Produktdetails

Protocols USB 2.0 Configuration 1:1 SPST Number of channels 2 USB speed (Mbps) 480 Bandwidth (MHz) 1220 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 6000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 4.3 ESD HBM (typ) (kV) 6 Operating temperature range (°C) -40 to 85 COFF (typ) (pF) 2 CON (typ) (pF) 6 Off isolation (typ) (dB) -30 OFF-state leakage current (max) (µA) 1 Ron (max) (mΩ) 10000 Ron channel match (max) (Ω) 0.35 Turnoff time (disable) (max) (ns) 25 Turnon time (enable) (max) (ns) 30 Rating Catalog
Protocols USB 2.0 Configuration 1:1 SPST Number of channels 2 USB speed (Mbps) 480 Bandwidth (MHz) 1220 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 6000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 4.3 ESD HBM (typ) (kV) 6 Operating temperature range (°C) -40 to 85 COFF (typ) (pF) 2 CON (typ) (pF) 6 Off isolation (typ) (dB) -30 OFF-state leakage current (max) (µA) 1 Ron (max) (mΩ) 10000 Ron channel match (max) (Ω) 0.35 Turnoff time (disable) (max) (ns) 25 Turnon time (enable) (max) (ns) 30 Rating Catalog
UQFN (RSE) 8 2.25 mm² 1.5 x 1.5
  • VCC Operation at 3 V and 4.3 V
  • 1.8-V Compatible Control-Pin Inputs
  • IOFF Supports Partial Power-Down Mode Operation
  • ron = 10 Ω Maximum
  • Δron <0.35 Ω Typical
  • Cio(ON) = 6 pF Typical
  • Low Power Consumption (1 µA Maximum)
  • ESD Performance Tested Per JESD 22
    • 6000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
    • 250-V Machine Model (A115-A)
  • Wide –3-dB Bandwidth = 1220 MHz Typical
  • Packaged in 8-Pin TQFN (1.5 mm × 1.5 mm)
  • VCC Operation at 3 V and 4.3 V
  • 1.8-V Compatible Control-Pin Inputs
  • IOFF Supports Partial Power-Down Mode Operation
  • ron = 10 Ω Maximum
  • Δron <0.35 Ω Typical
  • Cio(ON) = 6 pF Typical
  • Low Power Consumption (1 µA Maximum)
  • ESD Performance Tested Per JESD 22
    • 6000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
    • 250-V Machine Model (A115-A)
  • Wide –3-dB Bandwidth = 1220 MHz Typical
  • Packaged in 8-Pin TQFN (1.5 mm × 1.5 mm)

The TS3USB31 is a 1:1 SPST high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals. This device comes in a small UQFN package for use in a handset or consumer applications, such as cell phones, digital cameras, and notebooks with hubs. The wide bandwidth (750 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).

The TS3USB31 is a 1:1 SPST high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals. This device comes in a small UQFN package for use in a handset or consumer applications, such as cell phones, digital cameras, and notebooks with hubs. The wide bandwidth (750 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).

Herunterladen Video mit Transkript ansehen Video

Ähnliche Produkte, die für Sie interessant sein könnten

Selbe Funktionalität wie der verglichene Baustein bei abweichender Anschlussbelegung
TS3USB221A AKTIV Schneller Switch für einen Port mit Freigabesignal für USB 2.0 und ESD-Schutz The referenced device is an enhanced pinout option allowing flow through board layout.

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 3
Typ Titel Datum
* Data sheet TS3USB31 1:1 SPST High-Speed USB 2.0 (480-Mbps) Bus Isolation Switch With Single Enable datasheet (Rev. E) PDF | HTML 25 Aug 2016
Application note Passive Mux Selection Based On Bandwidth (Rev. A) PDF | HTML 31 Jul 2024
Application note High-Speed Layout Guidelines for Signal Conditioners and USB Hubs 14 Jun 2018

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Simulationsmodell

HSPICE Model for TS3USB31

SCDJ042.ZIP (95 KB) - HSpice Model
Simulationsmodell

TS3USB31 IBIS Model

SCDM099.ZIP (16 KB) - IBIS Model
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
UQFN (RSE) 8 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos