홈 로직 및 전압 변환 로직 게이트 AND 게이트
홈
로직 및 전압 변환
로직 게이트
AND 게이트

SN74LVC08A-EP

활성

향상된 제품, 4채널 2입력 2V~3.6V AND 게이트

지금 주문하기
데이터 시트

SN74LVC08A-EP

활성
데이터 시트 지금 주문하기

제품 상세 정보

Technology family LVC Number of channels 4 Inputs per channel 2 IOL (max) (mA) 24 IOH (max) (mA) -24 Input type Standard CMOS Output type Push-Pull Features Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Data rate (max) (Mbps) 100 Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
Technology family LVC Number of channels 4 Inputs per channel 2 IOL (max) (mA) 24 IOH (max) (mA) -24 Input type Standard CMOS Output type Push-Pull Features Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Data rate (max) (Mbps) 100 Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
SOIC (D) 14 51.9 mm² (8.65 mm × 6 mm) TSSOP (PW) 14 32 mm² (5 mm × 6.4 mm)
  • Controlled Baseline
    • One Assembly
    • One Test Site
    • One Fabrication Site
  • Extended Temperature Performance of -40°C to 125°C and -55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • ESD Protection Exceeds 2000 V Per
    MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Operates From 1.65 V to 3.6 V
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 4.1 ns at 3.3 V
  • Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
  • Controlled Baseline
    • One Assembly
    • One Test Site
    • One Fabrication Site
  • Extended Temperature Performance of -40°C to 125°C and -55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • ESD Protection Exceeds 2000 V Per
    MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Operates From 1.65 V to 3.6 V
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 4.1 ns at 3.3 V
  • Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

The SN74LVC08A quadruple 2-input positive-AND gate is designed for 2.7-V to 3.6-V VCC operation.

The device performs the Boolean function Y = A • B or Y = A\ + B\ in positive logic.

Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device as a translator in a mixed 3.3 V/5 V system environment.

The SN74LVC08A quadruple 2-input positive-AND gate is designed for 2.7-V to 3.6-V VCC operation.

The device performs the Boolean function Y = A • B or Y = A\ + B\ in positive logic.

Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device as a translator in a mixed 3.3 V/5 V system environment.
filter 기타 AND 게이트 찾기
다운로드 스크립트와 함께 비디오 보기 비디오

기술 자료

검색된 결과가 없습니다. 검색어를 지우고 다시 시도하세요.
3개 모두 보기
상위 문서 유형 직함 형식 옵션 최신 영어 버전 다운로드 날짜
* 데이터 시트 Quadruple 2-Input Positive-AND Gate datasheet (Rev. D) 2007. 9. 7
* 방사능 및 안정성 보고서 SN74LVC08AMDREP Reliability Report 2017. 8. 3
* VID SN74LVC08A-EP VID V6204655 2016. 6. 21

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

패키지 핀 CAD 기호, 풋프린트 및 3D 모델
SOIC (D) 14 Ultra Librarian
TSSOP (PW) 14 Ultra Librarian
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

포럼 주제 모두 보기(영문)

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

동영상