首頁 電源管理 功率級 Si 功率級

CSD95411

現行

65-A 尖峰連續電流同步降壓 NexFET™ 功率級

產品詳細資料

Rating Catalog VDS (V) 20 Ploss current (A) 30 Features Analog temperature output, Catastrophic over-current protection, Cycle-by-cycle over-current protection, Diode emulation mode with FCCM, Industry common footprint, Integrated current sense, Integrated ringing reduction, Negative over-current protection, Powerstack vertical FET integration, Ultra-low inductance package Operating temperature range (°C) -40 to 125
Rating Catalog VDS (V) 20 Ploss current (A) 30 Features Analog temperature output, Catastrophic over-current protection, Cycle-by-cycle over-current protection, Diode emulation mode with FCCM, Industry common footprint, Integrated current sense, Integrated ringing reduction, Negative over-current protection, Powerstack vertical FET integration, Ultra-low inductance package Operating temperature range (°C) -40 to 125
VQFN-CLIP (RRB) 41 30 mm² (6 mm × 5 mm)

  • Peak continuous current: 65-A
  • Peak efficiency (fSW = 600 kHz, LOUT = 150 nH): Over 94%
  • High-frequency operation: up to 1.75 MHz
  • Diode emulation function
  • Temperature compensated bi-directional current sense
  • Analog temperature output
  • Fault monitoring
  • 3.3-V and 5-V PWM signal compatible
  • Tri-state PWM input
  • Integrated bootstrap switch
  • Optimized dead time for shoot-through protection
  • High-density Industry Common QFN 5-mm × 6-mm Footprint
  • Ultra-low-inductance package
  • System optimized PCB footprint
  • Thermally enhanced topside cooling
  • RoHS compliant, lead-free terminal plating
  • Halogen free

  • Peak continuous current: 65-A
  • Peak efficiency (fSW = 600 kHz, LOUT = 150 nH): Over 94%
  • High-frequency operation: up to 1.75 MHz
  • Diode emulation function
  • Temperature compensated bi-directional current sense
  • Analog temperature output
  • Fault monitoring
  • 3.3-V and 5-V PWM signal compatible
  • Tri-state PWM input
  • Integrated bootstrap switch
  • Optimized dead time for shoot-through protection
  • High-density Industry Common QFN 5-mm × 6-mm Footprint
  • Ultra-low-inductance package
  • System optimized PCB footprint
  • Thermally enhanced topside cooling
  • RoHS compliant, lead-free terminal plating
  • Halogen free

The CSD95411 NexFET™ power stage is a highly optimized design for use with a high-power, high-density synchronous buck converter. This device integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. The power stage also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. The optimized PCB footprint helps reduce design time and simplify the completion of the overall system design.

The CSD95411 NexFET™ power stage is a highly optimized design for use with a high-power, high-density synchronous buck converter. This device integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. The power stage also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. The optimized PCB footprint helps reduce design time and simplify the completion of the overall system design.

下載 觀看有字幕稿的影片 影片
索取更多資訊

提供完整產品規格表和其它資訊。立即索取

您可能會感興趣的類似產品

open-in-new 比較替代產品
針腳對針腳的功能與所比較的裝置相同。
CSD95410RRB 現行 90A 峰值連續同步降壓 NexFET™ 智慧功率級 Same common footprint, higher current 5x6mm 90-A power stage

技術文件

找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 1
重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 CSD95411 Synchronous Buck NexFET Smart Power Stage datasheet PDF | HTML 2023/1/4

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

計算工具

SLPR052 — Power Stage LSET Calculator Tool

支援產品和硬體
封裝 針腳 CAD 符號、佔位空間與 3D 模型
VQFN-CLIP (RRB) 41 Ultra Librarian

訂購與品質

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片