LMV321A-Q1
- AEC-Q100 qualified for automotive applications
- Temperature grade 1: –40°C to +125°C, TA
- Device HBM ESD classification level 2
- Device CDM ESD classification level C6
- Low input offset voltage: ±1 mV
- Rail-to-rail output
- Unity-gain bandwidth: 1 MHz
- Low broadband noise: 30 nV/√ Hz
- Low input bias current: 10 pA
- Low quiescent current: 70 µA/Ch
- Unity-gain stable
- Internal RFI and EMI filter
- Operational at supply voltages as low as 2.5 V
- Easier to stabilize with higher capacitive load due to resistive open-loop output impedance
- Extended temperature range: –40°C to 125°C
The LMV3xxA-Q1 family includes single (LMV321A-Q1), dual (LMV358A-Q1), and quad-channel (LMV324A-Q1) low-voltage (2.5 V to 5.5 V) automotive operational amplifiers (op amps) with rail-to-rail output swing capabilities. These op amps provide a cost-effective method for space-constrained applications such as infotainment and lighting where low-voltage operation and high capacitive-load drive are required. The capacitive-load drive of the LMV3xxA-Q1 family is 500 pF, and the resistive open-loop output impedance makes stabilization easier with much higher capacitive loads. These op amps are designed specifically for low-voltage operation (2.5 V to 5.5 V) with performance specifications similar to the LMV3xx-Q1 devices.
The robust design of the LMV3xxA-Q1 family simplifies circuit design. The op amps feature unity-gain stability, an integrated RFI and EMI rejection filter, and no-phase reversal in overdrive conditions.
The LMV3xxA-Q1 family is available in industry-standard packages such as SOIC, MSOP, SOT-23, and TSSOP packages.
您可能會感興趣的類似產品
引腳對引腳且具備與所比較裝置相同的功能
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | LMV321A-Q1, LMV358A-Q1, LMV324A-Q1 Automotive Low-Voltage Rail-to-Rail Output Operational Amplifiers datasheet (Rev. D) | PDF | HTML | 2023年 4月 17日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
DIP-ADAPTER-EVM — DIP 轉接器評估模組
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
DIYAMP-EVM — 通用自製 (DIY) 放大器電路評估模組
The DIYAMP-EVM is a unique evaluation module (EVM) family that provides engineers and do it yourselfers (DIYers) with real-world amplifier circuits, enabling you to quickly evaluate design concepts and verify simulations. It is available in three industry-standard packages (SC70, SOT23, SOIC) and (...)
ANALOG-ENGINEER-CALC — 類比工程師計算機
CIRCUIT060013 — 具有 T 網路回饋電路的反相放大器
CIRCUIT060074 — 具有比較器電路的高壓側電流感測
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-23 (DBV) | 5 | Ultra Librarian |
SOT-SC70 (DCK) | 5 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點