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CC2745P10-Q1

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MCU inalámbrico SimpleLink™ Bluetooth® LE automotriz, flash de 1 MB, HSM, APU, CAN-FD y +20 dBm

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CC2745P10-Q1

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Detalles del producto

Type Wireless MCU Technology 2.4 GHz, Bluetooth® LE Protocols Qualified against Bluetooth® Core 6.0 CPU Arm® Cortex®-M33 Flash memory (kByte) 1024 RAM (kByte) 162 CAN (#) CAN-FD Number of GPIOs 23 TX power (max) (dBm) 20 Features AEC-Q100 Grade 2 qualified, Channel Sounding, DC/DC, Integrated Algorithm Processing Unit (APU), Integrated RF switch, Integrated balun, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), OAD Peripherals 1 Watchdog timer, 1 comparator, 12-bit ADC, 2 SPI, 2 UART, 4 timers, I2C, I2S, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC) Security Cryptographic acceleration, Hardware-enforced isolation, ISO21434 automotive cybersecurity compliant, Secure boot, Secure storage Cryptographic accelerators AES, ECC, RSA, SHA-2, TRNG Rating Automotive Operating temperature range (°C) -40 to 125 TI functional safety category CS Hardware accelerators CDE NPU Edge AI enabled Yes
Type Wireless MCU Technology 2.4 GHz, Bluetooth® LE Protocols Qualified against Bluetooth® Core 6.0 CPU Arm® Cortex®-M33 Flash memory (kByte) 1024 RAM (kByte) 162 CAN (#) CAN-FD Number of GPIOs 23 TX power (max) (dBm) 20 Features AEC-Q100 Grade 2 qualified, Channel Sounding, DC/DC, Integrated Algorithm Processing Unit (APU), Integrated RF switch, Integrated balun, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), OAD Peripherals 1 Watchdog timer, 1 comparator, 12-bit ADC, 2 SPI, 2 UART, 4 timers, I2C, I2S, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC) Security Cryptographic acceleration, Hardware-enforced isolation, ISO21434 automotive cybersecurity compliant, Secure boot, Secure storage Cryptographic accelerators AES, ECC, RSA, SHA-2, TRNG Rating Automotive Operating temperature range (°C) -40 to 125 TI functional safety category CS Hardware accelerators CDE NPU Edge AI enabled Yes
VQFN (RHA) 40 36 mm² (6 mm × 6 mm)
  • Arm Cortex-M33 processor (96MHz) with FPU (floating point unit), TrustZone-M support, and CDE (custom datapath extension) for machine learning acceleration
  • Algorithm Processing Unit (APU) (96MHz)
    • Mathematical accelerator for efficient vector and matrix operations
    • Bluetooth Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms such as MUltiple SIgnal Classification (MUSIC)
  • Up to 1MB of in-system programmable flash
  • Up to 162KB of SRAM
  • 32KB of System ROM with secure boot root of trust (RoT) and a serial (SPI/UART) bootloader
  • Serial wire debug (SWD)
  • AEC-Q100 Grade 2 qualified:
    • –40°C to +125°C junction temperature
  • HBM ESD Classification Level 2 (ESD HBM level 1C on RF pin, per AEC-Q100 Rev. J)
  • CDM ESD Classification Level C2A (ESD CDM level C1 on RF pin, per AEC-Q100 Rev. J)
  • 23 GPIOs, digital peripherals can be routed to multiple GPIOs:
    • Two SWD IO pads, multiplexed with GPIOs
    • Two LFXT IO pads, multiplexed with GPIOs
    • 19 DIOs (analog or digital IOs)
  • All GPIOs with wakeup and interrupt capabilities
  • 3 × 16-bit and 1 × 32-bit general-purpose timers, quadrature decode mode support
  • Real-time clock (RTC)
  • Watchdog timer
  • System timer for radio, RTOS, and application operations for Bluetooth channel sounding postprocessing
  • 12-bit ADC, up to 1.2MSPS, eight external inputs
  • Temperature sensor and battery monitor
  • 1× low-power comparator
  • 2× UART with LIN capability
  • 2× SPI
  • 1× I2C
  • 1× I2S
  • 1× CAN-FD controller with CAN/CAN-FD ISO 16845-1:2016 certification compliance
  • ISO21434 Automotive Cybersecurity Compliant
  • Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:
    • AES (up to 256 bits) crypto accelerator
    • ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator
    • SHA-2 (up to 512 bits) accelerator
    • True random number generator
    • HSM firmware update support
    • Differential power analysis (DPA) countermeasures for AES and ECC
  • Separate AES 128-bit cryptographic accelerator (LAES) for latency-critical link-layer operations
  • Secure boot and secure firmware updates
  • Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation
  • Voltage glitch monitor (VGM)
  • On-chip buck DC/DC converter
  • RX current: 6.1mA
  • TX current at 0dBm: 7.7mA
  • TX current at +10dBm: 24.5mA (R variant)
  • TX current at +20dBm: 143mA (P variant)
  • Active mode MCU 96MHz (CoreMark): 6.8mA
  • Standby: 0.9µA (low power mode, RTC on, full SRAM retention)
  • Shutdown: 160nA
  • Bluetooth® Core 6.0 Qualified
    • Support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy specification
  • Output power up to +10dBm (R variant)
  • Output power up to +20dBm (P variant)
  • Integrated BALUN
  • Integrated RF switch
  • Receiver sensitivity:
    • Bluetooth LE 125kbps: –103.5dBm
    • Bluetooth LE 1Mbps: –97dBm

