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MSPM0G3519

現行

具有雙區 512kB 快閃記憶體、128kB SRAM、2xCAN-FD、2xADC、DAC、COMP 的 80 MHz ARM® Cortex®-M0+ MCU

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MSPM0G3519

現行
產品規格表 立即訂購

產品詳細資料

CPU Arm Cortex-M0+ Frequency (MHz) 80 Flash memory (kByte) 512 RAM (kByte) 128 ADC type 12-bit SAR Features 5-V-tolerant I/Os, AES encryption, CAN FD, Comparator, DAC, DMA, MATHACL, RTC UART 7 CAN (#) CAN-FD Number of ADC channels 15, 19, 27 SPI 3 Hardware accelerators Trigonometric math accelerator Edge AI enabled Yes Operating temperature range (°C) -40 to 125 Rating Catalog Communication interface CAN-FD, I2C, LIN, SPI, UART Operating system FreeRTOS, Zephyr RTOS Nonvolatile memory (kByte) 512 Number of GPIOs 28, 44, 60, 74, 94 Number of I2Cs 3 Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure communication, Secure debug, Secure firmware & software update, Secure storage, Software IP protection
CPU Arm Cortex-M0+ Frequency (MHz) 80 Flash memory (kByte) 512 RAM (kByte) 128 ADC type 12-bit SAR Features 5-V-tolerant I/Os, AES encryption, CAN FD, Comparator, DAC, DMA, MATHACL, RTC UART 7 CAN (#) CAN-FD Number of ADC channels 15, 19, 27 SPI 3 Hardware accelerators Trigonometric math accelerator Edge AI enabled Yes Operating temperature range (°C) -40 to 125 Rating Catalog Communication interface CAN-FD, I2C, LIN, SPI, UART Operating system FreeRTOS, Zephyr RTOS Nonvolatile memory (kByte) 512 Number of GPIOs 28, 44, 60, 74, 94 Number of I2Cs 3 Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure communication, Secure debug, Secure firmware & software update, Secure storage, Software IP protection
LQFP (PM) 64 144 mm² 12 x 12 LQFP (PN) 80 196 mm² 14 x 14 LQFP (PT) 48 81 mm² 9 x 9 LQFP (PZ) 100 256 mm² 16 x 16 NFBGA (ZAW) 100 81 mm² 9 x 9 VQFN (RGZ) 48 49 mm² 7 x 7 VQFN (RHB) 32 25 mm² 5 x 5
  • Core
    • Arm 32-bit Cortex M0+ CPU with memory protection unit, frequency up to 80MHz
  • PSA-L1 Certification targeted
  • Operating characteristics
    • Extended temperature: –40°C up to 125°C
    • Wide supply voltage range: 1.62V to 3.6V
  • Memories
    • Up to 512KB of flash memory with error correction code (ECC)

