CSD95373BQ5M
- 45-A Continuous Operating Current Capability
- 92.7% System Efficiency at 25 A
- Low-Power Loss of 2.6 W at 25 A
- High-Frequency Operation (up to 1.25 MHz)
- Diode Emulation Mode With FCCM
- Temperature Compensated Bi-Directional Current Sense
- Analog Temperature Output (600 mV at 0°C)
- Fault Monitoring
- High-Side Short, Overcurrent, and Overtemperature Protection
- 3.3-V and 5-V PWM Signal Compatible
- Tri-State PWM Input
- Integrated Bootstrap Diode
- Optimized Dead Time for Shoot-Through Protection
- High-Density SON 5-mm × 6-mm Footprint
- Ultra-Low-Inductance Package
- System Optimized PCB Footprint
- RoHS Compliant – Lead-Free Terminal Plating
- Halogen Free
The CSD95373BQ5M NexFET™ smart power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.
관심 가지실만한 유사 제품
다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
기술 문서
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모두 보기1 | 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | CSD95373BQ5M Synchronous Buck NexFET Smart Power Stage datasheet (Rev. A) | PDF | HTML | 2017/07/12 |
설계 및 개발
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레퍼런스 디자인
PMP10393 — PMBus 인터페이스를 지원하는 고밀도 600mV 200A 5-6상 DC-DC 벅 컨버터 레퍼런스 디자인
Advanced DCAP+ control is used to provide the high speed dynamic control needed for CPU, Memory and ASIC applications. Up to six high current synchronous power stages provide the high currents and low losses needed for these applications. Multi-phase also allows output ripple cancellation and (...)
| 패키지 | 핀 | 다운로드 |
|---|---|---|
| LSON-CLIP (DQP) | 12 | 옵션 보기 |
주문 및 품질
포함된 정보:
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
포함된 정보:
- 팹 위치
- 조립 위치