Regulatory compliance

  • Designed for systems targeting compliance with worldwide radio frequency regulations
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15 (US)
    • ARIB STD-T66 (Japan)
  • LP-EM-CC2745R10-Q1, LP-EM-CC2755P10 LaunchPad™ Development Kit
  • BP-EM-CS Multiple antenna board for Bluetooth Channel Sounding
  • SimpleLink™ Low Power F3 Software Development Kit (SDK)
    • Fully qualified Bluetooth® software protocol stack in the SDK
      • Up to 32 concurrent multirole connections
      • Bluetooth Low Energy 6.0 Support
      • CCC Digital Key 3 / ICCE Bluetooth APIs support for secure car access systems
  • Automotive SPICE (ASPICE) compliance for SDK components, including the Bluetooth LE stack
  • SysConfig system configuration tool
  • SmartRF™ Studio for simple radio configuration

Operating ranges

  • Junction temperature TJ: –40°C to 125°C
  • Wide supply voltage range 1.71V to 3.8V
Package
  • 6mm × 6mm QFN40 with wettable flanks
  • RoHS-compliant package
  • Arm Cortex-M33 processor (96MHz) with FPU (floating point unit), TrustZone-M support, and CDE (custom datapath extension) for machine learning acceleration
  • Algorithm Processing Unit (APU) (96MHz)
    • Mathematical accelerator for efficient vector and matrix operations
    • Bluetooth Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms such as MUltiple SIgnal Classification (MUSIC)
  • Up to 1MB of in-system programmable flash
  • Up to 162KB of SRAM
  • 32KB of System ROM with secure boot root of trust (RoT) and a serial (SPI/UART) bootloader
  • Serial wire debug (SWD)
  • AEC-Q100 Grade 2 qualified:
    • –40°C to +125°C junction temperature
  • HBM ESD Classification Level 2 (ESD HBM level 1C on RF pin, per AEC-Q100 Rev. J)
  • CDM ESD Classification Level C2A (ESD CDM level C1 on RF pin, per AEC-Q100 Rev. J)
  • 23 GPIOs, digital peripherals can be routed to multiple GPIOs:
    • Two SWD IO pads, multiplexed with GPIOs
    • Two LFXT IO pads, multiplexed with GPIOs
    • 19 DIOs (analog or digital IOs)
  • All GPIOs with wakeup and interrupt capabilities
  • 3 × 16-bit and 1 × 32-bit general-purpose timers, quadrature decode mode support
  • Real-time clock (RTC)
  • Watchdog timer
  • System timer for radio, RTOS, and application operations for Bluetooth channel sounding postprocessing
  • 12-bit ADC, up to 1.2MSPS, eight external inputs
  • Temperature sensor and battery monitor
  • 1× low-power comparator
  • 2× UART with LIN capability
  • 2× SPI
  • 1× I2C
  • 1× I2S
  • 1× CAN-FD controller with CAN/CAN-FD ISO 16845-1:2016 certification compliance
  • ISO21434 Automotive Cybersecurity Compliant
  • Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:
    • AES (up to 256 bits) crypto accelerator
    • ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator
    • SHA-2 (up to 512 bits) accelerator
    • True random number generator
    • HSM firmware update support
    • Differential power analysis (DPA) countermeasures for AES and ECC
  • Separate AES 128-bit cryptographic accelerator (LAES) for latency-critical link-layer operations
  • Secure boot and secure firmware updates
  • Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation
  • Voltage glitch monitor (VGM)
  • On-chip buck DC/DC converter
  • RX current: 6.1mA
  • TX current at 0dBm: 7.7mA
  • TX current at +10dBm: 24.5mA (R variant)
  • TX current at +20dBm: 143mA (P variant)
  • Active mode MCU 96MHz (CoreMark): 6.8mA
  • Standby: 0.9µA (low power mode, RTC on, full SRAM retention)
  • Shutdown: 160nA
  • Bluetooth® Core 6.0 Qualified
    • Support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy specification
  • Output power up to +10dBm (R variant)
  • Output power up to +20dBm (P variant)
  • Integrated BALUN
  • Integrated RF switch
  • Receiver sensitivity:
    • Bluetooth LE 125kbps: –103.5dBm
    • Bluetooth LE 1Mbps: –97dBm

