Startseite Schalter und Multiplexer Analogschalter und Multiplexer Protokoll- & Busschalter & -multiplexer
Startseite
Schalter und Multiplexer
Analogschalter und Multiplexer
Protokoll- & Busschalter & -multiplexer

TS3USB30E

AKTIV

Schneller Switch für einen Port mit Freigabesignal für USB 2.0 und ESD-Schutz

Jetzt bestellen
Datenblatt

TS3USB30E

AKTIV
Datenblatt Jetzt bestellen

Produktdetails

Protocols USB 2.0 Configuration 2:1 SPDT Number of channels 2 USB speed (Mbps) 480 Bandwidth (MHz) 900 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 6000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 4.3 ESD HBM (typ) (kV) 8 Operating temperature range (°C) -40 to 85 COFF (typ) (pF) 2 CON (typ) (pF) 7.5 Off isolation (typ) (dB) -40 OFF-state leakage current (max) (µA) 1 Ron (max) (mΩ) 10000 Ron channel match (max) (Ω) 0.35 Turnoff time (disable) (max) (ns) 25 Turnon time (enable) (max) (ns) 30 Rating Catalog
Protocols USB 2.0 Configuration 2:1 SPDT Number of channels 2 USB speed (Mbps) 480 Bandwidth (MHz) 900 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 6000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 4.3 ESD HBM (typ) (kV) 8 Operating temperature range (°C) -40 to 85 COFF (typ) (pF) 2 CON (typ) (pF) 7.5 Off isolation (typ) (dB) -40 OFF-state leakage current (max) (µA) 1 Ron (max) (mΩ) 10000 Ron channel match (max) (Ω) 0.35 Turnoff time (disable) (max) (ns) 25 Turnon time (enable) (max) (ns) 30 Rating Catalog
UQFN (RSW) 10 2.52 mm² 1.8 x 1.4 VSSOP (DGS) 10 14.7 mm² 3 x 4.9
  • VCC operation at 2.7V to 4.3V
  • D+/D– pins tolerate up to 5.25V
  • 1.8V compatible control-pin inputs
  • IOFF supports partial power-down-mode operation
  • RON = 10Ω maximum
  • ΔRON = 0.35Ω typical
  • Cio(ON) = 7.5pF typical
  • Low power consumption (70nA maximum)
  • –3dB bandwidth = 1400MHz typical
  • Latch-up performance exceeds 100mA per JESD 78, Class II (1)
  • ESD performance tested per JESD 22
    • 8000V human-body model (A114-B, Class II)
    • 1000V charged-device model (C101)
  • ESD performance I/O port to GND (2)
    • 15000V human-body model
  • Packaged in 10-pin UQFN (1.8mm × 1.4mm)

(1)Except OE and S inputs

(2)High-voltage HBM is performed in addition to the standard HBM testing (A114-B, Class II) and applies to I/O ports tested with respect to GND only.
  • VCC operation at 2.7V to 4.3V
  • D+/D– pins tolerate up to 5.25V
  • 1.8V compatible control-pin inputs
  • IOFF supports partial power-down-mode operation
  • RON = 10Ω maximum
  • ΔRON = 0.35Ω typical
  • Cio(ON) = 7.5pF typical
  • Low power consumption (70nA maximum)
  • –3dB bandwidth = 1400MHz typical
  • Latch-up performance exceeds 100mA per JESD 78, Class II (1)
  • ESD performance tested per JESD 22
    • 8000V human-body model (A114-B, Class II)
    • 1000V charged-device model (C101)
  • ESD performance I/O port to GND (2)
    • 15000V human-body model
  • Packaged in 10-pin UQFN (1.8mm × 1.4mm)

(1)Except OE and S inputs

(2)High-voltage HBM is performed in addition to the standard HBM testing (A114-B, Class II) and applies to I/O ports tested with respect to GND only.

The TS3USB30E is a high-bandwidth 1:2 switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (1400MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs, or from two different hosts to one corresponding output. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. The TS3USB30E is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480Mbps).

The TS3USB30E integrates ESD protection cells on all pins, is available in a tiny UQFN package (1.8mm × 1.4mm) or a VSSOP package, and is characterized over the free-air temperature range of –40°C to 85°C.

The TS3USB30E is a high-bandwidth 1:2 switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (1400MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs, or from two different hosts to one corresponding output. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. The TS3USB30E is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480Mbps).

The TS3USB30E integrates ESD protection cells on all pins, is available in a tiny UQFN package (1.8mm × 1.4mm) or a VSSOP package, and is characterized over the free-air temperature range of –40°C to 85°C.
filter Andere Protokoll- & Busschalter & -multiplexer suchen
Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 3
Typ Titel Datum
* Data sheet TS3USB30E ESD-Protected, High-Speed USB 2.0 (480Mbps) 1:2 Multiplexer/Demultiplexer Switch With Single Enable datasheet (Rev. G) PDF | HTML 28 Okt 2024
Application note Passive Mux Selection Based On Bandwidth (Rev. A) PDF | HTML 31 Jul 2024
Application note High-Speed Layout Guidelines for Signal Conditioners and USB Hubs 14 Jun 2018

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Simulationsmodell

TS3USB30E S-Parameter Model

SCDM186.ZIP (130 KB) - S-Parameter Model
Herunterladen
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
UQFN (RSW) 10 Ultra Librarian
VSSOP (DGS) 10 Ultra Librarian
Es gelten die allgemeinen Geschäftsbedingungen von TI für Evaluierungsartikel.

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Alle Forenthemen auf Englisch anzeigen

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos