LMV614
- Supply Values: 1.8 V (Typical)
- Ensured 1.8-V, 2.7-V, and 5-V Specifications
- Output Swing:
- 80 mV From Rail With 600-Ω Load
- 30 mV From Rail With 2-kΩ Load
- VCM = 200 mV Beyond Rails
- 100-µA Supply Current (Per Channel)
- 1.4-MHz Gain Bandwidth Product
- Maximum VOS = 4 mV
- Temperature Range: −40°C to +125°C
- Create a Custom Design Using the LMV61x With the WEBENCH® Power Designer
The LMV61x devices are single, dual, and quad low-voltage, low-power operational amplifiers (op amps). They are designed specifically for low-voltage, general-purpose applications. Other important product characteristics are, rail-to-rail input or output, low supply voltage of 1.8 V and wide temperature range. The LMV61x input common mode extends
200 mV beyond the supplies and the output can swing rail-to-rail unloaded and within 30 mV with 2-kΩ load at 1.8-V supply. The LMV61x achieves a gain bandwidth of 1.4 MHz while drawing 100-µA (typical) quiescent current.
The industrial-plus temperature range of −40°C to 125°C allows the LMV61x to accommodate a broad range of extended environment applications.
The LMV611 is offered in the tiny 5-pin SC70 package, the LMV612 in space-saving 8-pin VSSOP and SOIC packages, and the LMV614 in 14-pin TSSOP and SOIC packages. These small package amplifiers offer an ideal solution for applications requiring minimum PCB footprint. Applications with area constrained PCB requirements include portable and battery-operated electronics.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | LMV61x Single, Dual, and Quad, 1.4-MHz, Low-Power, General-Purpose 1.8-V Operational Amplifiers datasheet (Rev. D) | PDF | HTML | 2017年 3月 29日 |
E-book | Analog Engineer’s Pocket Reference Guide Fifth Edition (Rev. C) | 2018年 11月 30日 | ||
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
ANALOG-ENGINEER-CALC — 類比工程師計算機
CIRCUIT060013 — 具有 T 網路回饋電路的反相放大器
CIRCUIT060074 — 具有比較器電路的高壓側電流感測
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
TIDA-00661 — 適用於空氣斷路器的高解析度、快速啟動類比前端參考設計
TIDA-00847 — 採用具有整合電源的數位隔離器且尺寸和成本經最佳化的二進位模組參考設計
TIDA-00809 — 適用於寬 AC/DC 輸入且符合 EMC 規範的分組隔離式雙通道二進位輸入模組參考設計
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 14 | Ultra Librarian |
TSSOP (PW) | 14 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點