ESD761-Q1

現行

採用 0402 封裝的車用 1.1-pF、±24-V、±15-kV ESD 防護二極體

產品詳細資料

Package name DFN-1006 (X1SON) Peak pulse power (8/20 μs) (max) (W) 65 Vrwm (V) 24 Bi-/uni-directional Bi-directional Number of channels 1 IO capacitance (typ) (pF) 1.1 Clamping voltage (V) 36.3 Breakdown voltage (min) (V) 25.5
Package name DFN-1006 (X1SON) Peak pulse power (8/20 μs) (max) (W) 65 Vrwm (V) 24 Bi-/uni-directional Bi-directional Number of channels 1 IO capacitance (typ) (pF) 1.1 Clamping voltage (V) 36.3 Breakdown voltage (min) (V) 25.5
X1SON (DPY) 2 0.6 mm² 1 x 0.6
  • IEC 61000-4-2 level 4 ESD protection:
    • ±30-kV, ±22-kV or ±15-kV contact discharge
    • ±30-kV, ±22-kV or ±15-kV air-gap discharge
  • ISO 10605 (330 pF, 330 Ω) ESD protection:
    • ±30-kV, ±22-kV or ±15-kV contact discharge
    • ±30-kV, ±22-kV or ±15-kV air-gap discharge
  • 24-V working voltage
  • Bidirectional ESD protection
  • Low clamping voltage protects downstream components
  • AEC-Q101 qualified
  • Temperature range: –55°C to +150°C
  • I/O capacitance = 2.3 pF, 1.6 pF, or 1.1 pF (typical)
  • Offered in industry standard packages: SOD-323 (DYF), SOD-523 (DYA), and 0402 size leadless package (DPY)
  • Leaded packages used for automatic optical inspection (AOI)
  • IEC 61000-4-2 level 4 ESD protection:
    • ±30-kV, ±22-kV or ±15-kV contact discharge
    • ±30-kV, ±22-kV or ±15-kV air-gap discharge
  • ISO 10605 (330 pF, 330 Ω) ESD protection:
    • ±30-kV, ±22-kV or ±15-kV contact discharge
    • ±30-kV, ±22-kV or ±15-kV air-gap discharge
  • 24-V working voltage
  • Bidirectional ESD protection
  • Low clamping voltage protects downstream components
  • AEC-Q101 qualified
  • Temperature range: –55°C to +150°C
  • I/O capacitance = 2.3 pF, 1.6 pF, or 1.1 pF (typical)
  • Offered in industry standard packages: SOD-323 (DYF), SOD-523 (DYA), and 0402 size leadless package (DPY)
  • Leaded packages used for automatic optical inspection (AOI)

The ESD1LIN24-Q1, ESD751-Q1, and ESD761-Q1 are single-channel low capacitance bidirectional ESD protection devices for local interconnect network (LIN). These devices are rated to dissipate contact ESD strikes beyond the maximum level specified in the IEC 61000-4-2 international standard (±30-kV Contact, ±30-kV Airgap), (±22-kV Contact, ±22-kV Airgap), and (±15-kV Contact, ±15-kV Airgap), respectively. The low dynamic resistance and low clamping voltage help protect systems against transient events. This protection is key as automotive systems require a high level of robustness and reliability when they control safety devices.

The ESD1LIN24-Q1 and ESD751-Q1 are both offered in leaded packages for easy flow through routing.

The ESD1LIN24-Q1, ESD751-Q1, and ESD761-Q1 are single-channel low capacitance bidirectional ESD protection devices for local interconnect network (LIN). These devices are rated to dissipate contact ESD strikes beyond the maximum level specified in the IEC 61000-4-2 international standard (±30-kV Contact, ±30-kV Airgap), (±22-kV Contact, ±22-kV Airgap), and (±15-kV Contact, ±15-kV Airgap), respectively. The low dynamic resistance and low clamping voltage help protect systems against transient events. This protection is key as automotive systems require a high level of robustness and reliability when they control safety devices.

The ESD1LIN24-Q1 and ESD751-Q1 are both offered in leaded packages for easy flow through routing.

下載 觀看有字幕稿的影片 影片

您可能會感興趣的類似產品

open-in-new 比較替代產品
功能相同,但引腳輸出與所比較的產品不同
ESD751-Q1 現行 適用於 LIN 與車載網路的車用 1.6pF、±24V、±22kV ESD 防護二極體 24-V one channel leaded part.

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 4
類型 標題 日期
* Data sheet ESD1LIN24-Q1, ESD751-Q1, and ESD761-Q1 Automotive 24-V, 1-Channel ESD Protection Diodes for In-Vehicle Networks datasheet (Rev. C) PDF | HTML 2022年 12月 16日
Product overview Creating Protection for LIN Expansion Bus PDF | HTML 2023年 5月 31日
Selection guide System-Level ESD Protection Guide (Rev. D) 2022年 9月 7日
Application note ESD Packaging and Layout Guide (Rev. B) PDF | HTML 2022年 8月 18日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

ESDEVM — 通用 ESD 評估模組

<p>The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested.</p>
(...)

使用指南: PDF | HTML
TI.com 無法提供
模擬工具

PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
模擬工具

TINA-TI — 基於 SPICE 的類比模擬程式

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
使用指南: PDF
封裝 引腳 下載
X1SON (DPY) 2 檢視選項

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片