      • Dual-bank with address swap for OTA updates

    • 16KB data flash bank with ECC protection
    • 128KB total SRAM
      • SRAM (Bank 0): 64kB SRAM with ECC protection or hardware parity, and retention down to STANDBY mode
      • SRAM (Bank 1): 64kB SRAM with retention down to STOP mode
  • High-performance analog peripherals
    • Two simultaneous sampling 12-bit 4Msps analog-to-digital converters (ADC) with up to 27 external channels
      • 14-bit effective resolution at 250ksps with hardware averaging
    • Three high-speed comparators (COMP) with integrated 8-bit reference DACs
      • 32ns propagation delay in high-speed mode
      • Support low-power mode operation down to <1µA
    • One 12-bit 1Msps digital-to-analog converter (DAC) with integrated output buffer
    • Programmable analog connections between ADC, COMP and DAC
    • Configurable 1.4V or 2.5V internal shared voltage reference (VREF)
    • Integrated temperature sensor
  • Optimized low-power modes
    • RUN: 123µA/MHz (CoreMark)
    • SLEEP: 38µA/MHz
    • STOP: 223µA at 4MHz
    • STANDBY: 1.7µA at 32kHz with RTC and SRAM Bank 0 and state retention
    • SHUTDOWN: 92nA with IO wake-up capability
  • Intelligent digital peripherals
    • 12-channel DMA controller
    • Math accelerator supports DIV, SQRT, MAC and TRIG computations
    • Nine timers support up to 28 PWM channels
      • Two 16-bit general-purpose timers support QEI
      • Four 16-bit general-purpose timers support low-power operation in STANDBY mode
      • One 32-bit general-purpose timer
      • Two 16-bit advanced timers with deadband support and complimentary outputs up to 12 PWM channels
    • Two windowed watchdog timers (WWDT), one independent watchdog timer (IWDT)
    • RTC with alarm and calendar mode
  • Enhanced communication interfaces
    • Seven UART interfaces
      • Two supporting LIN, IrDA, DALI, Smart Card, Manchester
      • Three supporting low-power operation in STANDBY mode
    • Three I2C interfaces supporting up to FM+ (1Mbit/s), SMBus/PMBus, and wakeup from STOP mode
    • Three SPI interfaces, with one supporting up to 32Mbits/s
    • Two Controller Area Network (CAN) interfaces support CAN 2.0 A or B and CAN-FD
  • Clock system
    • Internal 4 to 32MHz oscillator (SYSOSC) with up to ±1.2% accuracy
    • Phase-locked loop (PLL) up to 80MHz
    • Internal 32kHz low-frequency oscillator (LFOSC) with ±3% accuracy
    • External 4 to 48MHz crystal oscillator (HFXT)
    • External 32kHz crystal oscillator (LFXT)
    • External clock input
  • Data integrity and encryption
    • AES-128/256 accelerator with support for GCM/GMAC, CCM/CBC-MAC, CBC, CTR
    • Secure key storage for up to four AES keys
    • Flexible firewalls for protecting code and data
    • True random number generator (TRNG)
    • Cyclic redundancy checker (CRC-16, CRC-32)
  • Flexible I/O features
    • Up to 94 GPIOs
      • Two 5V-tolerant open-drain IOs
      • Three high-drive IOs with 20mA drive strength
      • Four high-speed IOs
  • Development support
    • 2-pin serial wire debug (SWD)
  • Package options
    • 100-pin nFBGA (ZAW) (0.8mm pitch)
    • 100-pin LQFP (PZ) (0.5mm pitch)
    • 80-pin LQFP (PN) (0.5mm pitch)
    • 64-pin LQFP (PM) (0.5mm pitch)
    • 48-pin LQFP (PT) (0.5mm pitch)
    • 48-pin VQFN (RGZ) (0.5mm pitch)
    • 42-pin DSBGA (YCJ) (0.35mm pitch) - Preview
    • 32-pin VQFN (RHB) (0.5mm pitch)
  • Family members (also see Device Comparison)
    • MSPM0G1518: 256KB flash, 128KB RAM
    • MSPM0G1519: 512KB flash, 128KB RAM
    • MSPM0G3518: 256KB flash, 128KB RAM
    • MSPM0G3519: 512KB flash, 128KB RAM
  • Development kits and software (also see Tools and Software)
  • Core
    • Arm 32-bit Cortex M0+ CPU with memory protection unit, frequency up to 80MHz
  • PSA-L1 Certification targeted
  • Operating characteristics
    • Extended temperature: –40°C up to 125°C
    • Wide supply voltage range: 1.62V to 3.6V
  • Memories
    • Up to 512KB of flash memory with error correction code (ECC)

