홈 로직 및 전압 변환 플립플롭, 래치 및 레지스터 D형 플립플롭
홈
로직 및 전압 변환
플립플롭, 래치 및 레지스터
D형 플립플롭

SN54ABT273

활성

클리어를 지원하는 8진 에지 트리거 D형 플립플롭

지금 주문
데이터 시트

SN54ABT273

활성
데이터 시트 지금 주문

제품 상세 정보

Number of channels 8 Technology family ABT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type Push-Pull Clock frequency (max) (MHz) 150 IOL (max) (mA) 48 IOH (max) (mA) -24 Supply current (max) (µA) 30000 Features Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -55 to 125 Rating Military
Number of channels 8 Technology family ABT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type Push-Pull Clock frequency (max) (MHz) 150 IOL (max) (mA) 48 IOH (max) (mA) -24 Supply current (max) (µA) 30000 Features Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -55 to 125 Rating Military
CDIP (J) 20 167.464 mm² 24.2 x 6.92 CFP (W) 20 90.5828 mm² 13.09 x 6.92 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • State-of-the-Art EPIC-IIBTM BiCMOS Design Significantly Reduces Power Dissipation
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
  • High-Drive Outputs (-32-mA IOH, 64-mA IOL)
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package

 

EPIC-IIB is a trademark of Texas Instruments Incorporated.
  • State-of-the-Art EPIC-IIBTM BiCMOS Design Significantly Reduces Power Dissipation
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
  • High-Drive Outputs (-32-mA IOH, 64-mA IOL)
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package

 

EPIC-IIB is a trademark of Texas Instruments Incorporated.

The 'ABT273 are 8-bit positive-edge-triggered D-type flip-flops with a direct clear () input. They are particularly suitable for implementing buffer and storage registers, shift registers, and pattern generators.

Information at the data (D) inputs meeting the setup time requirements is transferred to the Q outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a particular voltage level and is not directly related to the transition time of the positive-going pulse. When the clock (CLK) input is at either the high or low level, the D input signal has no effect at the output.

The SN54ABT273 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT273 is characterized for operation from -40°C to 85°C.

 

 

The 'ABT273 are 8-bit positive-edge-triggered D-type flip-flops with a direct clear () input. They are particularly suitable for implementing buffer and storage registers, shift registers, and pattern generators.

Information at the data (D) inputs meeting the setup time requirements is transferred to the Q outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a particular voltage level and is not directly related to the transition time of the positive-going pulse. When the clock (CLK) input is at either the high or low level, the D input signal has no effect at the output.

The SN54ABT273 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT273 is characterized for operation from -40°C to 85°C.

 

 
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기술 자료

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22개 모두 보기
유형 직함 날짜
* Data sheet Octal Edge-Triggered D-Type Flip-Flops With Clear datasheet (Rev. B) 1997/01/01
* SMD SN54ABT273 SMD 5962-93217 2016/06/21
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022/12/15
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note Selecting the Right Level Translation Solution (Rev. A) 2004/06/22
Application note Quad Flatpack No-Lead Logic Packages (Rev. D) 2004/02/16
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002/05/10
Selection guide Advanced Bus Interface Logic Selection Guide 2001/01/09
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997/08/01
Application note Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B) 1997/06/01
Application note Designing With Logic (Rev. C) 1997/06/01
Application note Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A) 1997/03/01
Application note Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A) 1996/12/01
Application note Input and Output Characteristics of Digital Integrated Circuits 1996/10/01
Application note Live Insertion 1996/10/01
Application note Understanding Advanced Bus-Interface Products Design Guide 1996/05/01
Selection guide Logic Guide (Rev. AC) PDF | HTML 1994/06/01

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패키지 핀 CAD 기호, 풋프린트 및 3D 모델
CDIP (J) 20 Ultra Librarian
CFP (W) 20 Ultra Librarian
LCCC (FK) 20 Ultra Librarian
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주문 및 품질

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  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
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