F28M36P63C2

現行

具 275 MIPS、1536 KB 快閃記憶體、ENET、USB 的 C2000™ 雙核心 32 位元 MCU

產品詳細資料

CPU 1 C28, 1 Cortex-M3 Frequency (MHz) 125, 150 Flash memory (kByte) 1536 RAM (kByte) 232 ADC type 2 12-bit Total processing (MIPS) 275 Features Single zone code security UART 6 CAN (#) 2 Sigma-delta filter 0 PWM (Ch) 24 Number of ADC channels 24 Direct memory access (Ch) 1 32-ch DMA, 1 6-Ch DMA SPI 5 QEP 3 USB Yes Hardware accelerators Floating point unit Edge AI enabled Yes Operating temperature range (°C) -40 to 125 Rating Catalog Communication interface CAN, I2C, SPI, UART Operating system BareMetal (No OS), FreeRTOS, SafeRTOS Number of I2Cs 2
CPU 1 C28, 1 Cortex-M3 Frequency (MHz) 125, 150 Flash memory (kByte) 1536 RAM (kByte) 232 ADC type 2 12-bit Total processing (MIPS) 275 Features Single zone code security UART 6 CAN (#) 2 Sigma-delta filter 0 PWM (Ch) 24 Number of ADC channels 24 Direct memory access (Ch) 1 32-ch DMA, 1 6-Ch DMA SPI 5 QEP 3 USB Yes Hardware accelerators Floating point unit Edge AI enabled Yes Operating temperature range (°C) -40 to 125 Rating Catalog Communication interface CAN, I2C, SPI, UART Operating system BareMetal (No OS), FreeRTOS, SafeRTOS Number of I2Cs 2
NFBGA (ZWT) 289 256 mm² (0 mm × 0 mm)
  • Master Subsystem — Arm® Cortex®-M3
    • 125 MHz
    • Embedded memory
      • Up to 1MB of flash (ECC)
      • Up to 128KB of RAM (ECC or parity)
      • Up to 64KB of shared RAM
      • 2KB of IPC Message RAM
    • Five Universal Asynchronous Receiver/Transmitters (UARTs)
    • Four Synchronous Serial Interfaces (SSIs)
      and a Serial Peripheral Interface (SPI)
    • Two Inter-integrated Circuits (I2Cs)
    • Universal Serial Bus On-the-Go (USB-OTG) + PHY
    • 10/100 ENET 1588 MII
    • Two Controller Area Network, D_CAN, modules (pin-bootable)
    • 32-channel Micro Direct Memory Access (µDMA)
    • Dual security zones (128-bit password per zone)
    • External Peripheral Interface (EPI)
    • Micro Cyclic Redundancy Check (µCRC) module
    • Four general-purpose timers
    • Two watchdog timer modules
    • Three external interrupts
    • Endianness: little endian
  • Clocking
    • On-chip crystal oscillator and external clock input
    • Dynamic Phase-Locked Loop (PLL) ratio changes supported
  • 1.2-V digital, 1.8-V analog, 3.3-V I/O design
  • Interprocessor Communications (IPC)
    • 32 handshaking channels
    • Four channels generate IPC interrupts
    • Can be used to coordinate transfer of data through IPC Message RAMs
  • Up to 142 individually programmable, multiplexed General-Purpose Input/Output (GPIO) pins
    • Glitch-free I/Os
  • Control Subsystem — TMS320C28x 32-bit CPU
    • 150 MHz
    • C28x core hardware built-in self-test
    • Embedded memory
      • Up to 512KB of flash (ECC)
      • Up to 36KB of RAM (ECC or parity)
      • Up to 64KB of shared RAM
      • 2KB of IPC Message RAM
    • IEEE-754 single-precision Floating-Point Unit (FPU)
    • Viterbi, Complex Math, CRC Unit (VCU)
    • Serial Communications Interface (SCI)
    • SPI
    • I2C
    • 6-channel Direct Memory Access (DMA)
    • 12 Enhanced Pulse Width Modulator (ePWM) modules
      • 24 outputs (16 high-resolution)
    • Six 32-bit Enhanced Capture (eCAP) modules
    • Three 32-bit Enhanced Quadrature Encoder Pulse (eQEP) modules
    • Multichannel Buffered Serial Port (McBSP)
    • EPI
    • One security zone (128-bit password)
    • Three 32-bit timers
    • Endianness: little endian
  • Analog Subsystem
    • Dual 12-bit Analog-to-Digital Converters (ADCs)
    • Up to 2.88 MSPS
    • Up to 24 channels
    • Four Sample-and-Hold (S/H) circuits
    • Up to six comparators with 10-bit Digital-to-Analog Converter (DAC)
  • Package
    • 289-ball ZWT New Fine Pitch Ball Grid Array (nFBGA)
  • Temperature options:
    • T: –40ºC to 105ºC Junction
    • S: –40ºC to 125ºC Junction
  • Master Subsystem — Arm® Cortex®-M3
    • 125 MHz
    • Embedded memory
      • Up to 1MB of flash (ECC)
      • Up to 128KB of RAM (ECC or parity)
      • Up to 64KB of shared RAM
      • 2KB of IPC Message RAM
    • Five Universal Asynchronous Receiver/Transmitters (UARTs)
    • Four Synchronous Serial Interfaces (SSIs)
      and a Serial Peripheral Interface (SPI)
    • Two Inter-integrated Circuits (I2Cs)
    • Universal Serial Bus On-the-Go (USB-OTG) + PHY
    • 10/100 ENET 1588 MII
    • Two Controller Area Network, D_CAN, modules (pin-bootable)
    • 32-channel Micro Direct Memory Access (µDMA)
    • Dual security zones (128-bit password per zone)
    • External Peripheral Interface (EPI)
    • Micro Cyclic Redundancy Check (µCRC) module
    • Four general-purpose timers
    • Two watchdog timer modules
    • Three external interrupts
    • Endianness: little endian
  • Clocking
    • On-chip crystal oscillator and external clock input
    • Dynamic Phase-Locked Loop (PLL) ratio changes supported
  • 1.2-V digital, 1.8-V analog, 3.3-V I/O design
  • Interprocessor Communications (IPC)
    • 32 handshaking channels
    • Four channels generate IPC interrupts
    • Can be used to coordinate transfer of data through IPC Message RAMs
  • Up to 142 individually programmable, multiplexed General-Purpose Input/Output (GPIO) pins
    • Glitch-free I/Os
  • Control Subsystem — TMS320C28x 32-bit CPU
    • 150 MHz
    • C28x core hardware built-in self-test
    • Embedded memory
      • Up to 512KB of flash (ECC)
      • Up to 36KB of RAM (ECC or parity)
      • Up to 64KB of shared RAM
      • 2KB of IPC Message RAM
    • IEEE-754 single-precision Floating-Point Unit (FPU)
    • Viterbi, Complex Math, CRC Unit (VCU)
    • Serial Communications Interface (SCI)
    • SPI
    • I2C
    • 6-channel Direct Memory Access (DMA)
    • 12 Enhanced Pulse Width Modulator (ePWM) modules
      • 24 outputs (16 high-resolution)
    • Six 32-bit Enhanced Capture (eCAP) modules
    • Three 32-bit Enhanced Quadrature Encoder Pulse (eQEP) modules
    • Multichannel Buffered Serial Port (McBSP)
    • EPI
    • One security zone (128-bit password)
    • Three 32-bit timers
    • Endianness: little endian
  • Analog Subsystem
    • Dual 12-bit Analog-to-Digital Converters (ADCs)
    • Up to 2.88 MSPS
    • Up to 24 channels
    • Four Sample-and-Hold (S/H) circuits
    • Up to six comparators with 10-bit Digital-to-Analog Converter (DAC)
  • Package
    • 289-ball ZWT New Fine Pitch Ball Grid Array (nFBGA)
  • Temperature options:
    • T: –40ºC to 105ºC Junction
    • S: –40ºC to 125ºC Junction