      • Dual-bank with address swap for OTA updates

    • 16KB data flash bank with ECC protection
    • 128KB total SRAM
      • SRAM (Bank 0): 64kB SRAM with ECC protection or hardware parity, and retention down to STANDBY mode
      • SRAM (Bank 1): 64kB SRAM with retention down to STOP mode
  • High-performance analog peripherals
    • Two simultaneous sampling 12-bit 4Msps analog-to-digital converters (ADC) with up to 27 external channels
      • 14-bit effective resolution at 250ksps with hardware averaging
    • Three high-speed comparators (COMP) with integrated 8-bit reference DACs
      • 32ns propagation delay in high-speed mode
      • Support low-power mode operation down to <1µA
    • One 12-bit 1Msps digital-to-analog converter (DAC) with integrated output buffer
    • Programmable analog connections between ADC, COMP and DAC
    • Configurable 1.4V or 2.5V internal shared voltage reference (VREF)
    • Integrated temperature sensor
  • Optimized low-power modes
    • RUN: 123µA/MHz (CoreMark)
    • SLEEP: 38µA/MHz
    • STOP: 223µA at 4MHz
    • STANDBY: 1.7µA at 32kHz with RTC and SRAM Bank 0 and state retention
    • SHUTDOWN: 92nA with IO wake-up capability
  • Intelligent digital peripherals
    • 12-channel DMA controller
    • Math accelerator supports DIV, SQRT, MAC and TRIG computations
    • Nine timers support up to 28 PWM channels
      • Two 16-bit general-purpose timers support QEI
      • Four 16-bit general-purpose timers support low-power operation in STANDBY mode
      • One 32-bit general-purpose timer
      • Two 16-bit advanced timers with deadband support and complimentary outputs up to 12 PWM channels
    • Two windowed watchdog timers (WWDT), one independent watchdog timer (IWDT)
    • RTC with alarm and calendar mode
  • Enhanced communication interfaces
    • Seven UART interfaces
      • Two supporting LIN, IrDA, DALI, Smart Card, Manchester
      • Three supporting low-power operation in STANDBY mode
    • Three I2C interfaces supporting up to FM+ (1Mbit/s), SMBus/PMBus, and wakeup from STOP mode
    • Three SPI interfaces, with one supporting up to 32Mbits/s
    • Two Controller Area Network (CAN) interfaces support CAN 2.0 A or B and CAN-FD
  • Clock system
    • Internal 4 to 32MHz oscillator (SYSOSC) with up to ±1.2% accuracy
    • Phase-locked loop (PLL) up to 80MHz
    • Internal 32kHz low-frequency oscillator (LFOSC) with ±3% accuracy
    • External 4 to 48MHz crystal oscillator (HFXT)
    • External 32kHz crystal oscillator (LFXT)
    • External clock input
  • Data integrity and encryption
    • AES-128/256 accelerator with support for GCM/GMAC, CCM/CBC-MAC, CBC, CTR
    • Secure key storage for up to four AES keys
    • Flexible firewalls for protecting code and data
    • True random number generator (TRNG)
    • Cyclic redundancy checker (CRC-16, CRC-32)
  • Flexible I/O features
    • Up to 94 GPIOs
      • Two 5V-tolerant open-drain IOs
      • Three high-drive IOs with 20mA drive strength
      • Four high-speed IOs
  • Development support
    • 2-pin serial wire debug (SWD)
  • Package options
    • 100-pin nFBGA (ZAW) (0.8mm pitch)
    • 100-pin LQFP (PZ) (0.5mm pitch)
    • 80-pin LQFP (PN) (0.5mm pitch)
    • 64-pin LQFP (PM) (0.5mm pitch)
    • 48-pin LQFP (PT) (0.5mm pitch)
    • 48-pin VQFN (RGZ) (0.5mm pitch)
    • 42-pin DSBGA (YCJ) (0.35mm pitch) - Preview
    • 32-pin VQFN (RHB) (0.5mm pitch)
  • Family members (also see Device Comparison)
    • MSPM0G1518: 256KB flash, 128KB RAM
    • MSPM0G1519: 512KB flash, 128KB RAM
    • MSPM0G3518: 256KB flash, 128KB RAM
    • MSPM0G3519: 512KB flash, 128KB RAM
  • Development kits and software (also see Tools and Software)

MSPM0Gx51x microcontrollers (MCUs) are part of the MSP highly integrated, ultra-low-power 32-bit MCU family based on the enhanced Arm Cortex-M0+ 32-bit core platform, operating at up to 80MHz frequency. These MCUs offer a blend of cost optimization and design flexibility for applications requiring 256KB to 512KB of flash memory in small packages or high pin count packages (up to 100 pins). These devices include dual CAN-FD controllers, cybersecurity enablers, high performance integrated analog, and provide excellent low power performance across the operating temperature range.

The device has up to 512KB of embedded flash program memory with built-in error correction code (ECC) and up to 128KB SRAM (with ECC and parity protection for the first 64kB). The flash memory is organized into two main banks to support field firmware updates, with address swap support provided between the two main banks.

Flexible cybersecurity enablers can be used to support secure boot, secure in-field firmware updates, IP protection (execute-only memory), key storage, and more. Hardware acceleration is provided for a variety of AES symmetric cipher modes, as well as a TRNG entropy source. The cybersecurity architecture is pending Arm® PSA Level 1 certification.

A set of high performance analog modules is provided, such as two simultaneously sampling 12-bit, 4Msps ADCs supporting up to 27 external channels, on-chip voltage reference (1.4V or 2.5V), one 12-bit 1Msps DAC, and three comparators operable in low-power and high-speed modes with additional built-in 8-bit reference DACs .

The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration allowing for customers find the MCU that meets their project’s needs. The MSPM0 MCU platform combines the Arm Cortex-M0+ platform with a holistic ultra-low-power system architecture, allowing system designers to increase performance while reducing energy consumption.

MSPM0Gx51x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad available for purchase. TI also provides a free MSPM0 Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

For complete module descriptions, see the MSPM0 G-Series 80MHz Microcontrollers Technical Reference Manual.

MSPM0Gx51x microcontrollers (MCUs) are part of the MSP highly integrated, ultra-low-power 32-bit MCU family based on the enhanced Arm Cortex-M0+ 32-bit core platform, operating at up to 80MHz frequency. These MCUs offer a blend of cost optimization and design flexibility for applications requiring 256KB to 512KB of flash memory in small packages or high pin count packages (up to 100 pins). These devices include dual CAN-FD controllers, cybersecurity enablers, high performance integrated analog, and provide excellent low power performance across the operating temperature range.

The device has up to 512KB of embedded flash program memory with built-in error correction code (ECC) and up to 128KB SRAM (with ECC and parity protection for the first 64kB). The flash memory is organized into two main banks to support field firmware updates, with address swap support provided between the two main banks.

