TMP9R01-SEP

활성

핀으로 선택 가능한 주소를 갖춘 방사능 내성 고정밀 원격 및 로컬 온도 센서

제품 상세 정보

Local sensor accuracy (max) 2 Type Remote Operating temperature range (°C) -55 to 125 Supply voltage (min) (V) 1.7 Interface type I2C, SMBus Supply voltage (max) (V) 3.6 Features ALERT Supply current (max) (µA) 375 Temp resolution (max) (bps) 12 Remote channels (#) 1 Addresses 9 Rating Space
Local sensor accuracy (max) 2 Type Remote Operating temperature range (°C) -55 to 125 Supply voltage (min) (V) 1.7 Interface type I2C, SMBus Supply voltage (max) (V) 3.6 Features ALERT Supply current (max) (µA) 375 Temp resolution (max) (bps) 12 Remote channels (#) 1 Addresses 9 Rating Space
VSSOP (DGS) 10 14.7 mm² 3 x 4.9
  • Vendor item drawing (VID) V62/24615
  • Radiation tolerant:
    • TID characterized up to 50krad(Si)
    • TID RHA/RLAT assurance up to 30krad(Si)
    • SEL immune to LET: 43MeV×cm2/mg at 125°C
    • SEE characterized to LET: 43MeV×cm2/mg
    • SEFI characterized to LET: 43MeV×cm2/mg
  • I2C interface (SMBusTM compatible)

    • Pin-programmable address
    • 12-bit resolution: 0.0625°C (LSB)
  • Temperature accuracy and range:
    • Local (on-chip) temp accuracy: ±2.0°C (Max)
    • Remote junction temp accuracy: ±1.5°C (Max)
    • Remote range tested to: –64°C to 191°C
  • Small-size package: VSSOP-10, 4.9mm × 3.0mm
  • QMLP version: TMP9R01-SP (pre-release)
  • QMLV version: TMP461-SP
  • Integrated calibration/protection features:
    • η-factor and offset correction
    • Series resistance cancellation
    • Remote BJT/diode fault detection
    • Programmable digital filter
  • Wide operating range, low power:
    • Voltage supply range: 1.7V to 3.6V
    • I/O voltages: 1.8V, 2.5V, and 3.3V
    • Standby/shutdown IQ: 15µA/3µA
  • Space enhanced plastic (Space EP):
    • Meets NASA’s ASTM E595 outgassing spec
    • Military temperature range (-55°C to 125°C)
    • Au bondwire and NiPdAu lead finish
    • One fabrication, assembly, and test site
    • Extended product life cycle
    • Wafer lot traceability
    • Extended product change notification
  • Vendor item drawing (VID) V62/24615
  • Radiation tolerant:
    • TID characterized up to 50krad(Si)
    • TID RHA/RLAT assurance up to 30krad(Si)
    • SEL immune to LET: 43MeV×cm2/mg at 125°C
    • SEE characterized to LET: 43MeV×cm2/mg
    • SEFI characterized to LET: 43MeV×cm2/mg
  • I2C interface (SMBusTM compatible)

    • Pin-programmable address
    • 12-bit resolution: 0.0625°C (LSB)
  • Temperature accuracy and range:
    • Local (on-chip) temp accuracy: ±2.0°C (Max)
    • Remote junction temp accuracy: ±1.5°C (Max)
    • Remote range tested to: –64°C to 191°C
  • Small-size package: VSSOP-10, 4.9mm × 3.0mm
  • QMLP version: TMP9R01-SP (pre-release)
  • QMLV version: TMP461-SP
  • Integrated calibration/protection features:
    • η-factor and offset correction
    • Series resistance cancellation
    • Remote BJT/diode fault detection
    • Programmable digital filter
  • Wide operating range, low power:
    • Voltage supply range: 1.7V to 3.6V
    • I/O voltages: 1.8V, 2.5V, and 3.3V
    • Standby/shutdown IQ: 15µA/3µA
  • Space enhanced plastic (Space EP):
    • Meets NASA’s ASTM E595 outgassing spec
    • Military temperature range (-55°C to 125°C)
    • Au bondwire and NiPdAu lead finish
    • One fabrication, assembly, and test site
    • Extended product life cycle
    • Wafer lot traceability
    • Extended product change notification

The TMP9R01-SEP device is a radiation-tolerant, high-accuracy, low-power remote and local temperature sensor that integrates a 12‑bit ADC, bias currents, and on‑chip calibration circuitry for temperature sensing. This device is available in a 10-pin VSSOP plastic-encapsulated package. By forcing a bias current through an external BJT transistor, or the diode/junction integrated in an FPGA, ADC, or ASIC, the device digitizes the resulting ΔVBE and directly reports with a 0.0625°C temperature resolution. The second on‑chip sensor measures local temperature, enabling on-board temperature sensing.

The TMP9R01-SEP device incorporates multiple calibration and protection features, including series resistance cancellation, programmable non‑ideality factor (η-Factor), offset correction, and programmable digital filter. The user can set high and low temperature limits that drive the ALERT output for over- and under- temperature thermal protection. The I2C/SMBus serial interface accepts up to nine different pin-programmable addresses on the same I2C bus. The TMP9R01-SEP device is also available in a QMLV (TMP461-SP) and QMLP (TMP9R01-SP, prerelease) versions, with higher radiation specs.

