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Lógica y traducción de voltaje
Traductores de tensión y desplazadores de nivel
Conversión de tensión

TXS0104E-Q1

ACTIVO

Traductor bidireccional de nivel de tensión de 4 bits para aplicaciones de drenaje abierto automo

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TXS0104E-Q1

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Detalles del producto

Bits (#) 4 Data rate (max) (Mbps) 24 Topology Open drain, Push-Pull Direction control (typ) Auto-direction Vin (min) (V) 1.65 Vin (max) (V) 3.6 Vout (min) (V) 2.3 Vout (max) (V) 5.5 Applications GPIO, I2C, JTAG, MDIO, SDIO, SMBus, SPI, UART Features Edge rate accelerator, Output enable Prop delay (ns) 124 Technology family TXS Supply current (max) (mA) 0.025 Rating Automotive Operating temperature range (°C) -40 to 125
Bits (#) 4 Data rate (max) (Mbps) 24 Topology Open drain, Push-Pull Direction control (typ) Auto-direction Vin (min) (V) 1.65 Vin (max) (V) 3.6 Vout (min) (V) 2.3 Vout (max) (V) 5.5 Applications GPIO, I2C, JTAG, MDIO, SDIO, SMBus, SPI, UART Features Edge rate accelerator, Output enable Prop delay (ns) 124 Technology family TXS Supply current (max) (mA) 0.025 Rating Automotive Operating temperature range (°C) -40 to 125
WQFN (BQA) 14 7.5 mm² (3 mm × 2.5 mm) UQFN (RUT) 12 3.4 mm² (2 mm × 1.7 mm) TSSOP (PW) 14 32 mm² (5 mm × 6.4 mm)
  • Qualified for automotive applications
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 1: –40°C to +125°C ambient operating temperature range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C6
  • No direction-control signal required
  • Maximum data rates:
    • 24 Mbps maximum (push pull)
    • 2 Mbps (open drain)
  • 1.65 V to 3.6 V on A port and 2.3 V to 5.5 V on B port (VCCA  ≤ VCCB)
  • No power-supply sequencing required—VCCA or VCCB can be ramped first
  • ESD protection exceeds JESD 22:
    • A Port
      • 2000-V Human-Body Model (A114-B)
      • 1000-V Charged-Device Model (C101)
    • B Port
      • 15-kV Human-Body Model (A114-B)
      • 1000-V Charged-Device Model (C101)
  • IEC 61000-4-2 ESD (B port)
    • ±8-kV Contact Discharge
    • ±10-kV Air-Gap Discharge
  • Qualified for automotive applications
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 1: –40°C to +125°C ambient operating temperature range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C6
  • No direction-control signal required
  • Maximum data rates:
    • 24 Mbps maximum (push pull)
    • 2 Mbps (open drain)
  • 1.65 V to 3.6 V on A port and 2.3 V to 5.5 V on B port (VCCA  ≤ VCCB)
  • No power-supply sequencing required—VCCA or VCCB can be ramped first
  • ESD protection exceeds JESD 22:
    • A Port
      • 2000-V Human-Body Model (A114-B)
      • 1000-V Charged-Device Model (C101)
    • B Port
      • 15-kV Human-Body Model (A114-B)
      • 1000-V Charged-Device Model (C101)
  • IEC 61000-4-2 ESD (B port)
    • ±8-kV Contact Discharge
    • ±10-kV Air-Gap Discharge

The TXS0104E-Q1 device connects an incompatible logic communication from chip-to-chip due to voltage mismatch. This auto-direction translator can be conveniently used to bridge the gap without the need of direction control from the host. Each channel can be mixed and matched with different output types (open-drain or push-pull) and mixed data flows (transmit or receive) without intervention from the host. This 4-bit noninverting translator uses two separate configurable power-supply rails. The A and B ports are designed to track VCCA and VCCB respectively. The VCCB pin accepts any supply voltage from 2.3 V to 5.5 V while the VCCA pin accepts any supply voltage from 1.65 V to 3.6 V such that VCCA is less than or equal to VCCB. This tracking allows for low-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.

When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.

The TXS0104E-Q1 device is designed so that the OE input circuit is supplied by VCCA.

To be in the high-impedance state during power up or power down, the OE pin must be tied to the GND pin through a pull down resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

The TXS0104E-Q1 device connects an incompatible logic communication from chip-to-chip due to voltage mismatch. This auto-direction translator can be conveniently used to bridge the gap without the need of direction control from the host. Each channel can be mixed and matched with different output types (open-drain or push-pull) and mixed data flows (transmit or receive) without intervention from the host. This 4-bit noninverting translator uses two separate configurable power-supply rails. The A and B ports are designed to track VCCA and VCCB respectively. The VCCB pin accepts any supply voltage from 2.3 V to 5.5 V while the VCCA pin accepts any supply voltage from 1.65 V to 3.6 V such that VCCA is less than or equal to VCCB. This tracking allows for low-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.

When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.

The TXS0104E-Q1 device is designed so that the OE input circuit is supplied by VCCA.

To be in the high-impedance state during power up or power down, the OE pin must be tied to the GND pin through a pull down resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Descargar la versión más reciente en inglés Fecha
* Hoja de datos TXS0104E-Q1 Automotive 4-Bit Bidirectional Voltage-Level Translator for Open-Dra datasheet (Rev. F) PDF | HTML 22/10/2024
Nota sobre la aplicación Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators PDF | HTML 12/07/2024
Nota sobre la aplicación Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 3/07/2024
Nota sobre la aplicación Leveraging Edge Rate Accelerators with Auto-Sensing Level Shifters PDF | HTML 29/09/2023
Application brief Future-Proofing Your Level Shifter Design with TI's Dual Footprint Packages PDF | HTML 5/09/2023
Nota sobre la aplicación Do’s and Don’ts for TXB and TXS Voltage Level-Shifters with Edge Rate Accelerato PDF | HTML 28/06/2023
Guía de selección Voltage Translation Buying Guide (Rev. A) 15/04/2021
Más documentación Automotive Logic Devices Brochure 27/08/2014

Diseño y desarrollo

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Encapsulado Pines Símbolos CAD, huellas y modelos 3D
WQFN (BQA) 14 Ultra Librarian
UQFN (RUT) 12 Ultra Librarian
TSSOP (PW) 14 Ultra Librarian
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