Flexible cybersecurity enablers can be used to support secure boot, secure in-field firmware updates, IP protection (execute-only memory), key storage, and more. Hardware acceleration is provided for a variety of AES symmetric cipher modes, as well as a TRNG entropy source. The cybersecurity architecture is pending Arm® PSA Level 1 certification.

A set of high performance analog modules is provided, such as two simultaneously sampling 12-bit, 4Msps ADCs supporting up to 27 external channels, on-chip voltage reference (1.4V or 2.5V), one 12-bit 1Msps DAC, and three comparators operable in low-power and high-speed modes with additional built-in 8-bit reference DACs .

The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration allowing for customers find the MCU that meets their project’s needs. The MSPM0 MCU platform combines the Arm Cortex-M0+ platform with a holistic ultra-low-power system architecture, allowing system designers to increase performance while reducing energy consumption.

MSPM0Gx51x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad available for purchase. TI also provides a free MSPM0 Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

For complete module descriptions, see the MSPM0 G-Series 80MHz Microcontrollers Technical Reference Manual.
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重要文件 類型 標題 格式選項 日期
* Data sheet MSPM0Gx51x Mixed-Signal Microcontrollers With CAN-FD Interface datasheet (Rev. B) PDF | HTML 2025年 10月 13日
* Errata MSPM0Gx51x Mixed-Signal Microcontrollers Errata (Rev. D) PDF | HTML 2025年 12月 10日
* User guide MSPM0 G-Series 80-MHz Microcontrollers Technical Reference Manual (Rev. C) 2025年 8月 19日
Application note Live Firmware Update via Flash Bank Swap PDF | HTML 2026年 1月 30日
Application note Dual Wheel Control Design in Projector based on MSPM0 MCU PDF | HTML 2026年 1月 23日
Application note Cybersecurity Enablers in MSPM0 MCUs (Rev. A) PDF | HTML 2025年 12月 10日
Application note EMC Improvement Guide for MSPM0 (Rev. A) PDF | HTML 2025年 12月 2日
Application note Local Interconnect Network (LIN) Automatic Baud Rate Detection Mechanism for MSPM0 Devices PDF | HTML 2025年 11月 25日
Application note MSPM0 ADC Noise Analysis and Application (Rev. A) PDF | HTML 2025年 11月 14日
Subsystem design I2C IO Expander PDF | HTML 2025年 9月 30日
Subsystem design ADC to I2C (Rev. A) PDF | HTML 2025年 9月 10日
Subsystem design ADC to UART (Rev. A) PDF | HTML 2025年 9月 9日
Subsystem design Thermistor Temperature Sensing (Rev. A) PDF | HTML 2025年 9月 9日
Subsystem design ADC to SPI (Rev. A) PDF | HTML 2025年 8月 27日
Subsystem design Digital FIR Filter (Rev. A) PDF | HTML 2025年 8月 27日
User guide MSPM0 MCUs Development Guide (Rev. G) PDF | HTML 2025年 8月 27日
Subsystem design Digital IIR Filter (Rev. A) PDF | HTML 2025年 8月 26日
Subsystem design Power Sequencer (Rev. A) PDF | HTML 2025年 8月 25日
Subsystem design 5V Interface (Rev. A) PDF | HTML 2025年 8月 20日
Subsystem design Data Sensor Aggregator Subsystem Design (Rev. A) PDF | HTML 2025年 8月 20日
Subsystem design CAN to I2C Bridge (Rev. A) PDF | HTML 2025年 8月 19日
Subsystem design CAN to SPI Bridge (Rev. A) PDF | HTML 2025年 8月 19日
Subsystem design CAN to UART bridge (Rev. A) PDF | HTML 2025年 8月 19日
Subsystem design PWM Control Using Push-Buttons PDF | HTML 2025年 8月 14日
Subsystem design Using MSPM0 as a Watchdog Timer PDF | HTML 2025年 8月 14日
Subsystem design Emulate EEPROM with FLASH (Type A) (Rev. A) PDF | HTML 2025年 8月 13日
Functional safety information Functional Safety Manual for MSPM0Gx51x PDF | HTML 2025年 8月 13日
Subsystem design Emulate EEPROM With FLASH (Type B) (Rev. A) PDF | HTML 2025年 8月 6日
Subsystem design Frequency Counter: Tone Detection (Rev. A) PDF | HTML 2025年 8月 6日
Analog Design Journal 在馬達控制中選擇位置感測器 PDF | HTML 2025年 7月 10日
