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TPSM63610E

ACTIVO

Módulo de alimentación de alta densidad, entrada de 36 V, salida de 1 V a 20 V y 8 A

Detalles del producto

Iout (max) (A) 8 Vin (max) (V) 36 Vin (min) (V) 3 Vout (max) (V) 20 Vout (min) (V) 1 Rating Catalog Operating temperature range (°C) -55 to 125 Topology Synchronous Buck Features EMI Tested, Enable, Frequency synchronization, Light Load Efficiency, Overcurrent protection, Power good, Spread Spectrum Control mode Peak-Current Switching frequency (max) (Hz) 2200000 Switching frequency (min) (Hz) 200000
Iout (max) (A) 8 Vin (max) (V) 36 Vin (min) (V) 3 Vout (max) (V) 20 Vout (min) (V) 1 Rating Catalog Operating temperature range (°C) -55 to 125 Topology Synchronous Buck Features EMI Tested, Enable, Frequency synchronization, Light Load Efficiency, Overcurrent protection, Power good, Spread Spectrum Control mode Peak-Current Switching frequency (max) (Hz) 2200000 Switching frequency (min) (Hz) 200000
B3QFN (RDF) 22 48.75 mm² 7.5 x 6.5
  • Functional Safety-Capable
  • Versatile 36-V IN, 8-A OUT synchronous buck module
    • Integrated MOSFETs, inductor, and controller
    • Adjustable output voltage from 1 V to 20 V
    • 6.5-mm × 7.5-mm × 4-mm overmolded package
    • –55°C to 125°C junction temperature range
    • Frequency adjustable from 200 kHz to 2.2 MHz
    • Negative output voltage capability
  • Ultra-high efficiency across the full load range
    • Peak efficiency of 95%+
    • External bias option for improved efficiency
    • Exposed pad for low thermal impedance. EVM θ JA = 18.2 °C/W.
    • Shutdown quiescent current of 0.6 µA (typical)
  • Ultra-low conducted and radiated EMI signatures
    • Low-noise package with dual input paths and integrated capacitors reduces switch ringing
    • Resistor-adjustable switch-node slew rate
    • Meets CISPR 11 and 32 Class B emissions
  • Designed for scalable power supplies
    • Pin compatible with the TPSM63608 (36 V, 6 A)
  • Inherent protection features for robust design
    • Precision enable input and open-drain PGOOD indicator for sequencing, control, and V IN UVLO
    • Overcurrent and thermal shutdown protections
  • Create a custom design using the TPSM63610E with the WEBENCH Power Designer
  • Functional Safety-Capable
  • Versatile 36-V IN, 8-A OUT synchronous buck module
    • Integrated MOSFETs, inductor, and controller
    • Adjustable output voltage from 1 V to 20 V
    • 6.5-mm × 7.5-mm × 4-mm overmolded package
    • –55°C to 125°C junction temperature range
    • Frequency adjustable from 200 kHz to 2.2 MHz
    • Negative output voltage capability
  • Ultra-high efficiency across the full load range
    • Peak efficiency of 95%+
    • External bias option for improved efficiency
    • Exposed pad for low thermal impedance. EVM θ JA = 18.2 °C/W.
    • Shutdown quiescent current of 0.6 µA (typical)
  • Ultra-low conducted and radiated EMI signatures
    • Low-noise package with dual input paths and integrated capacitors reduces switch ringing
    • Resistor-adjustable switch-node slew rate
    • Meets CISPR 11 and 32 Class B emissions
  • Designed for scalable power supplies
    • Pin compatible with the TPSM63608 (36 V, 6 A)
  • Inherent protection features for robust design
    • Precision enable input and open-drain PGOOD indicator for sequencing, control, and V IN UVLO
    • Overcurrent and thermal shutdown protections
  • Create a custom design using the TPSM63610E with the WEBENCH Power Designer

Deriving from a family of synchronous buck modules, the TPSM63610E is a highly integrated 36-V, 8-A DC/DC solution that combines power MOSFETs, a shielded inductor, and passives in an enhanced HotRod™ QFN package. The module has VIN and VOUT pins located at the corners of the package for optimized input and output capacitor placement. Four larger thermal pads beneath the module enable a simple layout and easy handling in manufacturing.

