ISO6761-Q1
- AEC-Q100 qualified with the following results:
- Device temperature Grade 1: –40°C to +125°C ambient operating temperature range
- Meets VDA320 isolation requirements
- 50 Mbps data rate
- Robust isolation barrier:
- High lifetime at 1500 V RMS working voltage
- Up to 5000 V RMS isolation rating
- Up to 10 kV surge capability
- ±150 kV/µs typical CMTI
- Wide supply range: 1.71 V to 1.89 V and 2.25 V to 5.5 V
- 1.71 V to 5.5 V level translation
- Default output high (ISO676x -Q1) and low (ISO676xF -Q1) options
- 1.6 mA per channel typical at 1 Mbps
- Low propagation delay: 11 ns typical
- Robust electromagnetic compatibility (EMC)
- System-level ESD, EFT, and surge immunity
- Low emissions
- Wide-SOIC (DW-16) Package
- Safety-Related Certifications:
- DIN EN IEC 60747-17 (VDE 0884-17)
- UL 1577 component recognition program
- IEC 62368-1, IEC 61010-1, IEC 60601-1 and GB 4943.1 certifications
The ISO676x -Q1 devices are high-performance, six-channel digital isolators ideal for cost-sensitive applications requiring up to 5000 V RMS isolation ratings per UL 1577. These devices are also certified by VDE, TUV, CSA, and CQC.
The ISO676x-Q1 devices provide high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by TI’s double capacitive silicon dioxide (SiO 2) insulation barrier. The ISO676x family of devices is available in all possible pin configurations such that all six channels are in the same direction, or one, two, or three channels are in reverse direction while the remaining channels are in forward direction. In the event of input power or signal loss, the default output is high for devices without suffix F and low for devices with suffix F. See Device Functional Modes section for further details.
Used in conjunction with isolated power supplies, these devices help prevent noise currents on data buses, such as CAN and LIN from damaging sensitive circuitry. Through innovative chip design and layout techniques, the electromagnetic compatibility of the ISO676x-Q1 devices has been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance. The ISO676x-Q1 family of devices is available in a 16-pin SOIC wide-body (DW) package and is a pin-to-pin upgrade to the older generations.
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技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | ISO676x-Q1 General-Purpose Six-Channel Automotive Reinforced Digital Isolators with Robust EMC datasheet (Rev. C) | PDF | HTML | 2023年 4月 27日 |
| Certificate | VDE Certificate for Reinforced Isolation for DIN EN IEC 60747-17 (Rev. S) | 2024年 2月 29日 | ||
| Certificate | CQC Certificate for ISOxxDWx (Rev. J) | 2023年 3月 27日 | ||
| Certificate | CSA Certificate for ISO676xDW (Rev. A) | 2023年 2月 15日 | ||
| Certificate | TUV Certificate for Isolation Devices (Rev. K) | 2022年 8月 5日 | ||
| Certificate | UL Certificate of Compliance File E181974 Vol 4 Sec 6 (Rev. P) | 2022年 8月 5日 | ||
| Functional safety information | ISO6761/ISO6761-Q1 Functional Safety FIT Rate, FMD and Pin FMA | PDF | HTML | 2022年 3月 9日 |
設計與開發
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DIGI-ISO-EVM — 通用數位隔離器評估模組
DIGI-ISO-EVM 是一款評估模組 (EVM)，可評估任何 TI 單通道、雙通道、三通道、四通道或六通道數位隔離器裝置，並提供五種不同封裝 - 8 接腳窄體 SOIC (D)、8 接腳寬體 SOIC (DWV)、16 接腳寬體 SOIC (DWW)、16 接腳超寬體 SOIC (DWW) 和 16 接腳 (DBQ) 封裝。EVM 具備足夠 Berg 接腳選項，可用於評估具最少外部零組件的裝置。
| 封裝 | 引腳 | 下載 |
|---|---|---|
| SOIC (DW) | 16 | 檢視選項 |
訂購與品質
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- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。