Subsystem design Simultaneous Sampling of ADCs PDF | HTML 2025年 6月 30日
Application note Capturing PWM 0% to 100% Duty Cycle with MSPM0 MCU PDF | HTML 2025年 6月 12日
Application note Migration Guide From STM8 to MSPM0 (Rev. A) PDF | HTML 2025年 5月 21日
Application note Getting Started with the MCAN (CAN FD) Module on MSPM0 MCUs PDF | HTML 2025年 4月 29日
Application note IAR to CCS Project Porting Guide PDF | HTML 2025年 3月 15日
White paper MSPM0 MCU Advantages in Automotive Application PDF | HTML 2025年 3月 11日
Application note LIN Basics and Implementation on MSPM0 PDF | HTML 2025年 2月 21日
Application note Laser Speckle Reduction Solution in Projector based on MSPM0 MCU PDF | HTML 2025年 2月 20日
User guide Migration Guide From NXP to MSPM0 PDF | HTML 2025年 2月 3日
Application note Closed Loop Constant Power Drive to Simplify Heater Element Control and Extend Battery Life PDF | HTML 2025年 1月 29日
Application note Flash Multi Bank Feature in MSPM0 Family PDF | HTML 2025年 1月 8日
Application note BQ79616 Control Based on MSPM0 Through UART to CAN PDF | HTML 2024年 12月 16日
Application note MSPM0G3507 Low Power Test and Guidance PDF | HTML 2024年 10月 18日
Application note Understanding the MSPM0 Debug Subsystem PDF | HTML 2024年 9月 23日
Application note A2L Refrigerant Standard Overview and TI Mitigation Control Board Designs for Designers PDF | HTML 2024年 9月 16日
Application note TPS929xxx LED Driver Control Using MSPM0 Through UART Over CAN PDF | HTML 2024年 9月 4日
Application note SPI to CAN Bridge on MSPM0 MCUs PDF | HTML 2024年 8月 28日
Application brief Bridge Design Between CAN and SPI with MSPM0 MCUs PDF | HTML 2024年 6月 17日
Application brief Bridge Design Between CAN and UART with MSPM0 MCUs PDF | HTML 2024年 6月 17日
Application brief Bridge Design between CAN and I2C with MSPM0 MCUs 2024年 6月 17日
Application note Designing Temperature Monitoring Systems with NTC and RTD PDF | HTML 2024年 5月 15日
Application brief Automotive Seat Comfort Module Using MSPM0 PDF | HTML 2024年 5月 1日
Application note Realization of Password-Protected Debug Based on Software PDF | HTML 2024年 3月 6日
Technical article 為什麼互通性對於不斷發展的電動車充電市場很重要 PDF | HTML 2024年 1月 26日
Product overview Realizing UWB Passive Entry Passive Start (PEPS) Design with MSPM0 MCU PDF | HTML 2024年 1月 12日
Product overview Realizing HVAC FAN Control Design with MSPM0 MCU PDF | HTML 2023年 12月 21日
Application note MSPM0 Enables Cost-Effective Field Transmitter Applications PDF | HTML 2023年 12月 15日
Application note Operating Time of MSPM0 Powered by a Capacitor PDF | HTML 2023年 10月 3日
Application note EEPROM Emulation Type A Solution PDF | HTML 2023年 4月 18日
Application note EEPROM Emulation Type B Design PDF | HTML 2023年 4月 11日
Application brief Increasing Flexibility in Your Battery Management Designs With a Low-Cost MSPM0 PDF | HTML 2023年 3月 2日
Application brief Optimizing Field Sensor and Transmitter Applications With MSPM0 MCUs PDF | HTML 2023年 3月 2日
Application brief Simplifying Pulse Oximeter Designs With Low-Cost Highly Integrated MSPM0 MCUs PDF | HTML 2023年 3月 2日
Application note MSPM0 G-Series MCUs Power Optimization Guide PDF | HTML 2023年 2月 22日
White paper MSPM0: Idea to Product With Easy-to-Use Tools, Software, and Academy PDF | HTML 2023年 2月 22日
Application note Make System Design Easy With MSPM0 Precision Analog PDF | HTML 2023年 2月 22日
Application note MSPM0L or MSPM0G: How to Pick the Right MSP Microcontroller for Your Application PDF | HTML 2022年 12月 13日

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

LP-MSPM0G3519 — LP-MSPM0G3519 evaluation module

LP-MSPM0G3519 LaunchPad™ 開發套件是基於 MSPM0G3519 的易用型評估模組 (EVM)。其包含開始在 MSPM0G3519 M0+ MCU 平台上開發所需的一切，包括用於編程、偵錯和能源量測的板載偵錯探測器。電路板包含三個按鈕、兩個 LED (一個是 RGB LED) 和超過 80 個針腳。運用最佳配置的 ADC 和 DAC 低通濾波器預留位置，以及 Launchpad 背面提供的外部參考選項，改善類比結果。