Regulatory compliance

  • Designed for systems targeting compliance with worldwide radio frequency regulations
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15 (US)
    • ARIB STD-T66 (Japan)
  • LP-EM-CC2745R10-Q1, LP-EM-CC2755P10 LaunchPad™ Development Kit
  • BP-EM-CS Multiple antenna board for Bluetooth Channel Sounding
  • SimpleLink™ Low Power F3 Software Development Kit (SDK)
    • Fully qualified Bluetooth® software protocol stack in the SDK
      • Up to 32 concurrent multirole connections
      • Bluetooth Low Energy 6.0 Support
      • CCC Digital Key 3 / ICCE Bluetooth APIs support for secure car access systems
  • Automotive SPICE (ASPICE) compliance for SDK components, including the Bluetooth LE stack
  • SysConfig system configuration tool
  • SmartRF™ Studio for simple radio configuration

Operating ranges

  • Junction temperature TJ: –40°C to 125°C
  • Wide supply voltage range 1.71V to 3.8V
Package
  • 6mm × 6mm QFN40 with wettable flanks
  • RoHS-compliant package

The SimpleLink™ CC274xR-Q1 and CC274xP-Q1 devices are AEC-Q100 complaint wireless microcontrollers (MCUs) supporting Bluetooth Low Energy 6.0 for automotive applications. These devices are optimized for low-power wireless communication in applications such as car access, including passive entry passive start (PEPS), phone as a key (PaaK), and remote keyless entry (RKE). The key features of this device include:

  • Support for features in Bluetooth 6.0 and earlier versions:
    • LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple advertisement sets, CSA#2, as well as backward compatibility with earlier Bluetooth Low Energy specifications
  • Bluetooth Channel Sounding technology support and an Algorithm Processing Unit (APU) to enable high accuracy, low cost, and a secure phase-based ranging mechanism for distance estimation

    • APU enables latency and power-efficient execution of distance-ranging signal processing algorithms, including FFT, super-resolution complex algorithms like MUltiple SIgnal Classification (MUSIC), and neural network algorithms.

  • ArmCustom Data Extension (CDE) instruction support for machine learning acceleration
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Advanced security features for connected wireless MCUs:
    • An isolated HSM environment with a dedicated controller handling accelerated cryptographic and random number generation operations
    • Secure boot and firmware updates with the root of trust enabled by an immutable system ROM
    • Arm Cortex M33 TrustZone-M based trusted execution environment support
    • Secure key storage support with HSM and TrustZone-M
    • Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage glitch injection
    • Dedicated AES-128 HW accelerator for handling timing-critical link-layer encryption/decryption operations
  • Ultra-low standby current with full 162KB SRAM retention and RTC operation that enables significant battery life extension, especially for applications with longer sleep intervals
  • Extended temperature support with the lowest standby current
  • Integrated BALUN and integrated RF switch to support both transmit and receive operations on the same RF pin, even in the P version; thereby, enabling a reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy

The CC274xR/P-Q1 devices are part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and a rich toolset. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

The SimpleLink™ CC274xR-Q1 and CC274xP-Q1 devices are AEC-Q100 complaint wireless microcontrollers (MCUs) supporting Bluetooth Low Energy 6.0 for automotive applications. These devices are optimized for low-power wireless communication in applications such as car access, including passive entry passive start (PEPS), phone as a key (PaaK), and remote keyless entry (RKE). The key features of this device include:

  • Support for features in Bluetooth 6.0 and earlier versions:
    • LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple advertisement sets, CSA#2, as well as backward compatibility with earlier Bluetooth Low Energy specifications
  • Bluetooth Channel Sounding technology support and an Algorithm Processing Unit (APU) to enable high accuracy, low cost, and a secure phase-based ranging mechanism for distance estimation

    • APU enables latency and power-efficient execution of distance-ranging signal processing algorithms, including FFT, super-resolution complex algorithms like MUltiple SIgnal Classification (MUSIC), and neural network algorithms.