The Concerto family is a multicore system-on-chip microcontroller unit (MCU) with independent communication and real-time control subsystems. The F28M36x family of devices is the second series in the Concerto family.

The communications subsystem is based on the industry-standard 32-bit Arm Cortex-M3 CPU and features a wide variety of communication peripherals, including Ethernet 1588, USB OTG with PHY, Controller Area Network (CAN), UART, SSI, I2C, and an external interface.

The real-time control subsystem is based on TI’s industry-leading proprietary 32-bit C28x floating-point CPU and features the most flexible and high-precision control peripherals, including ePWMs with fault protection, and encoders and captures—all as implemented by TI’s TMS320C2000™ Entry performance MCUs and Premium performance MCUs. In addition, the C28-CPU has been enhanced with the addition of the VCU instruction accelerator that implements efficient Viterbi, Complex Arithmetic, 16-bit FFTs, and CRC algorithms.

A high-speed analog subsystem and supplementary RAM memory is shared, along with on-chip voltage regulation and redundant clocking circuitry. Safety considerations also include Error Correction Code (ECC), parity, and code secure memory, as well as documentation to assist with system-level industrial safety certification.

The Concerto family is a multicore system-on-chip microcontroller unit (MCU) with independent communication and real-time control subsystems. The F28M36x family of devices is the second series in the Concerto family.

The communications subsystem is based on the industry-standard 32-bit Arm Cortex-M3 CPU and features a wide variety of communication peripherals, including Ethernet 1588, USB OTG with PHY, Controller Area Network (CAN), UART, SSI, I2C, and an external interface.

