TMUX7209
- Latch-up immune
- Dual supply range: ±4.5 V to ±22 V
- Single supply range: 4.5 V to 44 V
- Low on-resistance: 4 Ω
- Low charge injection: 3 pC
- High current support: 400 mA (maximum) (WQFN)
- High current support: 300 mA (maximum) (TSSOP)
- –40°C to +125°C operating temperature
- 1.8 V logic compatible inputs
- Integrated pull-down resistor on logic pins
- Fail-safe logic
- Rail-to-rail operation
- Bidirectional signal path
- Break-before-make switching
The TMUX7208 is a precision 8:1, single channel multiplexer while the TMUX7209 is a 4:1, 2 channel multiplexer featuring low on resistance and charge injection. The devices work with a single supply (4.5 V to 44 V), dual supplies (±4.5 V to ±22 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5 V). The TMUX720x support bidirectional analog and digital signals onthe source (Sx) and drain (D) pins ranging from VSS to VDD.
The TMUX720x are part of the precision switches and multiplexers family of devices and have very low on and off leakage currents allowing them to be used in high precision measurement applications. The TMUX72xx family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX72xx family of switches and multiplexers to be used in harsh environments.
기술 문서
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | TMUX720x 44-V, Latch-Up Immune, 8:1, 1-Channel and 4:1, 2-Channel Precision Multiplexers with 1.8-V Logic datasheet (Rev. E) | PDF | HTML | 2022/01/21 |
| Application note | Guarding in Multiplexer Applications | PDF | HTML | 2022/05/13 | |
| Application note | Using Latch Up Immune Multiplexers to Help Improve System Reliability (Rev. A) | 2021/09/20 | ||
| Application brief | Precision Multiplexers Reducing Barriers in an Industrial Environment | PDF | HTML | 2021/05/21 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
TMUXRUM-RRPEVM — 16핀 RUM 및 RRP QFN(Quad-Flatpack No-Lead) 패키지용 TMUX 일반 평가 모듈
TMUXRUM-RRPEVM을 사용하면 16핀 RUM 또는 RRP 패키지(QFN)를 사용하고 고전압 작동에 맞게 정격 조정된 TI의 TMUX 제품 라인의 빠른 프로토타이핑 및 DC 특성화가 가능합니다.
LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
LEADLESS-ADAPTER1 — TI의 6, 8, 10, 12, 14, 16 및 20핀 리드 없는 패키지의 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
| 패키지 | 핀 | 다운로드 |
|---|---|---|
| TSSOP (PW) | 16 | 옵션 보기 |
| WQFN (RUM) | 16 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.