SN65LVDS9637
- Meet or Exceed the Requirements of ANSI
TIA/EIA-644 Standard - Operate With a Single 3.3-V Supply
- Designed for Signaling Rates of up to
150 Mbps - Differential Input Thresholds ±100 mV Max
- Typical Propagation Delay Time of 2.1 ns
- Power Dissipation 60 mW Typical Per
Receiver at Maximum Data Rate - Bus-Terminal ESD Protection Exceeds 8 kV
- Low-Voltage TTL (LVTTL) Logic Output
Levels - Pin Compatible With AM26LS32, MC3486,
and µA9637 - Open-Circuit Fail-Safe
- Cold Sparing for Space and High-Reliability
Applications Requiring Redundancy
The SN55LVDS32, SN65LVDS32, SN65LVDS3486, and SN65LVDS9637 devices are differential line receivers that implement the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as EIA/TIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. Any of the differential receivers provides a valid logical output state with a ±100-mV differential input voltage within the input common-mode voltage range. The input common-mode voltage range allows 1 V of ground potential difference between two LVDS nodes.
The intended application of these devices and signaling technique is both point-to-point and multidrop (one driver and multiple receivers) data transmission over controlled impedance media of approximately 100 Ω. The transmission media may be printed-circuit board traces, backplanes, or cables. The ultimate rate and distance of data transfer depends on the attenuation characteristics of the media and the noise coupling to the environment.
The SN65LVDS32, SN65LVDS3486, and SN65LVDS9637 devices are characterized for operation from –40°C to 85°C. The SN55LVDS32 device is characterized for operation from –55°C to 125°C.
기술 자료
| 상위 문서 | 유형 | 직함 | 형식 옵션 | 최신 영어 버전 다운로드 | 날짜 | |
|---|---|---|---|---|---|---|
| * | 데이터 시트 | SNx5LVDS32, SN65LVDS3486, SN65LVDS9637 High-Speed Differential Line Receivers datasheet (Rev. R) | 2014. 8. 6 | |||
| Application brief | LVDS to Improve EMC in Motor Drives | 2018. 9. 27 | ||||
| Application brief | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018. 8. 3 | ||||
| Application brief | How to Terminate LVDS Connections with DC and AC Coupling | 2018. 5. 16 | ||||
| 애플리케이션 노트 | An Overview of LVDS Technology | 1998. 10. 5 |
설계 및 개발
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| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| HVSSOP (DGN) | 8 | Ultra Librarian |
| VSSOP (DGK) | 8 | Ultra Librarian |
| SOIC (D) | 8 | Ultra Librarian |
주문 및 품질
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