The real-time control subsystem is based on TI’s industry-leading proprietary 32-bit C28x floating-point CPU and features the most flexible and high-precision control peripherals, including ePWMs with fault protection, and encoders and captures—all as implemented by TI’s TMS320C2000™ Entry performance MCUs and Premium performance MCUs. In addition, the C28-CPU has been enhanced with the addition of the VCU instruction accelerator that implements efficient Viterbi, Complex Arithmetic, 16-bit FFTs, and CRC algorithms.

A high-speed analog subsystem and supplementary RAM memory is shared, along with on-chip voltage regulation and redundant clocking circuitry. Safety considerations also include Error Correction Code (ECC), parity, and code secure memory, as well as documentation to assist with system-level industrial safety certification.

下載 觀看有字幕稿的影片 影片

您可能會感興趣的類似產品

open-in-new 比較替代產品
功能相似於所比較的產品。
TMS320F28388D 現行 具有聯結管理器、2 個 C28x+CLA CPU、1.5MB 快閃記憶體、FPU64、CLB、ENET、EtherCAT 的 C2000™ 32 位元 MCU This product is the latest powerful 32-bit floating-point microcontroller unit (MCU) designed for advanced closed-loop control.

技術文件

找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 18
重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 F28M36x Concerto Microcontrollers datasheet (Rev. F) PDF | HTML 2020/6/23
* 使用指南 TMS320C28x Extended Instruction Sets Technical Reference Manual (Rev. C) 2019/10/29
* 使用指南 TMS320F28M35x and TMS320F28M36x Flash API Reference Guide (v1.53) (Rev. B) 2018/1/16
* 使用指南 Concerto F28M36x Technical Reference Manual (Rev. E) 2017/2/27
* 勘誤表 F28M36x Concerto™ MCUs Silicon Errata (Rev. L) PDF | HTML 2020/6/23
應用說明 Migrating Software From 8-Bit (Byte) Addressable CPU’s to C28x CPU (Rev. A) PDF | HTML 2023/4/19
應用說明 Calculating Useful Lifetimes of Embedded Processors (Rev. B) PDF | HTML 2019/5/7
使用指南 TMS320F28002x Flash API Version 1.57.00.00 2019/3/3
應用說明 MSL Ratings and Reflow Profiles (Rev. A) 2018/12/13
應用說明 Dual Motor Ctl Using FCL and Perf Analysis Using SFRA on TMS320F28379D LaunchPad (Rev. A) 2018/3/20
使用指南 Fast Current Loop (C28x) Library 2018/3/6
應用說明 Performance Analysis of Fast Current Loop (FCL) in Servo 2018/3/6
使用指南 TI-RTOS 2.20 User's Guide (Rev. M) 2016/6/17
應用說明 Calculator for CAN Bit Timing Parameters PDF | HTML 2016/3/22
使用指南 TMS320C28x DSP CPU and Instruction Set (Rev. F) 2015/4/10
應用說明 Calculating FIT for a Mission Profile 2015/3/24
使用指南 TMS320C28x Floating Point Unit and Instruction Set Reference Guide (Rev. B) 2014/1/23
應用說明 High Voltage Solar Inverter DC-AC Kit 2012/7/9

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

TMDSDOCK28M36 — H63C2 Concerto 實驗套件

德州儀器的 C2000 實驗套件是用於初期設備探索和測試的理想產品。Concerto H63C2 實驗套件具有一個擴充基座,可存取所有 controlCARD 訊號、模擬板區域以及 RS-232 與 JTAG 連接器。每個套件均包含 H63C2 controlCARD。controlCARD 是完整的板級模組,它利用業界標準的 DIMM 外形尺寸來提供薄型單板控制器解決方案。套件配備完整的 Code Composer StudioTM IDE v5 與 USB 纜線。

安裝 controlSUITE 即可存取所有軟體、文件與硬體文件。

支援產品和硬體
有庫存
限制:
??asset.out-of-stock-ti_zh_TW??
無法提供
子卡

TMDSHSECDOCK — HSEC180 controlCARD 基板擴充站

TMDSHSECDOCK 為一塊基板,可為相容的 HSEC180 架構 controlCARD 提供關鍵訊號的接頭針腳存取。提供模擬板區域以快速進行原型設計。電路板電源可由 USB 纜線或 5-V 桶式電源供應器供電。

支援產品和硬體
有庫存
限制:
??asset.out-of-stock-ti_zh_TW??
無法提供
偵錯探測器

TMDSEMU200-U — XDS200 USB 偵錯探測器

XDS200 是為 TI 嵌入式裝置偵錯的偵錯探測器(模擬器)。對於大多數裝置,建議使用較新、成本較低的 XDS110 (www.ti.com/tool/TMDSEMU110-U)。XDS200 支援單一 Pod 中廣泛的標準(IEEE1149.1、IEEE1149.7、SWD)。所有 XDS 偵錯探針在所有配備嵌入式追蹤緩衝器 (ETB) 的 Arm® 與 DSP 處理器中均支援核心與系統追蹤。

XDS200 透過 TI 20 接腳連接器(配備適用 TI 14 接腳、Arm Cortex® 10 接腳和 Arm 20 接腳的多重轉接器)連接到目標電路板,並透過 USB2.0 高速 (...)

