SN55LVDS32-SP
- QML-V Qualified, SMD 5962-97621
- Operate From a Single 3.3-V Supply
- Designed for Signaling Rates of up to 100 Mbps
- Differential Input Thresholds ±100 mV Max
- Typical Propagation Delay Times of 2.1 ns
- Power Dissipation 60 mW Typical Per Receiver at Maximum Data Rate
- Bus-Terminal ESD Protection Exceeds 8 kV
- Low-Voltage TTL (LVTTL) Logic Input Levels
- Open-Circuit Fail-Safe
- Cold Sparing for Space and High Reliability Applications Requiring Redundancy
The SN55LVDS32 is a differential line receiver that implements the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as EIA/TIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. Any of the four differential receivers provides a valid logical output state with a ±100-mV differential input voltage within the input common-mode voltage range. The input common-mode voltage range allows 1 V of ground potential difference between two LVDS nodes.
The intended application of these devices and signaling technique is both point-to-point and multidrop (one driver and multiple receivers) data transmission over controlled impedance media of approximately 100 Ω. The transmission media may be printed-circuit board traces, backplanes, or cables. The ultimate rate and distance of data transfer depends on the attenuation characteristics of the media and the noise coupling to the environment.
The SN55LVDS32 is characterized for operation from –55°C to 125°C.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | High-Speed Differential Line Receiver. datasheet | 2012/03/01 | |
* | SMD | SN55LVDS32-SP SMD 5962-97622 | 2016/07/08 | |
* | Radiation & reliability report | SN55LVDS31 and SN55LVDS32 SEE Report | 2015/03/31 | |
* | Radiation & reliability report | SN55LVDS32J Radiation Test Report | 2015/03/31 | |
Application brief | DLA Approved Optimizations for QML Products (Rev. B) | PDF | HTML | 2024/05/17 | |
Selection guide | TI Space Products (Rev. J) | 2024/02/12 | ||
More literature | TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. A) | 2023/08/31 | ||
Application note | Heavy Ion Orbital Environment Single-Event Effects Estimations (Rev. A) | PDF | HTML | 2022/11/17 | |
Application note | Single-Event Effects Confidence Interval Calculations (Rev. A) | PDF | HTML | 2022/10/19 |
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
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주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
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