The TMP9R01-SEP device is ideal for multi‑location spacecraft housekeeping, satellite telemetry, avionics, and other high‑reliability industrial or medical designs that require precise temperature sensing and radiation tolerance.

The TMP9R01-SEP device is a radiation-tolerant, high-accuracy, low-power remote and local temperature sensor that integrates a 12‑bit ADC, bias currents, and on‑chip calibration circuitry for temperature sensing. This device is available in a 10-pin VSSOP plastic-encapsulated package. By forcing a bias current through an external BJT transistor, or the diode/junction integrated in an FPGA, ADC, or ASIC, the device digitizes the resulting ΔVBE and directly reports with a 0.0625°C temperature resolution. The second on‑chip sensor measures local temperature, enabling on-board temperature sensing.

The TMP9R01-SEP device incorporates multiple calibration and protection features, including series resistance cancellation, programmable non‑ideality factor (η-Factor), offset correction, and programmable digital filter. The user can set high and low temperature limits that drive the ALERT output for over- and under- temperature thermal protection. The I2C/SMBus serial interface accepts up to nine different pin-programmable addresses on the same I2C bus. The TMP9R01-SEP device is also available in a QMLV (TMP461-SP) and QMLP (TMP9R01-SP, prerelease) versions, with higher radiation specs.

The TMP9R01-SEP device is ideal for multi‑location spacecraft housekeeping, satellite telemetry, avionics, and other high‑reliability industrial or medical designs that require precise temperature sensing and radiation tolerance.

다운로드 스크립트와 함께 비디오 보기 동영상

관심 가지실만한 유사 제품

open-in-new 대안 비교
다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
TMP461-SP 활성 방사능 손상 방지 보증(RHA), 높은 정확도의 원격 및 로컬 온도 센서 QMLV-RHA version (100 krad RLAT), in a ceramic package.

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
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8개 모두 보기
유형 직함 날짜
* Data sheet TMP9R01-SEP Radiation Tolerant, I2 C Digital Temperature Sensor with Remote and Local (On-Chip) Temperature Sensing datasheet PDF | HTML 2025/07/21
* Radiation & reliability report TMP9R01-SEP Production Flow and Reliability Report (Rev. A) PDF | HTML 2025/07/31
* Radiation & reliability report TMP9R01-SEP Total Ionizing Dose (TID) Report (Rev. C) 2025/06/27
* Radiation & reliability report TMP9R01-SEP Single-Event Effects (SEE) Radiation Test Report (Rev. B) PDF | HTML 2025/06/19
Application note How to Optimize Space-Grade Temperature Sensing Designs PDF | HTML 2025/10/27
Selection guide TI Space Products (Rev. K) 2025/04/04
Product overview TI Space Qualified Temperature Sensor Product Selection Guide (Rev. A) PDF | HTML 2025/01/22
Application note Remote Temperature Transistor Sensor Selection Guide PDF | HTML 2021/03/24

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

TMP9R01EVM — TMP9R01 평가 모듈

TMP9R01EVM은 TMP9R01-SEP 장치를 평가하고 비트 단위 레지스터 레벨까지 장치에 익숙해지기 위한 빠른 설정을 제공하도록 설계되었습니다. 이 평가 모듈(EVM)은 장치의 일반적인 기능을 테스트할 수 있을 뿐만 아니라, SEL(신호 이벤트 예측) 테스트와 같은 방사선 환경에서도 테스트를 수행할 수 있도록 설계되었습니다. 이 EVM을 통해 사용자는 TMP9R01 디지털 온도 센서의 성능을 우주 환경에서 평가할 수 있습니다.
사용 설명서: PDF | HTML
TI.com에서 구매 불가
평가 보드

ALPHA-3P-ADM-VA601-SPACE-AMD — AMD Versal 코어 XQRVC1902 ACAP 및 TI 방사선 내성 제품을 사용하는 Alpha Data ADM-VA601 키트

AMD-Xilinx®® Versal AI Core XQRVC1902 적응형 SoC/FPGA를 강조하는 6U VPX 폼 팩터입니다. ADM-VA600은 FMC+ 커넥터 1개, DDR4 DRAM 및 시스템 모니터링 기능을 갖춘 모듈식 보드 설계입니다. 대부분의 구성 요소는 방사능 내성 전원 관리, 인터페이스, 클로킹 및 임베디드 프로세싱(-SEP) 장치입니다.

평가 보드

ALPHA-3P-VB630-SPACE-AMD — AMD Versal 에지 XQRVE2302 ACAP 및 TI 방사선 내성 제품을 사용하는 Alpha Data ADM-VB630 키트

AMD-Xilinx® Versal AI Edge XQRVE2302 적응형 SoC/FPGA를 강조하는 3U VPX 폼 팩터입니다. ADM-VB630은 싱글 보드 컴퓨터입니다. 대부분의 구성 요소는 방사능 내성 전원 관리, 인터페이스 및 감지(-SEP) 포트폴리오입니다.

시뮬레이션 모델

TMP9R01 IBIS model

SNIM014.ZIP (0 KB) - IBIS Model
패키지 CAD 기호, 풋프린트 및 3D 모델
VSSOP (DGS) 10 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

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