With an output voltage from 1 V to 20 V, the TPSM63610E is designed to quickly and easily implement a low-EMI design in a small PCB footprint. The total solution requires as few as four external components and eliminates the magnetics and compensation part selection from the design process.

Although designed for small size and simplicity in space-constrained applications, the TPSM63610E module offers many features for robust performance: precision enable with hysteresis for adjustable input-voltage UVLO, resistor-programmable switch node slew rate and spread spectrum for improved EMI. Along with integrated VCC, bootstrap and input capacitors for increased reliability and higher density. The module can be configured for constant switching frequency over the full load current range (FPWM), or variable frequency (PFM) for higher light load efficiency. Including a PGOOD indicator for sequencing, fault protection, and output voltage monitoring.

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Deriving from a family of synchronous buck modules, the TPSM63610E is a highly integrated 36-V, 8-A DC/DC solution that combines power MOSFETs, a shielded inductor, and passives in an enhanced HotRod™ QFN package. The module has VIN and VOUT pins located at the corners of the package for optimized input and output capacitor placement. Four larger thermal pads beneath the module enable a simple layout and easy handling in manufacturing.

With an output voltage from 1 V to 20 V, the TPSM63610E is designed to quickly and easily implement a low-EMI design in a small PCB footprint. The total solution requires as few as four external components and eliminates the magnetics and compensation part selection from the design process.

Although designed for small size and simplicity in space-constrained applications, the TPSM63610E module offers many features for robust performance: precision enable with hysteresis for adjustable input-voltage UVLO, resistor-programmable switch node slew rate and spread spectrum for improved EMI. Along with integrated VCC, bootstrap and input capacitors for increased reliability and higher density. The module can be configured for constant switching frequency over the full load current range (FPWM), or variable frequency (PFM) for higher light load efficiency. Including a PGOOD indicator for sequencing, fault protection, and output voltage monitoring.

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Documentación técnica

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Tipo Título Fecha
* Data sheet TPSM63610EHigh-Density, 3-V to 36-V Input,1-V to 20-V Output,8-A (10-A Peak)Buck Power Module with Extended Temperature Range and Enhanced HotRod™ QFN Package datasheet (Rev. A) PDF | HTML 01 nov 2023
Functional safety information TPSM63608 and TPSM63610/E Functional Safety FIT Rate, FMD and Pin FMA PDF | HTML 12 oct 2022

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

TPSM63610EVM — Placa de evaluación TPSM63610 para módulo de alimentación reductor de 36 V de entrada, 1 V a 20 V, 8

Este módulo de evaluación (EVM) permite evaluar fácilmente el módulo de alimentación TPSM63610 a través del uso de puentes y puntos de prueba para configurar y probar las características del dispositivo sobre la marcha. Además de evaluar el rendimiento eléctrico del dispositivo, este EVM sirve (...)
Guía del usuario: PDF | HTML
Herramienta de cálculo

TPSM63610-DESIGN-CALC TPSM63610 power module quickstart design tool

The TPSM6310 quick-start calculator is a standalone tool that facilitates and assists the power-supply engineer with the design of a DC/DC buck regulator based on a family of synchronous buck power modules, including TPSM6310, TPSM63610E and TPSM63608. The user can quickly arrive at an optimized (...)

Productos y hardware compatibles

Productos y hardware compatibles

Productos
Power modules (integrated inductor)
TPSM63608 Módulo de alimentación de alta densidad de 36 V de entrada, 1 V a 20 V de salida y 6 A en QFN HotRod TPSM63610 Módulo de alimentación de 8 A de alta densidad, entrada de 36 V, salida de 1 V a 20 V, QFN HotRod™ m TPSM63610E Módulo de alimentación de alta densidad, entrada de 36 V, salida de 1 V a 20 V y 8 A
Paquete Pasadores Descargar
B3QFN (RDF) 22 Ver opciones

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

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