支援產品和硬體
有庫存
限制:
??asset.out-of-stock-ti_zh_TW??
無法提供
偵錯探測器

TMDSEMU560V2STM-U — XDS560™ 軟體 v2 系統追蹤 USB 偵錯探測器

XDS560v2 是 XDS560™ 系列偵錯探測器中性能最高的,且同時支援傳統 JTAG 標準 (IEEE1149.1) 與 cJTAG (IEEE1149.7)。  請注意,其不支援序列線偵錯 (SWD)。

所有 XDS 偵錯探測器均在所有配備嵌入式追蹤緩衝器 (ETB) 的 ARM 與 DSP 處理器中支援核心與系統追蹤。  對於針腳上的追蹤,則需要 XDS560v2 PRO TRACE

XDS560v2 透過 MIPI HSPT 60 針腳接頭 (具有用於 TI 14 針腳、TI 20 針腳和 ARM 20 針腳的多轉接器) 連接到目標電路板,並透過 USB2.0 高速 (...)

支援產品和硬體
有庫存
限制:
??asset.out-of-stock-ti_zh_TW??
無法提供
偵錯探測器

TMDSEMU560V2STM-UE — XDS560v2 System Trace USB 與乙太網路偵錯探測器

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

支援產品和硬體
有庫存
限制:
??asset.out-of-stock-ti_zh_TW??
無法提供
介面轉接器

TMDSADAP180TO100 — 180 轉 100 針腳 DIMM 轉接器

The TMDSADAP180TO100 adapter allows the use of 180-Pin C2000 control cards with existing 100-Pin DIMM based evaluation tools.
支援產品和硬體
有庫存
限制:
??asset.out-of-stock-ti_zh_TW??
無法提供
韌體

USIT-3P-SECIC-HSM — Uni-Sentry SecIC-HSM 韌體

SecIC-HSM 旨在滿足 MCU/SoC 晶片所需的網路安全要求。HSM 韌體可應用於汽車、新能源、光伏、機器人、醫療保健與航空等領域。提供的網路安全功能包括安全開機、安全通訊 (SecOC)、安全診斷、安全儲存、安全更新、安全偵錯和金鑰管理。SecIC-HSM 的優點:一站式網路安全解決方案,具備跨晶片系列的全方位軟體相容性,擁有業界領先的性能,已在近 30 家 OEM 的量產車型中成功部署,累計出貨超過 300 萬套。

支援產品和硬體
韌體

USIT-3P-SECIC-PQC — Uni-Sentry SecIC-PQC 演算法韌體

Uni-Sentry 的安全解決方案採用 PQC 演算法,能夠抵抗量子電腦對傳統加密演算法所造成的解密威脅。PQC 韌體與硬體安全模組 (HSM) 進行協同優化,利用硬體加速與安全性強化,以提升加密演算法的執行效率與安全性。 


Uni-Sentry 持續監控全球量子運算的發展,並更新其演算法組合。當前的 PQC 產品功能包括:

  • SP 800-208:LMS 和 XMSS
  • FIPS 203 (ML-KEM):CRYSTALS-KYBER
  • FIPS 204 (ML-DSA):CRYSTALS-Dilithium
  • FIPS 205 (SLH-DSA): SPHINCS+ 

技術亮點 

  • 量子抗性認證:與 (...)
支援產品和硬體
模擬型號

F28M35x RFP BSDL Model (Rev. A)

SPRM558A.ZIP (4 KB) - BSDL 模型
支援產品和硬體
模擬型號

F28M35x RFP IBIS Model

SPRM557.ZIP (288 KB) - IBIS 模型
支援產品和硬體
模擬型號

F28M36x ZWT BSDL Model (Rev. A)

SPRM599A.ZIP (6 KB) - BSDL 模型
支援產品和硬體
模擬型號

F28M36x ZWT IBIS Model

SPRM628.ZIP (358 KB) - IBIS 模型
支援產品和硬體
設計工具

C2000-3P-SEARCH — C2000 第三方搜尋工具

TI has partnered with multiple companies to offer a wide range of solutions and services for TI C2000 devices. These companies can accelerate your path to production using C2000 devices. Download this search tool to quickly browse third-party details and find the right third-party to meet your (...)

支援產品和硬體
封裝 針腳 CAD 符號、佔位空間與 3D 模型
NFBGA (ZWT) 289 Ultra Librarian

訂購與品質

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片