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CSD97370Q5M

現行

30 V 25 A SON 5 x 6 mm 同步降壓 NexFET ™功率級

產品詳細資料

Rating Catalog VDS (V) 30 Ploss current (A) 25 Features Ultra-low inductance package Operating temperature range (°C) -55 to 150
Rating Catalog VDS (V) 30 Ploss current (A) 25 Features Ultra-low inductance package Operating temperature range (°C) -55 to 150
LSON-CLIP (DQP) 22 30 mm² (6 mm × 5 mm)
  • 90% System Efficiency at 25A
  • Input Voltages up to 22V
  • High Frequency Operation (Up To 2MHz)
  • Incorporates Power Block Technology
  • High Density – SON 5-mm × 6-mm Footprint
  • Low Power Loss 2.8W at 25A
  • Ultra Low Inductance Package
  • System Optimized PCB Footprint
  • 3.3V and 5V PWM Signal Compatible
  • 3-State PWM Input
  • Integrated Bootstrap Diode
  • Pre-Bias Start-Up Protection
  • Shoot Through Protection
  • RoHS Compliant – Lead Free Terminal Plating Halogen Free
  • 90% System Efficiency at 25A
  • Input Voltages up to 22V
  • High Frequency Operation (Up To 2MHz)
  • Incorporates Power Block Technology
  • High Density – SON 5-mm × 6-mm Footprint
  • Low Power Loss 2.8W at 25A
  • Ultra Low Inductance Package
  • System Optimized PCB Footprint
  • 3.3V and 5V PWM Signal Compatible
  • 3-State PWM Input
  • Integrated Bootstrap Diode
  • Pre-Bias Start-Up Protection
  • Shoot Through Protection
  • RoHS Compliant – Lead Free Terminal Plating Halogen Free

The CSD97370Q5M NexFET Power Stage is an optimized design for use in a high power, high density Synchronous Buck converter. This product integrates an enhanced gate driver IC and Power Block Technology to complete the power stage switching function. This combination produces a high current, high efficiency, high speed switching device and delivers an excellent thermal solution in a small 5-mm × 6-mm outline package due to its large ground based thermal pad. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD97370Q5M NexFET Power Stage is an optimized design for use in a high power, high density Synchronous Buck converter. This product integrates an enhanced gate driver IC and Power Block Technology to complete the power stage switching function. This combination produces a high current, high efficiency, high speed switching device and delivers an excellent thermal solution in a small 5-mm × 6-mm outline package due to its large ground based thermal pad. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

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重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 Synchronous Buck NexFET™ Power Stage - CSD97370Q5M datasheet (Rev. C) 2012/2/22
選擇指南 Power Management Guide 2018 (Rev. R) 2018/6/25

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模擬型號

CSD97370Q5M PSpice Transient Model

SLPM193.ZIP (16 KB) - PSpice 模型
支援產品和硬體
模擬型號

CSD97370Q5M TINA-TI Spice Transient Model

SLPM256.ZIP (13 KB) - TINA-TI Spice 模型
支援產品和硬體
封裝 針腳 CAD 符號、佔位空間與 3D 模型
LSON-CLIP (DQP) 22 Ultra Librarian

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