Gehäuseinformationen
| Gehäuse | Pins SOIC (D) | 8 |
| Betriebstemperaturbereich (°C) -40 to 150 |
| Gehäusemenge | Träger 75 | TUBE |
Merkmale von TPS54231
- 3.5- to 28-V Input Voltage Range
- Adjustable Output Voltage Down to 0.8 V
- Integrated 80-mΩ High-Side MOSFET
Supports up to 2 A Continuous Output
Current - High Efficiency at Light Loads with a
Pulse Skipping Eco-mode™ - Fixed 570-kHz Switching Frequency
- Typical 1-µA Shutdown Quiescent
Current - Adjustable Slow-Start Limits Inrush
Currents - Programmable UVLO Threshold
- Overvoltage Transient Protection
- Cycle-by-Cycle Current Limit, Frequency
Fold Back and Thermal Shutdown Protection - Available in Easy-to-Use SOIC8 Package
- Supported by WEBENCH® Software Tool
(www.TI.com/WEBENCH) - APPLICATIONS
- Consumer Applications such as Set-Top Boxes,
CPE Equipment, LCD Displays, Peripherals, and
Battery Chargers - Industrial and Car Audio Power Supplies
- 5-V, 12-V and 24-V Distributed Power Systems
- Consumer Applications such as Set-Top Boxes,
WEBENCH Is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners
Beschreibung von TPS54231
The TPS54231 device is a 2-V, 2-A non-synchronous buck converter that integrates a low RDS(on) high-side MOSFET. To increase efficiency at light loads, a pulse skipping Eco-mode™ feature is automatically activated. Furthermore, the 1-µA shutdown supply current allows the device to be used in battery powered applications. Current mode control with internal slope compensation simplifies the external compensation calculations and reduces component count while allowing the use of ceramic output capacitors. A resistor divider programs the hysteresis of the input undervoltage lockout. An overvoltage transient protection circuit limits voltage overshoots during startup and transient conditions. A cycle-by-cycle current limit scheme, frequency fold back and thermal shutdown protect the device and the load in the event of an overload condition. The TPS54231 device is available in an 8-pin SOIC package that has been internally optimized to improve thermal performance.