使用指南: PDF | HTML
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開發板

ALGO-3P-UISP1-TI — 適用於德州儀器裝置的 Algocraft μISP1 編程器

μISP 可以連接到主機 PC (內建 RS-232、USB、LAN 連接) 或獨立模式工作。

在單機模式下，只要按下「開始」按鈕或透過一些 TTL 控制線，就可以執行編程週期。

其緊湊的尺寸和多功能性可輕鬆整合到生產環境、手動和自動化程序中。

從：Algocraft
造訪合作夥伴網站
偵錯探測器

TMDSEMU110-U — XDS110 JTAG 偵錯探測器

德州儀器 XDS110 是一種全新的偵錯探測器 (模擬器) 類別，適用於 TI 嵌入式處理器。XDS110 取代 XDS100 系列，可在單一 Pod 中支援更廣泛的標準 (IEEE1149.1、IEEE1149.7、SWD)。同時，所有 XDS 偵錯探針在所有配備嵌入式追蹤緩衝器 (ETB) 的 Arm® 與 DSP 處理器中均支援核心與系統追蹤。  對於針腳上的核心追蹤，則需要 XDS560v2 PRO TRACE。

德州儀器 XDS110 透過 TI 20 針腳連接器（具有用於 TI 14 針腳和 Arm 10 針腳和 Arm 20 針腳的多轉接器）連接到目標電路板，並透過 USB2.0 (...)

使用指南: PDF
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偵錯探測器

TMDSEMU200-U — XDS200 USB 偵錯探測器

XDS200 是為 TI 嵌入式裝置偵錯的偵錯探測器（模擬器）。對於大多數裝置，建議使用較新、成本較低的 XDS110 (www.ti.com/tool/TMDSEMU110-U)。XDS200 支援單一 Pod 中廣泛的標準（IEEE1149.1、IEEE1149.7、SWD）。所有 XDS 偵錯探針在所有配備嵌入式追蹤緩衝器 (ETB) 的 Arm® 與 DSP 處理器中均支援核心與系統追蹤。

XDS200 透過 TI 20 接腳連接器（配備適用 TI 14 接腳、Arm Cortex® 10 接腳和 Arm 20 接腳的多重轉接器）連接到目標電路板，並透過 USB2.0 高速 (...)

TI.com 無法提供
偵錯探測器

SEGGR-3P-J-LINK — 偵錯探針的 SEGGER J-Link 系列

SEGGER J-Link 是業界領先的嵌入式系統開發除錯探針系列。J-Link 以其卓越的速度、可靠性與多功能性著稱，已成為全球開發人員的首選工具。二十多年來，這些探針在各種嵌入式應用與產業中，對於高效率的除錯、程式燒錄與效能分析都扮演了不可或缺的角色。

J-Link 除錯探針是優化除錯與快閃記憶體燒錄體驗的首選解決方案。使用者可享受破紀錄的快閃載入器、最高可達 4 MB/s 的 RAM 下載速度，以及在微控制器快閃記憶體中設定無限制斷點的能力。這種速度、彈性與可靠性的組合，使 SEGGER J-Link 成為任何嵌入式系統開發人員不可或缺的工具。

若要檢視 J-Link 支援的 TI (...)

從：SEGGER
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偵錯探測器

SEGGR-3P-J-TRACE — 串流追蹤探針的 SEGGER J-Trace 系列

SEGGER 的 J-Trace 是一款專業的串流追蹤探針，配備完整的功能清單，專為滿足嵌入式開發人員的除錯需求而設計，並提供最佳的追蹤體驗。具備無限制串流追蹤、即時程式碼剖析與即時程式碼覆蓋率等功能，J-Trace 可幫助開發人員有效隔離並識別難以發現的程式缺陷。

J-Trace 支援多平台，包括 Windows、macOS 及 Linux，應用範圍廣泛。它與大多數熱門 IDE 相容，確保能無縫整合進各種開發環境中。

SEGGER 已針對下列 TI 裝置進行 J-Trace 測試，並建立參考專案以驗證（串流）追蹤功能：AM3359、AM3517、Jacinto 7 (...)

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偵錯探測器

TSK-3P-BLUEBOX — TASKING BlueBox hardware debugger

TASKING’s Debug, Trace, and Test tools offer comprehensive solutions for efficient debugging, tracing, and testing of TI's embedded systems. The scalable TASKING BlueBox debuggers allow users to easily flash, debug, and test across TI's portfolio. Development on TI hardware is made even easier with (...)

從：TASKING Germany GmbH
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硬體程式設計工具

ACROVIEW-3P-AP6000 — AP6000 programmer support all TI programmable chips, including EP Product, Power ICs, and Gauge ICs

AP6000, launched by Acroview, is a universal programmer designed to support TI ICs across all series. Leveraging Acroview's highly skilled algorithm R&D engineering team, it delivers the fastest chip support speed in the industry.The AP6000 is capable of programming 8 chips simultaneously, and (...)

