ESD761-Q1
- IEC 61000-4-2 level 4 ESD protection:
- ±30-kV, ±22-kV or ±15-kV contact discharge
- ±30-kV, ±22-kV or ±15-kV air-gap discharge
- ISO 10605 (330 pF, 330 Ω) ESD protection:
- ±30-kV, ±22-kV or ±15-kV contact discharge
- ±30-kV, ±22-kV or ±15-kV air-gap discharge
- 24-V working voltage
- Bidirectional ESD protection
- Low clamping voltage protects downstream components
- AEC-Q101 qualified
- Temperature range: –55°C to +150°C
- I/O capacitance = 2.3 pF, 1.6 pF, or 1.1 pF (typical)
- Offered in industry standard packages: SOD-323 (DYF), SOD-523 (DYA), and 0402 size leadless package (DPY)
- Leaded packages used for automatic optical inspection (AOI)
The ESD1LIN24-Q1, ESD751-Q1, and ESD761-Q1 are single-channel low capacitance bidirectional ESD protection devices for local interconnect network (LIN). These devices are rated to dissipate contact ESD strikes beyond the maximum level specified in the IEC 61000-4-2 international standard (±30-kV Contact, ±30-kV Airgap), (±22-kV Contact, ±22-kV Airgap), and (±15-kV Contact, ±15-kV Airgap), respectively. The low dynamic resistance and low clamping voltage help protect systems against transient events. This protection is key as automotive systems require a high level of robustness and reliability when they control safety devices.
The ESD1LIN24-Q1 and ESD751-Q1 are both offered in leaded packages for easy flow through routing.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | ESD1LIN24-Q1, ESD751-Q1, and ESD761-Q1 Automotive 24-V, 1-Channel ESD Protection Diodes for In-Vehicle Networks datasheet (Rev. C) | PDF | HTML | 2022年 12月 16日 |
Product overview | Creating Protection for LIN Expansion Bus | PDF | HTML | 2023年 5月 31日 | |
Selection guide | System-Level ESD Protection Guide (Rev. D) | 2022年 9月 7日 | ||
Application note | ESD Packaging and Layout Guide (Rev. B) | PDF | HTML | 2022年 8月 18日 |
設計與開發
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ESDEVM — 通用 ESD 評估模組
<p>The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested.</p>
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 引腳 | 下載 |
---|---|---|
X1SON (DPY) | 2 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點
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