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Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 3.6 Number of channels 18 IOL (max) (mA) 24 IOH (max) (mA) -32 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Bus-hold, Positive input clamp diode, Ultra high speed (tpd <5ns) Technology family ALVC Rating Catalog Operating temperature range (°C) -40 to 85
Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 3.6 Number of channels 18 IOL (max) (mA) 24 IOH (max) (mA) -32 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Bus-hold, Positive input clamp diode, Ultra high speed (tpd <5ns) Technology family ALVC Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 56 190.647 mm² 18.42 x 10.35
  • Member of the Texas Instruments Widebus™ Family
  • EPIC™ (Enhanced-Performance Implanted CMOS) Submicron Process
  • UBT™ (Universal Bus Transceiver) Transceiver Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Modes
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages

Widebus, EPIC, UBT are trademarks of Texas Instruments.

  • Member of the Texas Instruments Widebus™ Family
  • EPIC™ (Enhanced-Performance Implanted CMOS) Submicron Process
  • UBT™ (Universal Bus Transceiver) Transceiver Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Modes
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages

Widebus, EPIC, UBT are trademarks of Texas Instruments.

This 18-bit universal bus transceiver is designed for 1.65-V to 3.6-V VCC operation.

Data flow in each direction is controlled by output-enable (OEAB and OEBA\), latch-enable (LEAB and LEBA), and clock (CLKAB\ and CLKBA\) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB\ is held at a high or low logic level. If LEAB is low, the A data is stored in the latch/flip-flop on the high-to-low transition of CLKAB\. Output-enable OEAB is active high. When OEAB is high, the B-port outputs are active. When OEAB is low, the B-port outputs are in the high-impedance state.

Data flow for B to A is similar to that of A to B, but uses OEBA\, LEBA, and CLKBA\. The output enables are complementary (OEAB is active high, and OEBA\ is active low).

To ensure the high-impedance state during power up or power down, OEBA\ should be tied to VCC through a pullup resistor, and OEAB should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver.

Active bus-hold circuitry holds unused or floating data inputs at a valid logic state.

The SN74ALVCH16500 is characterized for operation from –40°C to 85°C.

This 18-bit universal bus transceiver is designed for 1.65-V to 3.6-V VCC operation.

Data flow in each direction is controlled by output-enable (OEAB and OEBA\), latch-enable (LEAB and LEBA), and clock (CLKAB\ and CLKBA\) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB\ is held at a high or low logic level. If LEAB is low, the A data is stored in the latch/flip-flop on the high-to-low transition of CLKAB\. Output-enable OEAB is active high. When OEAB is high, the B-port outputs are active. When OEAB is low, the B-port outputs are in the high-impedance state.

Data flow for B to A is similar to that of A to B, but uses OEBA\, LEBA, and CLKBA\. The output enables are complementary (OEAB is active high, and OEBA\ is active low).

To ensure the high-impedance state during power up or power down, OEBA\ should be tied to VCC through a pullup resistor, and OEAB should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver.

Active bus-hold circuitry holds unused or floating data inputs at a valid logic state.

The SN74ALVCH16500 is characterized for operation from –40°C to 85°C.

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기술 자료

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유형 직함 날짜
* Data sheet SN74ALVCH16500 datasheet (Rev. I) 2004/09/02
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
User guide ALVC Advanced Low-Voltage CMOS Including SSTL, HSTL, And ALB (Rev. B) 2002/08/01
More literature Standard Linear & Logic for PCs, Servers & Motherboards 2002/06/13
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 2002/05/22
Application note Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A) 1999/09/08
Application note TI SN74ALVC16835 Component Specification Analysis for PC100 1998/08/03
Application note Logic Solutions for PC-100 SDRAM Registered DIMMs (Rev. A) 1998/05/13
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 1997/12/01
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997/08/01
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997/06/01
Application note Input and Output Characteristics of Digital Integrated Circuits 1996/10/01
Application note Live Insertion 1996/10/01
Application note Understanding Advanced Bus-Interface Products Design Guide 1996/05/01

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주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
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