從：Acroview Technology Co.,Ltd.
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硬體程式設計工具

ACROVIEW-3P-AP8000 — AP8000 Universal Programming System, including all TI programmable chips.

AP8000 is a leading technology platform of Universal Programming developed by Acroview. We have an accomplished team of algorithm R&D engineers, to offer the fastest chip support software development service among the industry. The AP8000 can support the programming of 8 chips simultaneously. (...)

從：Acroview Technology Co.,Ltd.
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硬體程式設計工具

ALGO-3P-WRITENOW — Algocraft WriteNow！程式設計工具

WriteNow! 系統內編程器系列是可編程產業的一大突破。此編程器支援多家製造商的眾多裝置 (例如微控制器、記憶體、CPLD 與其他可編程裝置)。其尺寸精巧，便於整合至 ATE 與固定裝置。編程器可單機運作，或透過內建的 RS-232、LAN 與 USB 連接埠與主機電腦連線，並隨附操作簡易的工具軟體。

從：Algocraft
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硬體程式設計工具

C-GANG — 適用於獨立式與整合式快閃且快速可靠的 gang 編程解決方案

C-GANG 是一款低成本的 gang 程式設計工具，可同時編程多達六個相同的目標。本產品相容於各種 TI 微控制器，包括 MSPM0、MSP430 及 C2000 裝置。

從：Elprotronic Inc.
TI.com 無法提供
硬體程式設計工具

OPTEEQ-3P-SG400-SERIES — OPTEEQ SG400 系列通用型在板量產燒錄器

OPTEEQ Technologies 是擁有十多年半導體晶片燒錄深厚專業知識的市場領導者。OPTEEQ SG400E 燒錄器提供 1-32 通道選項。在保留 SG400 系列高穩定性與超快燒錄速度的同時，它透過全新設計的獨立電源系統滿足客戶的多樣化應用場景。同時新增 VCC/VPP 快速放電電路與雙過載保護電路，使其成為汽車電子、工業控制與其他行業中 PCB 大量生產與測試的理想選擇，幫助客戶達成百萬級晶片燒錄零缺陷的目標。

從：OPTEEQ Technologies
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硬體程式設計工具

SOFTM-3P-FLASHRUNNER-NXG — SMH Technologies FlashRunner LAN 2.0 下一代編程工具

FlashRunner LAN2.0 NeXt Generation 是一款通用的系統內編程解決方案（ISP），提供 1 至 4 個平行通道。由於簡單的遠程會話，可以啟用更多的通道（從 2 到 4）。FlashRunner LAN2.0 NXG 設計為整合在固定裝置中，因此極為精巧緊湊。全新圖形使用者介面（Workbench）可縮減整體配置工作，只要客戶按幾下滑鼠就能建立工作專案，並偵測目標裝置與客戶韌體之間的不相符情況，以及電源供應器設定。
若要檢視支援的 TI 裝置，請參閱 https://smh-tech.com/category/texas-instruments/。

從：SMH Technologies
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軟體開發套件 (SDK)

MSPM0-SDK — MSPM0 Software Development Kit (SDK)

The MSPM0 SDK provides the ultimate collection of software, tools and documentation to accelerate the development of applications for the MSPM0 MCU platform under a single software package.

支援產品和硬體

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瀏覽 下載選項
驅動程式或資料庫

MSPM0-DIAGNOSTIC-LIB — MSPM0 diagnostic library

The MSPM0 diagnostic library software development kit (SDK) is a collection of functional safety software to assist customers to meet their functional safety diagnostic requirements.

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要求
開發模組 (EVM) 的 GUI

LP-MSPM0G3507-OOBE — Out-of-box experience GUI for LP-MSPM0G3507

Out-of-box experience GUI for LP-MSPM0G3507
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啟動
開發模組 (EVM) 的 GUI

MSPM0-ANALOG-CONFIGURATOR — Analog Configurator for MSPM0

The MSPM0 analog configurator is a graphical configuration tool designed to simplify and accelerate the design and enablement of an analog signal chain using a MSPM0 device with no traditional coding development necessary.

The tool uses an intuitive GUI to configure a signal chain using the high (...)

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啟動 下載選項
快速入門

CCSTUDIO-STARTHUB — Example application browser

Explore a vast library of example projects, categorized by application type, with support for multiple development environments
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啟動 下載選項
快速入門

MSP-MOTOR-CONTROL — MSPM0 Firmware solutions for motor control applications

MSP Motor Control is a collection of software, tools and examples to spin motors in 30 minutes or less with MSPM0 Arm® Cortex® M0+ MCUs and popular motor driver solutions.

