The DDC3512 is a 24-bit,
512-channel, current-input analog-to-digital (A/D) converter. The
device combines both, current-to-voltage conversion by current
integration, and A/D conversion. The device is a stacked-die version
of DDC3256, with one die of the latter sitting on top of the
other.
Up to 512 individual low-level current output
devices, such as photodiodes, can be directly connected to the
inputs and digitized in parallel (simultaneously).
For each of the 512 inputs, the device has one low
noise and low power integrator designed to capture all the charge
from the sensor. The integration time is adjustable from 50µs to
1.6ms, allowing currents in the order of fA to µA to be continuously
measured with outstanding precision. The outputs of the integrators
are digitized by on-chip low power ADCs and the converted digital
codes are transmitted over a single LVDS pair designed to minimize
noise coupling in environments with high channel count.
The DDC3512 operates from single
1.85V supply. The device is specified from 0°C to 70°C operating
temperature and available in a 13.2 × 17.2mm2 656-ball
0.8mm row-pitch and 0.4mm column-pitch BGA. The on-chip reference
buffer and bypass capacitors (on the BGA) help minimize the external
component requirements and further reduce board space.
The DDC3512 is a 24-bit,
512-channel, current-input analog-to-digital (A/D) converter. The
device combines both, current-to-voltage conversion by current
integration, and A/D conversion. The device is a stacked-die version
of DDC3256, with one die of the latter sitting on top of the
other.
Up to 512 individual low-level current output
devices, such as photodiodes, can be directly connected to the
inputs and digitized in parallel (simultaneously).
For each of the 512 inputs, the device has one low
noise and low power integrator designed to capture all the charge
from the sensor. The integration time is adjustable from 50µs to
1.6ms, allowing currents in the order of fA to µA to be continuously
measured with outstanding precision. The outputs of the integrators
are digitized by on-chip low power ADCs and the converted digital
codes are transmitted over a single LVDS pair designed to minimize
noise coupling in environments with high channel count.
The DDC3512 operates from single
1.85V supply. The device is specified from 0°C to 70°C operating
temperature and available in a 13.2 × 17.2mm2 656-ball
0.8mm row-pitch and 0.4mm column-pitch BGA. The on-chip reference
buffer and bypass capacitors (on the BGA) help minimize the external
component requirements and further reduce board space.