CSDM65295T
- Topside-cooled 9 mm x 10 mm x 5 mm LGA package, industry common footprint
- Integrated inductor
- High output current capability:
- Peak current: 180A
- Continuous current: 130A RMS
- (Subject to thermal boundary condition)
- Operating VIN input voltage: 4.5V to 16V
- Operating VDD Bias: 4.5V to 5.5V
- High-frequency operation (up to 2MHz)
- Integrated clamping circuitry for avalanche free operation
- Temperature compensated bi-directional current sense with current mode reporting (5µA/A)
- Body braking mode (BB)
- Forced continuous conduction mode (FCCM) operation
- Green, RoHS compliant without exemption, and completely Pb free
- Fault detection
- High-side short (HSS)
- Fault protection
- Over temperature (OT)
- Cycle-by-cycle negative over current limiting (NOC)
- Over current protection (OCP)
- BOOT UVLO
The CSDM65295x family of devices are 2-phase smart power stage modules with high peak current capability. The device family is highly optimized design for use in high-power, high-density synchronous buck converter applications. This product family integrates the driver IC and power MOSFETs into one Pb-free monolithic design to complete the power stage switching function. There are VIN and VDD bypass capacitors integrated into the package for minimum loop inductance and improved ringing.
This combination produces high-current, high-efficiency, and high-speed switching capability in a small industry standard 9mm × 10mm × 5 mm footprint.
CSDM65295x integrates accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. This power stage module also includes cycle-by-cycle current limiting, over temperature and short circuit protection, and is designed to be compatible with TPS537xx series controllers.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | CSDM65295x Dual-Phase Buck Smart Power Stage Module datasheet | PDF | HTML | 2026/02/02 |
설계 및 개발
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| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| QFN-FCMOD (VCQ) | 72 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.