제품 상세 정보

CPU Arm® Cortex®-M0+ Technology Bluetooth low energy, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Proprietary 2.4 GHz, Zigbee, Zigbee 3.0 Flash memory (kByte) 512 RAM (kByte) 64 Peripherals 1 SPI, 1 UART, 1 comparator, 12-bit ADC 8-channel, 4 timers, I2C, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC) Features OAD Number of GPIOs 12 Security Cryptographic acceleration Cryptographic accelerators AES, RNG Operating system FreeRTOS, Zephyr RTOS Type Wireless module Sensitivity (best) (dBm) -101 Operating temperature range (°C) -40 to 85 TX power (max) (dBm) 8
CPU Arm® Cortex®-M0+ Technology Bluetooth low energy, Proprietary 2.4 GHz, Thread, Zigbee Protocols Bluetooth® Low Energy, Proprietary 2.4 GHz, Zigbee, Zigbee 3.0 Flash memory (kByte) 512 RAM (kByte) 64 Peripherals 1 SPI, 1 UART, 1 comparator, 12-bit ADC 8-channel, 4 timers, I2C, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC) Features OAD Number of GPIOs 12 Security Cryptographic acceleration Cryptographic accelerators AES, RNG Operating system FreeRTOS, Zephyr RTOS Type Wireless module Sensitivity (best) (dBm) -101 Operating temperature range (°C) -40 to 85 TX power (max) (dBm) 8
QFM (MHA) 24 70 mm² 10 x 7

Certified wireless module

  • Optimized 48MHz Arm Cortex-M0+ processor
  • 512KB of in-system programmable flash
  • 12KB of ROM for bootloader and drivers
  • 64KB of ultra-low leakage SRAM. Full RAM retention in standby mode
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy
  • Built on the CC2340R53 WCSP package
  • Integrated antenna
  • Optional external antenna
  • Supports over-the-air upgrade (OTA)
  • Serial wire debug (SWD)

Low power consumption

  • MCU consumption:
    • 2.6mA active mode, CoreMark
    • 53µA/MHz running CoreMark
    • 710nA standby mode
    • 165nA shutdown mode, wake-up on pin
  • Radio consumption:
    • 5.5mA RX
    • 5.1mA TX at 0dBm
    • < 11.0mA TX at +8dBm

Wireless protocol support

  • Bluetooth® LE(1)
    • Features: LE 2M, LE Coded, Periodic Advertising, Extended Advertising, LE Secure Connections
    • Qualified against Bluetooth Core 5.4

High-performance radio

  • -102dBm sensitivity for Bluetooth® Low Energy 125kbps
  • -96.5dBm sensitivity for Bluetooth® Low Energy 1Mbps
  • Output power up to +8dBm with temperature compensation

Regulatory compliance

  • Designed for systems targeting compliance with these standards:
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15
    • ARIB STD-T66 (Japan)
    • ISED (Canada)
    • NCC (Taiwan)
    • KCC (Korea)
  • Up to 12 I/O pads
    • 2 IO pads SWD, muxed with GPIOs
    • 2 IO pads LFXT, muxed with GPIOs
    • Up to 12 DIOs (analog or digital IOs)
  • 3 × 16-bit and 1× 24-bit general-purpose timers, quadrature decode mode support
  • 12-bit ADC, 267ksps with internal reference, 4 external ADC inputs
  • 1× low power comparator
  • 1× UART
  • 1× SPI
  • 1× I2C
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor
  • Watchdog timer

Security enablers

  • AES 128-bit cryptographic accelerator
  • Random number generator from on-chip analog noise

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.71V to 3.8V single supply voltage
  • Tj: –40°C up to +85°C

RoHS-compliant package

  • 7mm x 10mm 24 pin MHA Package

(1)Module is pre-certified for Bluetooth LE only

Certified wireless module

  • Optimized 48MHz Arm Cortex-M0+ processor
  • 512KB of in-system programmable flash
  • 12KB of ROM for bootloader and drivers
  • 64KB of ultra-low leakage SRAM. Full RAM retention in standby mode
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy
  • Built on the CC2340R53 WCSP package
  • Integrated antenna
  • Optional external antenna
  • Supports over-the-air upgrade (OTA)
  • Serial wire debug (SWD)

Low power consumption

  • MCU consumption:
    • 2.6mA active mode, CoreMark
    • 53µA/MHz running CoreMark
    • 710nA standby mode
    • 165nA shutdown mode, wake-up on pin
  • Radio consumption:
    • 5.5mA RX
    • 5.1mA TX at 0dBm
    • < 11.0mA TX at +8dBm

Wireless protocol support

  • Bluetooth® LE(1)
    • Features: LE 2M, LE Coded, Periodic Advertising, Extended Advertising, LE Secure Connections
    • Qualified against Bluetooth Core 5.4

