전력 관리 DC/DC 전력 모듈 벅 모듈(통합 인덕터)

TPS81256

마지막 구매

통합 전원 솔루션, 3W 고효율 부스트 컨버터 모듈(MicroSiP™ 패키지)

TPS81256은(는) 단종 과정에 있습니다.
이 제품은 단종이 진행 중인 제품입니다. 새로운 설계는 대체 제품을 고려해야 합니다.
open-in-new 대안 비교
다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
TPS61253A 활성 1.2mm x 1.3mm WCSP의 3.8MHz, 5V/4A 부스트 Discrete solution
TPSM81033 활성 MagPack™ 패키징 기술 및 전원 양호를 지원하는 5.5V, 2A, 2.4MHz 동기식 부스트 전원 모듈 Same functionality with higher power density

제품 상세 정보

Rating Catalog Topology Boost Iout (max) (A) 0.7 Vin (max) (V) 5.5 Vin (min) (V) 2.5 Vout (max) (V) 5 Vout (min) (V) 5 Features Enable, Load Disconnect, Synchronous rectification Operating temperature range (°C) -40 to 125 Type Module
Rating Catalog Topology Boost Iout (max) (A) 0.7 Vin (max) (V) 5.5 Vin (min) (V) 2.5 Vout (max) (V) 5 Vout (min) (V) 5 Features Enable, Load Disconnect, Synchronous rectification Operating temperature range (°C) -40 to 125 Type Module
USIP (SIP) 9 See data sheet
  • 91% Efficiency at 4MHz Operation
  • Wide VIN Range From 2.5V to 5.5V
  • IOUT ≥550mA at VOUT = 5.0V, VIN ≥3.3V
  • Fixed Output Voltage 5.0V
  • ±2% Total DC Voltage Accuracy
  • 43µA Supply Current
  • Best-in-Class Line and Load Transient
  • VIN ≥ VOUT Operation
  • Low-Ripple Light-Load PFM Mode
  • True Load Disconnect During Shutdown
  • Thermal Shutdown and Overload Protection
  • Sub 1-mm Profile Solution
  • Total Solution Size <9mm2
  • 9-Pin MicroSiP Packaging
  • 91% Efficiency at 4MHz Operation
  • Wide VIN Range From 2.5V to 5.5V
  • IOUT ≥550mA at VOUT = 5.0V, VIN ≥3.3V
  • Fixed Output Voltage 5.0V
  • ±2% Total DC Voltage Accuracy
  • 43µA Supply Current
  • Best-in-Class Line and Load Transient
  • VIN ≥ VOUT Operation
  • Low-Ripple Light-Load PFM Mode
  • True Load Disconnect During Shutdown
  • Thermal Shutdown and Overload Protection
  • Sub 1-mm Profile Solution
  • Total Solution Size <9mm2
  • 9-Pin MicroSiP Packaging

The TPS81256 device is a complete MicroSiP DC/DC step-up power solution intended for battery-powered portable applications. Included in the package are the switching regulator, inductor and input/output capacitors. Only a tiny additional output capacitor is required to finish the design.

The TPS81256 is based on a high-frequency synchronous step-up DC/DC converter optimized for battery-powered portable applications.

The DC/DC converter operates at a regulated 4-MHz switching frequency and enters power-save mode operation at light load currents to maintain high efficiency over the entire load current range.

The PFM mode extends the battery life by reducing the supply current to 43µA (typical) during light load operation. Intended for low-power applications, the TPS81256 supports more than 3W output power over a full Li-Ion battery voltage range. Input current in shutdown mode is less than 1µA (typical), which maximizes battery life.

The TPS81256 offers a very small solution size of less than 9mm2 due to minimum amount of external components. The solution is packaged in a compact (2.6mm x 2.9mm) and low profile (1.0mm) BGA package suitable for automated assembly by standard surface mount equipment.

The TPS81256 device is a complete MicroSiP DC/DC step-up power solution intended for battery-powered portable applications. Included in the package are the switching regulator, inductor and input/output capacitors. Only a tiny additional output capacitor is required to finish the design.

The TPS81256 is based on a high-frequency synchronous step-up DC/DC converter optimized for battery-powered portable applications.

The DC/DC converter operates at a regulated 4-MHz switching frequency and enters power-save mode operation at light load currents to maintain high efficiency over the entire load current range.

The PFM mode extends the battery life by reducing the supply current to 43µA (typical) during light load operation. Intended for low-power applications, the TPS81256 supports more than 3W output power over a full Li-Ion battery voltage range. Input current in shutdown mode is less than 1µA (typical), which maximizes battery life.

The TPS81256 offers a very small solution size of less than 9mm2 due to minimum amount of external components. The solution is packaged in a compact (2.6mm x 2.9mm) and low profile (1.0mm) BGA package suitable for automated assembly by standard surface mount equipment.

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* Data sheet TPS81256 3-W, High Efficiency Step-Up Converter In MicroSiP Packaging datasheet (Rev. D) PDF | HTML 2018/02/02

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치