  • ArmCustom Data Extension (CDE) instruction support for machine learning acceleration
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Advanced security features for connected wireless MCUs:
    • An isolated HSM environment with a dedicated controller handling accelerated cryptographic and random number generation operations
    • Secure boot and firmware updates with the root of trust enabled by an immutable system ROM
    • Arm Cortex M33 TrustZone-M based trusted execution environment support
    • Secure key storage support with HSM and TrustZone-M
    • Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage glitch injection
    • Dedicated AES-128 HW accelerator for handling timing-critical link-layer encryption/decryption operations
  • Ultra-low standby current with full 162KB SRAM retention and RTC operation that enables significant battery life extension, especially for applications with longer sleep intervals
  • Extended temperature support with the lowest standby current
  • Integrated BALUN and integrated RF switch to support both transmit and receive operations on the same RF pin, even in the P version; thereby, enabling a reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy

The CC274xR/P-Q1 devices are part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and a rich toolset. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.
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Documentación técnica

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Ver todo 17
Documentación principal Tipo Título Opciones de formato Descargar la versión más reciente en inglés Fecha
* Hoja de datos CC274xR-Q1, CC274xP-Q1 Automotive SimpleLink™ Bluetooth® Low Energy Wireless MCU datasheet (Rev. D) PDF | HTML 5/11/2025
* Guía del usuario CC27xx Technical Reference Manual (Rev. A) PDF | HTML 19/05/2025
* Errata CC274xx-Q1 SimpleLink ™ Wireless MCU Device Revision E Errata (Rev. B) PDF | HTML 6/01/2026
Nota sobre la aplicación Practical Software Debugging Methods and Software Design FAQs for CC27xx and CC23xx PDF | HTML 15/07/2026
Application brief CC27xx HSM Timing Benchmarks PDF | HTML 13/07/2026
Asesoramiento en ciberseguridad Invalid Bluetooth® LE Data Length Extension (DLE) Parameter Leading to DoS PDF | HTML 28/05/2026
Asesoramiento en ciberseguridad Denial of Service during Bluetooth LE authentication and connection PDF | HTML 28/05/2026
Asesoramiento en ciberseguridad Enabling Tools Client Mode Leads to Possibility of Bypassing Debug Authentication on CC27xx Devices PDF | HTML 12/05/2026
Nota sobre la aplicación CC27xx Operation and Configuration Without an External 32kHz Crystal PDF | HTML 11/05/2026
Nota sobre la aplicación CC234x and CC27xx Hardware Configuration and PCB Design Considerations (Rev. A) PDF | HTML 4/02/2026
Nota sobre la aplicación AN103 -- Basic RF Testing of CCxxxx Devices (Rev. A) PDF | HTML 11/12/2025
Nota sobre la aplicación How to Certify Your Bluetooth Product (Rev. N) PDF | HTML 18/11/2025
Certificado LP-EM-CC2745R10-Q1 EU Declaration of Conformity (DoC) (Rev. A) 13/05/2025
Artículo técnico Solving key wireless connectivity cyber security challenges with low-power wireless MCUs (Rev. A) PDF | HTML 11/12/2024
Nota sobre la aplicación High Accuracy, Low Cost, Secure Ranging with Bluetooth Channel Sounding PDF | HTML 27/02/2024
Nota sobre la aplicación RF PCB Simulation Cookbook 9/01/2019
Nota sobre la aplicación CC-Antenna-DK2 and Antenna Measurements Summary (Rev. A) PDF | HTML 2/10/2017

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

LP-EM-CC2745R10-Q1 — Kit de desarrollo LaunchPad™ CC2745R10-Q1 para MCU inalámbrico de 2.4 GHz SimpleLink™

Este kit de desarrollo LaunchPad™ acelera el desarrollo en dispositivos con amplificador de potencia integrado y soporte de radio para funcionamiento de 2.4 Ghz. El LaunchPad viene equipado con un microcontrolador (MCU) inalámbrico que cumple con AEC-Q100 y es compatible con Bluetooth® baja energía (...)

Guía del usuario: PDF | HTML
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Kit de desarrollo

LP-XDS110 — Depurador del kit de desarrollo LaunchPad™ XDS110

El depurador del kit de desarrollo LaunchPad LP-XDS110 es una herramienta para programar y depurar microcontroladores, microprocesadores y dispositivos DSP compatibles con XDS de Texas Instruments (TI). El LP-XDS110 está diseñado para conectarse directamente a Launchpads divididos a través del (...)

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Kit de desarrollo

LP-XDS110ET — Kit de desarrollo XDS110ET LaunchPad™ depurador con software EnergyTrace™

El depurador del kit de desarrollo LaunchPad LP-XDS110ET es una herramienta para programar y depurar microcontroladores, microprocesadores y dispositivos DSP compatibles con XDS de Texas Instruments (TI). El LP-XDS110ET puede conectarse directamente a kits de desarrollo Split Launchpad a través del (...)