High-performance radio

  • -102dBm sensitivity for Bluetooth® Low Energy 125kbps
  • -96.5dBm sensitivity for Bluetooth® Low Energy 1Mbps
  • Output power up to +8dBm with temperature compensation

Regulatory compliance

  • Designed for systems targeting compliance with these standards:
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15
    • ARIB STD-T66 (Japan)
    • ISED (Canada)
    • NCC (Taiwan)
    • KCC (Korea)
  • Up to 12 I/O pads
    • 2 IO pads SWD, muxed with GPIOs
    • 2 IO pads LFXT, muxed with GPIOs
    • Up to 12 DIOs (analog or digital IOs)
  • 3 × 16-bit and 1× 24-bit general-purpose timers, quadrature decode mode support
  • 12-bit ADC, 267ksps with internal reference, 4 external ADC inputs
  • 1× low power comparator
  • 1× UART
  • 1× SPI
  • 1× I2C
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor
  • Watchdog timer

Security enablers

  • AES 128-bit cryptographic accelerator
  • Random number generator from on-chip analog noise

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.71V to 3.8V single supply voltage
  • Tj: –40°C up to +85°C

RoHS-compliant package

  • 7mm x 10mm 24 pin MHA Package

(1)Module is pre-certified for Bluetooth LE only

The CC2340R5MODA SimpleLink™ of devices are 2.4GHz wireless microcontrollers (MCUs), targeting Bluetooth® Low Energy. These devices are optimized for low-power wireless communication with Over the Air Download (OAD) support in Building automation (wireless sensors, lighting control, beacons), asset tracking, medical, and Personal electronics (toys) markets. Highlighted features of this device include:

  • The CC2340R5MODA is a 7mm x 10mm certified wireless module 2.4GHz with integrated antenna, DCDC components and high-frequency crystal oscillator.
  • Support for Bluetooth 5 features: high-speed mode (2Mbps PHY), long-range (LE Coded 125kbps and 500kbps PHYs), privacy 1.2.1 and channel selection algorithm #2, as well as backward compatibility and support for key features from the Bluetooth 4.2 and earlier Low Energy specifications.
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 software development kit (SDK)
  • Ultra-low standby current less than 0.71µA with RTC operational and full RAM retention that enables significant battery life extension, especially for applications with longer sleep intervals.
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy (–102dBm for 125kbps LE Coded PHY)

The CC2340R5MODA family is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single-core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit the SimpleLink™ MCU platform.

The CC2340R5MODA SimpleLink™ of devices are 2.4GHz wireless microcontrollers (MCUs), targeting Bluetooth® Low Energy. These devices are optimized for low-power wireless communication with Over the Air Download (OAD) support in Building automation (wireless sensors, lighting control, beacons), asset tracking, medical, and Personal electronics (toys) markets. Highlighted features of this device include:

  • The CC2340R5MODA is a 7mm x 10mm certified wireless module 2.4GHz with integrated antenna, DCDC components and high-frequency crystal oscillator.
  • Support for Bluetooth 5 features: high-speed mode (2Mbps PHY), long-range (LE Coded 125kbps and 500kbps PHYs), privacy 1.2.1 and channel selection algorithm #2, as well as backward compatibility and support for key features from the Bluetooth 4.2 and earlier Low Energy specifications.
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 software development kit (SDK)
  • Ultra-low standby current less than 0.71µA with RTC operational and full RAM retention that enables significant battery life extension, especially for applications with longer sleep intervals.
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy (–102dBm for 125kbps LE Coded PHY)

The CC2340R5MODA family is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single-core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit the SimpleLink™ MCU platform.

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기술 자료

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상위 문서 유형 직함 형식 옵션 날짜
* Data sheet SimpleLink™ 32-bit Arm® Cortex®-M0+ Bluetooth® Low Energy wireless module with integrated antenna datasheet PDF | HTML 2026/06/16

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

LP-EM-CC2340R53 — 2.4GHz 다중 표준 무선 MCU의 CC2340R SimpleLink™ 제품군용 LaunchPad™ 개발 키트

CC2340R53을 지원하는 이 LaunchPad™ 개발 키트는 Bluetooth® 저에너지, Thread, Zigbee® 및 2.4GHz 독점 프로토콜을 지원하는 2.4GHz 무선 MCU의 CC2340R SimpleLink™ 제품군을 사용하여 개발 속도를 높이는 데 사용됩니다. 소프트웨어 지원은 호환되는 SimpleLink™ 소프트웨어 개발 키트에서 제공합니다. 이 키트는 분할 LaunchPad™ 개발 키트이며, 따라서 XDS 디버거가 포함되어 있지 않습니다. 권장 디버거는 LP-XDS110 or LP-XDS110ET입니다.
사용 설명서: PDF | HTML
TI.com에서 구매할 수 없음
디버그 프로브