MSP Motor Control provides examples for supported hardware kits to spin brushed, stepper, and three-phase motors with sensored (...)

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開始使用 下載選項
快速入門

TI-DEVELOPER-ZONE — Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
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開始使用
IDE、配置、編譯器或偵錯程式

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development tool ecosystem. It is an integrated development environment (IDE) for TI's microcontrollers, processors, wireless connectivity devices and radar sensors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize (...)

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啟動 下載選項
IDE、配置、編譯器或偵錯程式

EDGE-AI-STUDIO-MCU — Edge AI Studio for Microcontrollers

Edge AI Studio is part of the CCStudio™ development tool ecosystem.  Edge AI Studio is a collection of graphical and command line tools designed to accelerate edge AI development on TI processors, microcontrollers, connectivity devices and radar sensors.  It supports both AI-accelerated (...)

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啟動 下載選項
IDE、配置、編譯器或偵錯程式

GHS-3P-MULTI-IDE — Green Hills Software MULTI Integrated Development Environment

The MULTI® development environment has been in use by thousands of developers for three decades and is the industry’s unrivaled integrated development environment to create, debug, and optimize C, C++ and Ada  code for production-focused applications.  It brings together (...)
從：Green Hills Software
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IDE、配置、編譯器或偵錯程式

MSP-ZERO-CODE-STUDIO — Graphical development environment for designing applications for MSP microcontrollers

MSP Zero Code Studio is a visual design environment that simplifies firmware development, making it possible to configure, develop, and run microcontroller applications in minutes with zero coding and no IDE required. Available as a standalone download or on the cloud.

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啟動 下載選項
IDE、配置、編譯器或偵錯程式

SYSCONFIG — Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

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啟動 下載選項
線上培訓

MSPM0-ACADEMY — MSPM0 Academy

MSPM0 Academy delivers easy-to-use training modules that span a wide range of topics and LaunchPads in the MSPM0 MCU portfolio.
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瀏覽
作業系統 (OS)

GHS-3P-UVELOSITY — Green Hills Software u-velOSity Safety RTOS

The µ-velOSity™ Safety RTOS is the smallest of Green Hills Software's real-time operating systems and was designed especially for microcontrollers. It supports a wide range of TI processor families using the Arm® Cortex-M or Cortex-R cores as a main CPU or as a co-processors (...)
從：Green Hills Software
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軟體程式設計工具

MSP-GANG-SOFTWARE — MSP-GANG Software

The MSP Gang Programmer (MSP-GANG) is a MSPM0/MSP430/MSP432 device programmer that can program up to eight identical devices at the same time.
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下載選項
軟體程式設計工具

UNIFLASH — UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.

UniFlash can be run from the cloud on the TI Developer Zone or downloaded and used (...)

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啟動 下載選項
計算工具

MSPM0-CALC — Power estimation tool for the MSPM0 platform

This tool can be used by engineers to estimate power consumption in different modes of operation for the MSPM0 device family.
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下載
參考設計

TIDA-010247 — 適用於 48–1500V 儲能系統的高準確度電池管理單元參考設計

此參考設計為高壓側 N 通道 MOSFET 控制（高達 32 個）電池管理單元 (BMU)，且使用堆疊式 BQ769x2 電池監控器系列。此設計也整合了 CAN 介面，適用於 BMU 堆疊高電壓（高達 1500V）儲能站應用。高壓側 N 通道 MOSFET 架構與最佳化驅動電路，可提供簡易的開關控制。此參考設計可實現低待機與運送模式耗電量，並可將兩組之間的電流差距最佳化。此參考設計適用於 48–1500V 儲能系統。
Design guide: PDF
參考設計

TIDA-010279 — 適用於儲能系統且最高 1500V 的可堆疊電池管理單元參考設計

此參考設計是完整電池芯溫度感測與高電池芯電壓準確度的鋰離子 (Li-ion)、磷酸鐵鋰 (LiFePO4) 電池組 (52s)。此設計可監控每個電池芯電壓、電池芯溫度，並保護電池組，以確保安全使用。此設計支援菊輪鍊與控制器區域網路 (CAN) 介面，以針對最高 1500V 的電池儲能系統實現可堆疊通訊。這些功能讓此參考設計適用於高容量電池組應用。
Design guide: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
LQFP (PM) 64 Ultra Librarian
LQFP (PN) 80 Ultra Librarian
LQFP (PT) 48 Ultra Librarian
LQFP (PZ) 100 Ultra Librarian
NFBGA (ZAW) 100 Ultra Librarian
VQFN (RGZ) 48 Ultra Librarian
VQFN (RHB) 32 Ultra Librarian
適用 TI 的評估品項標準條款與條件。

訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中的可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

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