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Tarjeta secundaria

TTC-3P-CHANNEL-SOUNDING — Solución de posicionamiento de sonido de canal de soporte de TTC HY-27P101PC

TTC es el primero en lograr la fabricación en serie de productos clave digitales automotrices y mantiene la cooperación en proyectos con los principales fabricantes de equipos originales del sector automotriz. 


HY-27P101PC y HY-27P103WC son módulos Bluetooth baja energía (5.3 y posterior) para (...)

Desde: Shenzhen Shengrun Technology Co., Ltd.
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Sonda de depuración

TMDSEMU110-U — Sonda de depuración XDS110 JTAG

El XDS110 de Texas Instruments es una nueva clase de sonda de depuración (emulador) para procesadores integrados de TI. El XDS110 sustituye a la familia XDS100, al tiempo que es compatible con una mayor variedad de estándares (IEEE1149.1, IEEE1149.7, SWD) en un único pod. Todas las sondas de (...)

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Sonda de depuración

TSK-3P-BLUEBOX — TASKING BlueBox hardware debugger

TASKING’s Debug, Trace, and Test tools offer comprehensive solutions for efficient debugging, tracing, and testing of TI's embedded systems. The scalable TASKING BlueBox debuggers allow users to easily flash, debug, and test across TI's portfolio. Development on TI hardware is made even easier with (...)

Desde: TASKING Germany GmbH
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Kit de desarrollo de software (SDK)

SIMPLELINK-LOWPOWER-F3-SDK — SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices

Los kits de desarrollo de software (SDK) de baja potencia de SimpleLink™ son compatibles con la familia de productos CC13xx, CC23xx, CC26xx y CC27xx. Juntos, estos SDK proporcionan paquetes de programas completos para el desarrollo de aplicaciones Sub-1 GHz y 2.4 GHz que incluyen compatibilidad con (...)

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IDE, configuración, compilador o depurador

CCSTUDIO-OPENOCD — OpenOCD Binary Releases

Pre-built binaries for the popular open-source OpenOCD debug stack.
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IDE, configuración, compilador o depurador

SYSCONFIG — Standalone desktop version of SysConfig

CCStudio™ SysConfig is part of TI's extensive CCStudio™ development ecosystem and is a configuration tool that simplifies hardware and software configuration challenges to accelerate software development.

SysConfig provides an intuitive graphical user interface for configuring pins, peripherals, (...)

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TSK-3P-VX-TOOLSET — VX-TOOLSET de TASKING para Arm

VX-TOOLSET para Arm es una cadena de herramientas de compilación certificada para el desarrollo de software integrado de seguridad crítica en dispositivos seleccionados con núcleos Cortex-M y Cortex-R. Gracias a la integración con Eclipse IDE, la compatibilidad avanzada con multinúcleo y el (...)

Desde: TASKING Germany GmbH
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Soporte de software

SMARTRF-STUDIO-8 — SmartRF Studio 8 application software for CC23xx and CC27xx devices, and CC140xP transceivers

SmartRF™ Studio es una aplicación para Windows que ayuda a los diseñadores de sistemas de RF a evaluar fácilmente la radio en una etapa temprana del proceso de diseño para todos los dispositivos de RF de baja potencia CC1xxx y CC2xxx de TI. Simplifica la generación de los valores y comandos del (...)

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Herramienta de cálculo

BT-POWER-CALC — Bluetooth Power Calculator for CC13xx, CC26xx, CC23xx, and CC27xx devices

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Certificación

CC27XX-REPORTS — LP-EM-CC27XX CE & FCC Certification Reports & DOC for Reference-only

This page provides access to the CC27XX certification reports for the CC27XX EVMs. EVM certification reports are provided for reference only. When using a chip down design, the customer is responsible for their own certification.
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Herramienta de diseño

SIMPLELINK-2-4GHZ-DESIGN-REVIEW — Hardware Design Review Request Form for SimpleLink™ CC2xxx Devices

El proceso de revisión del diseño de hardware de SimpleLink le ofrece la posibilidad de ponerse en contacto, de forma personalizada, con un experto en la materia que puede ayudarlo a revisar su diseño y proporcionarle valiosos comentarios. Aquí encontrará un sencillo proceso de 3 pasos para (...)

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Encapsulado Pines Símbolos CAD, huellas y modelos 3D
VQFN (RHA) 40 Ultra Librarian
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Soporte y capacitación

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