TMDSEMU110-U — XDS110 JTAG 디버그 프로브

텍사스 인스트루먼트 XDS110은 TI 임베디드 프로세서를 위한 새로운 디버그 프로브(에뮬레이터)입니다. XDS110은 XDS100 제품군을 대체하면서 하나의 포드로 더 다양한 표준(IEEE1149.1, IEEE1149.7, SWD)을지원합니다. 또한 모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)가 포함되어 있는 모든 Arm® 및 DSP 프로세서에서 코어(Core) 및 시스템 트레이스(System Trace)를 지원합니다.  핀을 통한 코어 추적의 경우 XDS560v2 PRO TRACE가 필요합니다.

(...)
사용 설명서: PDF
Download English Version: PDF
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개발 키트

LP-XDS110 — XDS110 LaunchPad™ 개발 키트 디버거

LP-XDS110 LaunchPad 개발 키트 디버거는 텍사스 인스트루먼트(TI) 마이크로컨트롤러, 마이크로프로세서 및 DSP XDS 호환 장치의 프로그래밍 및 디버깅용 도구입니다. LP-XDS110은 20핀 엣지 커넥터를 통해 분할 LaunchPad에 직접 연결하도록 설계된 제품이지만, XDS110 출력 커넥터를 사용해 다른 LaunchPad 및 XDS 호환 장치 디버깅에도 사용할 수 있습니다.

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개발 키트

LP-XDS110ET — XDS110ET LaunchPad™ 개발 키트 디버거(EnergyTrace™ 소프트웨어 포함)

LP-XDS110ET LaunchPad 개발 키트 디버거는 텍사스 인스트루먼트(TI) 마이크로컨트롤러, 마이크로프로세서 및 DSP XDS 호환 장치의 프로그래밍 및 디버깅용 도구입니다. LP-XDS110ET는 20핀 엣지 커넥터를 통해 분할 LaunchPad 개발 키트에 직접 연결하도록 설계된 제품이지만, XDS110 출력 커넥터를 사용해 다른 LaunchPad 개발 키트 및 XDS 호환 장치 디버깅에도 사용할 수 있습니다. LP-XDS110ET는 EnergyTrace™ 소프트웨어를 지원하기 위해 전력 측정용 회로를 추가했습니다.

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소프트웨어 개발 키트(SDK)

SIMPLELINK-LOWPOWER-F3-SDK SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx, CC26xx and CC27xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, (...)

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지원되는 제품 및 하드웨어

찾아보기 다운로드 옵션
소프트웨어 개발 키트(SDK)

SIMPLELINK-LOWPOWER-ZEPHYR-SDK Zephyr® Platform support for the SimpleLink™ Low Power family of devices

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx, CC26xx and CC27xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

소프트웨어 개발 키트(SDK)

SIMPLELINK-TI-OPENTHREAD-SDK SimpleLink™ family of devices OpenThread software

The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx, CC26xx and CC27xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

시작하기

TI-DEVELOPER-ZONE Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

IDE, 구성, 컴파일러 또는 디버거

CCSTUDIO Code Composer Studio integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

시작 다운로드 옵션
IDE, 구성, 컴파일러 또는 디버거

CCSTUDIO-OPENOCD OpenOCD Binary Releases

Pre-built binaries for the popular open-source OpenOCD debug stack.
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GitHub에서 보기 다운로드 옵션
IDE, 구성, 컴파일러 또는 디버거

SYSCONFIG Standalone desktop version of SysConfig

CCStudio™ SysConfig is part of TI's extensive CCStudio™ development ecosystem and is a configuration tool that simplifies hardware and software configuration challenges to accelerate software development.

SysConfig provides an intuitive graphical user interface for configuring pins, peripherals, (...)

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지원되는 제품 및 하드웨어

시작 다운로드 옵션
온라인 교육

SIMPLELINK-ACADEMY-CC23XX Simplelink™ CC23xx Academy

SimpleLink™ Academy is an interactive learning experience for TI's wireless protocols. Our hands-on training modules cover all phases of development for LaunchPad™ development kits alongside software development kits (SDKs) in the SimpleLink MCU family.
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

설계 툴

SIMPLELINK-2-4GHZ-DESIGN-REVIEW Hardware Design Review Request Form for SimpleLink™ CC2xxx Devices

The SimpleLink hardware design review process provides a way to get in touch, one-on-one, with a subject matter expert that can help review your design and provide valuable feedback. A simple three-step process for requesting a review as well as links to relevant technical documentation and (...)

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패키지 CAD 기호, 풋프린트 및 3D 모델
QFM (MHA) 24 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

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품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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