TMP9R01-SEP
- Vendor item drawing (VID) V62/24615
- Radiation tolerant:
-
I2C interface (SMBusTM compatible)
- Pin-programmable address
- 12-bit resolution: 0.0625°C (LSB)
- Temperature accuracy and range:
- Local (on-chip) temp accuracy: ±2.0°C (Max)
- Remote junction temp accuracy: ±1.5°C (Max)
- Remote range tested to: –64°C to 191°C
- Small-size package: VSSOP-10, 4.9mm × 3.0mm
- QMLP version: TMP9R01-SP (pre-release)
- QMLV version: TMP461-SP
- Integrated calibration/protection features:
- η-factor and offset correction
- Series resistance cancellation
- Remote BJT/diode fault detection
- Programmable digital filter
- Wide operating range, low power:
- Voltage supply range: 1.7V to 3.6V
- I/O voltages: 1.8V, 2.5V, and 3.3V
- Standby/shutdown IQ: 15µA/3µA
- Space enhanced plastic (Space EP):
- Meets NASA’s ASTM E595 outgassing spec
- Military temperature range (-55°C to 125°C)
- Au bondwire and NiPdAu lead finish
- One fabrication, assembly, and test site
- Extended product life cycle
- Wafer lot traceability
- Extended product change notification
The TMP9R01-SEP device is a radiation-tolerant, high-accuracy, low-power remote and local temperature sensor that integrates a 12‑bit ADC, bias currents, and on‑chip calibration circuitry for temperature sensing. This device is available in a 10-pin VSSOP plastic-encapsulated package. By forcing a bias current through an external BJT transistor, or the diode/junction integrated in an FPGA, ADC, or ASIC, the device digitizes the resulting ΔVBE and directly reports with a 0.0625°C temperature resolution. The second on‑chip sensor measures local temperature, enabling on-board temperature sensing.
The TMP9R01-SEP device incorporates multiple calibration and protection features, including series resistance cancellation, programmable non‑ideality factor (η-Factor), offset correction, and programmable digital filter. The user can set high and low temperature limits that drive the ALERT output for over- and under- temperature thermal protection. The I2C/SMBus serial interface accepts up to nine different pin-programmable addresses on the same I2C bus. The TMP9R01-SEP device is also available in a QMLV (TMP461-SP) and QMLP (TMP9R01-SP, prerelease) versions, with higher radiation specs.
The TMP9R01-SEP device is ideal for multi‑location spacecraft housekeeping, satellite telemetry, avionics, and other high‑reliability industrial or medical designs that require precise temperature sensing and radiation tolerance.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | TMP9R01-SEP Radiation Tolerant, I2 C Digital Temperature Sensor with Remote and Local (On-Chip) Temperature Sensing datasheet | PDF | HTML | 2025/07/21 |
| * | Radiation & reliability report | TMP9R01-SEP Production Flow and Reliability Report (Rev. A) | PDF | HTML | 2025/07/31 |
| * | Radiation & reliability report | TMP9R01-SEP Total Ionizing Dose (TID) Report (Rev. C) | 2025/06/27 | |
| * | Radiation & reliability report | TMP9R01-SEP Single-Event Effects (SEE) Radiation Test Report (Rev. B) | PDF | HTML | 2025/06/19 |
| Application note | How to Optimize Space-Grade Temperature Sensing Designs | PDF | HTML | 2025/10/27 | |
| Selection guide | TI Space Products (Rev. K) | 2025/04/04 | ||
| Product overview | TI Space Qualified Temperature Sensor Product Selection Guide (Rev. A) | PDF | HTML | 2025/01/22 | |
| Application note | Remote Temperature Transistor Sensor Selection Guide | PDF | HTML | 2021/03/24 |
설계 및 개발
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AMD-Xilinx® Versal AI Edge XQRVE2302 적응형 SoC/FPGA를 강조하는 3U VPX 폼 팩터입니다. ADM-VB630은 싱글 보드 컴퓨터입니다. 대부분의 구성 요소는 방사능 내성 전원 관리, 인터페이스 및 감지(-SEP) 포트폴리오입니다.
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| VSSOP (DGS) | 10 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치