 Ron (max) (mΩ) 9000 VIH (min) (V) 1.7 VIL (max) (V) 0.8 Rating Catalog
Protocols Analog Configuration 1:1 SPST Number of channels 8 Bandwidth (MHz) 500 Ron (typ) (mΩ) 4000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 5.5 Supply current (typ) (µA) 1000 Operating temperature range (°C) -40 to 85 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 64 COFF (typ) (pF) 3.5 CON (typ) (pF) 9 OFF-state leakage current (max) (µA) 1 Ron (max) (mΩ) 9000 VIH (min) (V) 1.7 VIL (max) (V) 0.8 Rating Catalog
VQFN (RGY) 20 15.75 mm² (4.5 mm × 3.5 mm) TSSOP (PW) 20 41.6 mm² (6.5 mm × 6.4 mm) TVSOP (DGV) 20 32 mm² (5 mm × 6.4 mm) SSOP (DBQ) 20 51.9 mm² (8.65 mm × 6 mm)
  • High-bandwidth datapath (up to 500MHz)
  • 5V-tolerant I/Os with device powered up or powered down
  • Low and flat ON-state resistance (ron) characteristics over operating range (ron = 4Ω typical)
  • Rail-to-rail switching on data I/O ports
    • 0- to 5V switching with 3.3V VCC
    • 0- to 3.3V switching with 2.5V VCC
  • Bidirectional data flow with near-zero propagation delay
  • Low input, output capacitance minimizes loading and signal distortion (Cio(OFF) = 4pF typical)
  • Fast switching frequency (f OE = 20MHz maximum)
  • Data and control inputs provide undershoot clamp diodes
  • Low power consumption (ICC = 0.7mA typical)
  • VCC operating range from 2.3V to 3.6V
  • Data I/Os support 0- to 5V signaling levels (0.8V, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V, and 5V)
  • Control inputs can be driven by TTL or 5V/3.3V CMOS outputs
  • Ioff supports partial-power-down mode operation
  • Latch-up performance exceeds 100mA per JESD 78, class II
  • ESD performance tested per JESD 22
    • 2000V human-body model (A114B, class II)
    • 1000V charged-device model (C101)
  • High-bandwidth datapath (up to 500MHz)
  • 5V-tolerant I/Os with device powered up or powered down
  • Low and flat ON-state resistance (ron) characteristics over operating range (ron = 4Ω typical)
  • Rail-to-rail switching on data I/O ports
    • 0- to 5V switching with 3.3V VCC
    • 0- to 3.3V switching with 2.5V VCC
  • Bidirectional data flow with near-zero propagation delay
  • Low input, output capacitance minimizes loading and signal distortion (Cio(OFF) = 4pF typical)
  • Fast switching frequency (f OE = 20MHz maximum)
  • Data and control inputs provide undershoot clamp diodes
  • Low power consumption (ICC = 0.7mA typical)
  • VCC operating range from 2.3V to 3.6V
  • Data I/Os support 0- to 5V signaling levels (0.8V, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V, and 5V)
  • Control inputs can be driven by TTL or 5V/3.3V CMOS outputs
  • Ioff supports partial-power-down mode operation
  • Latch-up performance exceeds 100mA per JESD 78, class II
  • ESD performance tested per JESD 22
    • 2000V human-body model (A114B, class II)
    • 1000V charged-device model (C101)

The SN74CB3Q3345 is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (ron). The low and flat ON-state resistance allows for minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. The device also features low data I/O capacitance to minimize capacitive loading and signal distortion on the data bus. Specifically designed to support high-bandwidth applications, the SN74CB3Q3345 provides an optimized interface for broadband communications, networking, and data-intensive computing systems.

The SN74CB3Q3345 is organized as an 8-bit bus switch with two output-enable (OE, OE) inputs. When OE is high or OE is low, the bus switch is ON, and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE is low and OE is high, the bus switch is OFF, and a high-impedance state exists between the A and B ports.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry prevents damaging current backflow through the device when powered down.

The device has isolation during power off. To maintain the high-impedance state during power up or power down, OE must be tied to VCC through a pullup resistor and OE must be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver.

The SN74CB3Q3345 is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (ron). The low and flat ON-state resistance allows for minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. The device also features low data I/O capacitance to minimize capacitive loading and signal distortion on the data bus. Specifically designed to support high-bandwidth applications, the SN74CB3Q3345 provides an optimized interface for broadband communications, networking, and data-intensive computing systems.

The SN74CB3Q3345 is organized as an 8-bit bus switch with two output-enable (OE, OE) inputs. When OE is high or OE is low, the bus switch is ON, and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE is low and OE is high, the bus switch is OFF, and a high-impedance state exists between the A and B ports.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry prevents damaging current backflow through the device when powered down.

The device has isolation during power off. To maintain the high-impedance state during power up or power down, OE must be tied to VCC through a pullup resistor and OE must be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver.

Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 4
Top-Dokumentation Typ Titel Format-Optionen Neueste englische Version herunterladen Datum
* Datenblatt SN74CB3Q3345 8-Bit FET BUS Switch 2.5V, 3.3V Low-Voltage High-Bandwidth BUS Switch datasheet (Rev. C) PDF | HTML 21.08.2026
Anwendungshinweis Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02.06.2022
Anwendungshinweis Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01.12.2021
Application brief Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) PDF | HTML 06.01.2021

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Schnittstellenadapter

LEADED-ADAPTER1 — Oberflächenmontierbarer DIP-Header-Adapter zur schnellen Prüfung der 5-, 8-, 10-, 16- und 24-poligen

Die EVM-LEADED1-Platine ermöglicht schnelles Testen und Testbrettaufbauten von gängigen bleihaltigen Gehäusen von TI.  Die Platine verfügt über Anschlussflächen, um die oberflächenmontierten Gehäuse D, DBQ, DCT,DCU, DDF, DGS, DGV und PW von TI in 100-mil-DIP-Stiftleisten umzuwandeln.     

Benutzerhandbuch: PDF
Unterstützte Produkte und Hardware
Vorrätig
Limit:
??asset.out-of-stock-ti_de_DE??
Nicht verfügbar
Simulationsmodell

HSPICE Model of SN74CB3Q3345 (Rev. A)

SCDJ022 (115 KB) - HSpice-Modell
Unterstützte Produkte und Hardware
Simulationsmodell

SN74CB3Q3345 IBIS Model

SCDM061.ZIP (25 KB) - IBIS-Modell
Unterstützte Produkte und Hardware
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
VQFN (RGY) 20 Ultra Librarian
TSSOP (PW) 20 Ultra Librarian
TVSOP (DGV) 20 Ultra Librarian
SSOP (DBQ) 20 Ultra Librarian

Bestellen & Qualität

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos